{"id":"https://openalex.org/W2472005331","doi":null,"title":"Aluminum-Based High-Temperature (>200\u00b0C) Packaging for SiC Power Converters *","display_name":"Aluminum-Based High-Temperature (>200\u00b0C) Packaging for SiC Power Converters *","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2472005331","mag":"2472005331"},"language":"en","primary_location":{"id":"mag:2472005331","doi":null,"is_oa":false,"landing_page_url":"http://www.dchopkins.com/research/research/Conference%20Proceedings/33%20-%20Aluminium-Based%20High-Temperature%20(200C)%20Packaging%20for%20SiC%20Power%20Converters.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070803828","display_name":"Douglas C. Hopkins","orcid":"https://orcid.org/0000-0001-8915-7212","observed_orcids":["https://orcid.org/0000-0001-8915-7212"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Douglas C. Hopkins","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0001-8915-7212","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052534836","display_name":"D. Kellerman","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. Kellerman","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047534866","display_name":"Cemal Basaran","orcid":"https://orcid.org/0000-0003-4378-0476","observed_orcids":["https://orcid.org/0000-0003-4378-0476"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Cemal Basaran","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-4378-0476","affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5102025609","display_name":"Juan G\u00f3mez","orcid":"https://orcid.org/0000-0003-1809-8766","observed_orcids":["https://orcid.org/0000-0003-1809-8766"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Juan G\u00f3mez","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0003-1809-8766","affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.45454015,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/sic-power-converters","display_name":"SiC power converters","score":0.7099999785423279},{"id":"https://openalex.org/keywords/high-temperature-power-electronics","display_name":"high-temperature power electronics","score":0.6949999928474426},{"id":"https://openalex.org/keywords/aluminum-nitride-substrate","display_name":"aluminum nitride substrate","score":0.8550000190734863},{"id":"https://openalex.org/keywords/dissimilar-metal-interfaces","display_name":"dissimilar metal interfaces","score":0.8330000042915344},{"id":"https://openalex.org/keywords/cast-molding","display_name":"cast molding","score":0.4819999933242798},{"id":"https://openalex.org/keywords/multi-chip-power-modules","display_name":"multi-chip power modules","score":0.843999981880188},{"id":"https://openalex.org/keywords/power-density","display_name":"power density","score":0.8420000076293945},{"id":"https://openalex.org/keywords/forced-air-cooling","display_name":"forced air cooling","score":0.6060000061988831}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7737525701522827},{"id":"https://openalex.org/C2780722187","wikidata":"https://www.wikidata.org/wiki/Q412356","display_name":"Silicon carbide","level":2,"score":0.7406045794487},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.6014230251312256},{"id":"https://openalex.org/C121598971","wikidata":"https://www.wikidata.org/wiki/Q16466835","display_name":"Lead frame","level":4,"score":0.5886526703834534},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.5234136581420898},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5055243968963623},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.499523401260376},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.48596298694610596},{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.4757423400878906},{"id":"https://openalex.org/C129014197","wikidata":"https://www.wikidata.org/wiki/Q906544","display_name":"Power semiconductor device","level":3,"score":0.46516138315200806},{"id":"https://openalex.org/C5335593","wikidata":"https://www.wikidata.org/wiki/Q241906","display_name":"Carbide","level":2,"score":0.4232531487941742},{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.4154462516307831},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.40653109550476074},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.39376378059387207},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2812047004699707},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.16092169284820557},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13820487260818481},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.11090222001075745},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.10888543725013733},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2472005331","doi":null,"is_oa":false,"landing_page_url":"http://www.dchopkins.com/research/research/Conference%20Proceedings/33%20-%20Aluminium-Based%20High-Temperature%20(200C)%20Packaging%20for%20SiC%20Power%20Converters.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.571399986743927,"display_name":"Affordable and clean energy"},{"id":"https://metadata.un.org/sdg/9","score":0.4943999946117401,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2088111989","https://openalex.org/W2739206850"],"related_works":["https://openalex.org/W2254214705","https://openalex.org/W857612127","https://openalex.org/W4310813927","https://openalex.org/W2275354416","https://openalex.org/W3173520437","https://openalex.org/W2207954180","https://openalex.org/W2156245347","https://openalex.org/W1992042862","https://openalex.org/W2113727304","https://openalex.org/W4396575249"],"abstract_inverted_index":{"This":[0],"paper":[1],"describes":[2],"the":[3,54,57,78,88],"development":[4],"of":[5,106],"a":[6,98,102,113],"comprehensive":[7],"packaging":[8],"approach":[9,23],"for":[10,63],"high-power,":[11],"high-temperature":[12],"power":[13,75,104],"electronic":[14],"systems,":[15],"which":[16],"utilize":[17],"Silicon":[18],"Carbide":[19],"(SiC)":[20],"transistors.":[21],"The":[22,72],"is":[24,48],"aluminum-based":[25],"using":[26],"an":[27,35],"aluminum":[28,30,36],"conductor,":[29],"nitride":[31],"(AlN)":[32],"substrate":[33],"and":[34,52,67,116],"-silicon-carbide":[37],"(AlSiC)":[38],"combination":[39],"to":[40,50,81,84,100],"minimize":[41],"dissimilar":[42],"metal":[43],"interfaces.":[44],"A":[45],"cast":[46],"process":[47],"able":[49],"pattern":[51],"capture":[53],"AlN":[55],"into":[56],"AlSiC":[58],"net-shape":[59],"structure.":[60],"Other":[61],"techniques":[62],"selective":[64],"electrical":[65],"isolation":[66],"device":[68],"mounting":[69],"are":[70,95],"discussed.":[71],"resulting":[73],"multichip":[74],"module":[76],"allows":[77],"SiC":[79],"transistors":[80],"operate":[82],"up":[83],"350\u00b0C":[85],"while":[86],"keeping":[87],"gate":[89],"drive":[90],"below":[91],"250\u00b0C.":[92],"Six":[93],"modules":[94],"interconnected":[96],"in":[97,112],"frame":[99],"provide":[101],"processed":[103],"density":[105],">70W/cu.cm.":[107],"(>1.1kW/cu.in.)":[108],"with":[109,118],"forced":[110],"air-cooling":[111],"150\u00b0C":[114],"ambient,":[115],"19kW/kg":[117],"97%":[119],"efficient":[120],"converter.":[121]},"counts_by_year":[],"updated_date":"2025-11-06T04:12:42.849631","created_date":"2016-07-22T00:00:00"}