{"id":"https://openalex.org/W2474480763","doi":null,"title":"9 and Electrical Coupling in Stacks","display_name":"9 and Electrical Coupling in Stacks","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2474480763","mag":"2474480763"},"language":"en","primary_location":{"id":"mag:2474480763","doi":null,"is_oa":false,"landing_page_url":"https://link.springer.com/content/pdf/10.1007/978-0-387-78691-9_10.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091102145","display_name":"Brian T. R. Wetton","orcid":"https://orcid.org/0000-0002-6808-6301","observed_orcids":["https://orcid.org/0000-0002-6808-6301"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Brian Wetton","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0002-6808-6301","affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5091102145"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.13289999961853027,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.13289999961853027,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.02930000051856041,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14311","display_name":"Electrical and Electromagnetic Research","score":0.025299999862909317,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrical-coupling","display_name":"electrical coupling","score":0.9319999814033508}],"concepts":[{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5618596076965332},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38386639952659607},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22445443272590637},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1345132291316986}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2474480763","doi":null,"is_oa":false,"landing_page_url":"https://link.springer.com/content/pdf/10.1007/978-0-387-78691-9_10.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1984611717","https://openalex.org/W1984717573","https://openalex.org/W1999586755","https://openalex.org/W2023794757","https://openalex.org/W2036884447","https://openalex.org/W2044307855","https://openalex.org/W2054509680","https://openalex.org/W2074093410","https://openalex.org/W2103992671","https://openalex.org/W2131488335","https://openalex.org/W2141962923","https://openalex.org/W2159629948","https://openalex.org/W2171259974"],"related_works":["https://openalex.org/W3010212434","https://openalex.org/W2401094680","https://openalex.org/W2982145051","https://openalex.org/W3109892105","https://openalex.org/W7073850309","https://openalex.org/W2726543985","https://openalex.org/W2759000315","https://openalex.org/W7046922134","https://openalex.org/W3142468730","https://openalex.org/W2345456713"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-07-22T00:00:00"}