{"id":"https://openalex.org/W2493558786","doi":"https://doi.org/10.1007/s10854-016-5498-x","title":"Effects of Al, Pr additions on the wettability and interfacial reaction of Zn\u201325Sn solder on Cu substrate","display_name":"Effects of Al, Pr additions on the wettability and interfacial reaction of Zn\u201325Sn solder on Cu substrate","publication_year":2016,"publication_date":"2016-08-10","ids":{"openalex":"https://openalex.org/W2493558786","doi":"https://doi.org/10.1007/s10854-016-5498-x","mag":"2493558786"},"language":"en","primary_location":{"id":"doi:10.1007/s10854-016-5498-x","doi":"https://doi.org/10.1007/s10854-016-5498-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-016-5498-x","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090364702","display_name":"Xi Niu","orcid":"https://orcid.org/0000-0001-6042-5957","observed_orcids":["https://orcid.org/0000-0001-6042-5957"]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Xi Niu","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, ROC"],"raw_orcid":"https://orcid.org/0000-0001-6042-5957","affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077252340","display_name":"Kwang\u2010Lung Lin","orcid":"https://orcid.org/0000-0003-4743-4765","observed_orcids":["https://orcid.org/0000-0003-4743-4765"]},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kwang-Lung Lin","raw_affiliation_strings":["Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, ROC","institution_ids":["https://openalex.org/I91807558"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5090364702"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":{"value":3990,"currency":"USD","value_usd":3990},"apc_paid":null,"fwci":1.2867,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.80664828,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":97},"biblio":{"volume":"28","issue":"1","first_page":"105","last_page":"113"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6230000257492065},{"id":"https://openalex.org/keywords/aluminum-addition","display_name":"aluminum addition","score":0.7519999742507935},{"id":"https://openalex.org/keywords/rare-earth-elements","display_name":"rare earth elements","score":0.7289999723434448},{"id":"https://openalex.org/keywords/wettability","display_name":"wettability","score":0.9010000228881836},{"id":"https://openalex.org/keywords/solder-oxidation","display_name":"solder oxidation","score":0.5070000290870667},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.8379999995231628},{"id":"https://openalex.org/keywords/solder-cu-interface","display_name":"solder/Cu interface","score":0.7390000224113464},{"id":"https://openalex.org/keywords/surface-segregation","display_name":"surface segregation","score":0.44699999690055847},{"id":"https://openalex.org/keywords/soldering","display_name":"soldering","score":0.3400000035762787}],"concepts":[{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.9311834573745728},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.90144944190979},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8513985276222229},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7661607265472412},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.7466689944267273},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.6658167839050293},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6044930815696716},{"id":"https://openalex.org/C146088050","wikidata":"https://www.wikidata.org/wiki/Q744818","display_name":"Transmission electron microscopy","level":2,"score":0.5167707204818726},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.47969433665275574},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.4471834897994995},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23900243639945984},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10506713390350342},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s10854-016-5498-x","doi":"https://doi.org/10.1007/s10854-016-5498-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10854-016-5498-x","pdf_url":null,"source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":34,"referenced_works":["https://openalex.org/W644443296","https://openalex.org/W759857905","https://openalex.org/W1485283179","https://openalex.org/W1966709642","https://openalex.org/W1975765053","https://openalex.org/W1983000181","https://openalex.org/W1983427864","https://openalex.org/W1992332506","https://openalex.org/W1992787250","https://openalex.org/W2002927719","https://openalex.org/W2003202198","https://openalex.org/W2005717451","https://openalex.org/W2006039767","https://openalex.org/W2014949988","https://openalex.org/W2016124699","https://openalex.org/W2020977713","https://openalex.org/W2023944949","https://openalex.org/W2025896430","https://openalex.org/W2046340695","https://openalex.org/W2048299983","https://openalex.org/W2049410537","https://openalex.org/W2057199685","https://openalex.org/W2064923958","https://openalex.org/W2065111765","https://openalex.org/W2065260025","https://openalex.org/W2069795814","https://openalex.org/W2072930129","https://openalex.org/W2084581403","https://openalex.org/W2144279396","https://openalex.org/W2162998404","https://openalex.org/W2336565258","https://openalex.org/W2355084643","https://openalex.org/W6603112649","https://openalex.org/W6723511144"],"related_works":["https://openalex.org/W2758379924","https://openalex.org/W2002927719","https://openalex.org/W759857905","https://openalex.org/W2898868097","https://openalex.org/W1207407011","https://openalex.org/W2520999710","https://openalex.org/W2889498045","https://openalex.org/W1997628659","https://openalex.org/W2368793961","https://openalex.org/W2374524269"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-09-18T07:38:42.748307","created_date":"2016-08-23T00:00:00"}