{"id":"https://openalex.org/W2412928147","doi":"https://doi.org/10.1109/icep.2016.7486872","title":"Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis","display_name":"Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis","publication_year":2016,"publication_date":"2016-04-01","ids":{"openalex":"https://openalex.org/W2412928147","doi":"https://doi.org/10.1109/icep.2016.7486872","mag":"2412928147"},"language":"en","primary_location":{"id":"doi:10.1109/icep.2016.7486872","doi":"https://doi.org/10.1109/icep.2016.7486872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icep.2016.7486872","pdf_url":null,"source":{"id":"https://openalex.org/S4363608352","display_name":"International Conference on Electronics Packaging (ICEP)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Conference on Electronics Packaging (ICEP)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068567039","display_name":"Christof Landesberger","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"C. Landesberger","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048318099","display_name":"Nagarajan Palavesam","orcid":"https://orcid.org/0000-0002-9043-5678","observed_orcids":["https://orcid.org/0000-0002-9043-5678"]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"N. Palavesam","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008534739","display_name":"Waltraud Hell","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"W. Hell","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073137038","display_name":"Andreas Drost","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"A. Drost","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055689032","display_name":"Robert Faul","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"R. Faul","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022061507","display_name":"Horst A. Gieser","orcid":"https://orcid.org/0000-0003-0838-024X","observed_orcids":["https://orcid.org/0000-0003-0838-024X"]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"H. Gieser","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034824933","display_name":"Detlef Bonfert","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"D. Bonfert","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039968464","display_name":"Karlheinz Bock","orcid":"https://orcid.org/0000-0002-0757-3325","observed_orcids":["https://orcid.org/0000-0002-0757-3325"]},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Bock","raw_affiliation_strings":["Technische Universit\u00e4t Dresden, 01069, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universit\u00e4t Dresden, 01069, Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004211018","display_name":"Christoph Kutter","orcid":"https://orcid.org/0000-0002-9605-1878","observed_orcids":["https://orcid.org/0000-0002-9605-1878"]},"institutions":[{"id":"https://openalex.org/I4210128143","display_name":"Fraunhofer Research Institution for Microsystems and Solid State Technologies","ror":"https://ror.org/02hm5m482","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210128143","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"C. Kutter","raw_affiliation_strings":["Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany","institution_ids":["https://openalex.org/I4210128143"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":6.0452,"has_fulltext":false,"cited_by_count":24,"citation_normalized_percentile":{"value":0.97392009,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"473","last_page":"478"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.4975999891757965,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.4975999891757965,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.49000000953674316,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.0007999999797903001,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chip-embedding","display_name":"chip embedding","score":0.6240000128746033},{"id":"https://openalex.org/keywords/polyimide-films","display_name":"polyimide films","score":0.8270000219345093},{"id":"https://openalex.org/keywords/roll-to-roll-manufacturing","display_name":"roll-to-roll processing","score":0.6710000038146973},{"id":"https://openalex.org/keywords/chip-on-film","display_name":"chip on film","score":0.6399999856948853},{"id":"https://openalex.org/keywords/mechanical-robustness","display_name":"mechanical robustness","score":0.6919999718666077}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7798781394958496},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6865313649177551},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5947861671447754},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.5941070318222046},{"id":"https://openalex.org/C7363328","wikidata":"https://www.wikidata.org/wiki/Q5426847","display_name":"FOIL method","level":2,"score":0.5760161280632019},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5095334649085999},{"id":"https://openalex.org/C41608201","wikidata":"https://www.wikidata.org/wiki/Q980509","display_name":"Embedding","level":2,"score":0.5004339218139648},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47534987330436707},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.4313996136188507},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4233434796333313},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.38292309641838074},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21594935655593872},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1808742880821228},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08810287714004517},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.06526833772659302},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06319335103034973},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icep.2016.7486872","doi":"https://doi.org/10.1109/icep.2016.7486872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icep.2016.7486872","pdf_url":null,"source":{"id":"https://openalex.org/S4363608352","display_name":"International Conference on Electronics Packaging (ICEP)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Conference on Electronics Packaging (ICEP)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/396134","doi":null,"is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/396134","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1492390522","https://openalex.org/W1587075491","https://openalex.org/W1953449815","https://openalex.org/W1980689048","https://openalex.org/W1999998115","https://openalex.org/W2025756861","https://openalex.org/W2043765394","https://openalex.org/W2049741696","https://openalex.org/W2124447137","https://openalex.org/W2139503719","https://openalex.org/W2161739788","https://openalex.org/W2166982064","https://openalex.org/W2182893782","https://openalex.org/W2513912255","https://openalex.org/W7029087073"],"related_works":["https://openalex.org/W2139503719","https://openalex.org/W2439320707","https://openalex.org/W2103948276","https://openalex.org/W2063636724","https://openalex.org/W2259130891","https://openalex.org/W2161739788","https://openalex.org/W2133088268","https://openalex.org/W7000824072","https://openalex.org/W2139768330","https://openalex.org/W2063549554"],"abstract_inverted_index":{"We":[0],"present":[1],"technological":[2,68,126],"results":[3],"on":[4,20,29,93,154],"the":[5,21,54,67,155,195,211],"embedding":[6,38,57,109],"of":[7,34,56,63,87,103,119,139,157,210],"ultra-thin":[8,59,175],"microcontroller":[9,74],"ICs":[10],"in":[11,27,39,61,112,207],"flexible":[12,115,166],"film":[13,30,79,167],"substrates.":[14,80],"The":[15,50,108,169],"novel":[16],"concept":[17],"is":[18],"based":[19],"following":[22],"technologies:":[23],"face-up":[24],"chip":[25,117,196],"mounting":[26],"cavities":[28],"laminates,":[31],"photo-lithographic":[32],"patterning":[33],"vias":[35],"and":[36,42,47,76,99,125,146,161],"interconnects":[37],"polymer":[40,102],"layer":[41],"compatibility":[43],"with":[44,178],"both":[45],"sheet":[46],"roll-to-roll":[48,129],"processing.":[49],"paper":[51],"briefly":[52],"reviews":[53],"benefit":[55],"for":[58,106,128,136,165],"dies":[60],"terms":[62],"mechanical":[64,208],"robustness.":[65],"For":[66],"demonstration,":[69],"we":[70,149],"used":[71],"25\u03bcm":[72],"thin":[73],"IC":[75],"50\u03bcm":[77],"polyimide":[78],"Electrical":[81],"interconnections":[82],"were":[83,183],"realized":[84],"by":[85],"sputtering":[86],"metal":[88],"layers.":[89],"Photolithography":[90],"was":[91,172,191],"performed":[92],"\u201cwafer":[94],"level\u201d":[95],"using":[96,174],"aligner":[97],"photomasks":[98],"a":[100,113,120,204],"photo-sensitive":[101],"10\u03bcm":[104],"thickness":[105,121,197],"embedding.":[107],"process":[110],"resulted":[111],"mechanically":[114],"fan-out":[116],"package":[118],"below":[122],"100\u03bcm.":[123],"Perspectives":[124],"requirements":[127],"manufacture":[130],"as":[131,133],"well":[132],"cost":[134],"estimation":[135],"this":[137],"kind":[138],"Thin":[140],"Chip":[141],"Foil":[142],"Package":[143],"are":[144],"explained":[145],"discussed.":[147],"Furthermore,":[148],"report":[150],"our":[151],"recent":[152],"work":[153],"development":[156],"an":[158],"in-situ":[159],"bending":[160],"electrical":[162],"test":[163,176],"equipment":[164],"modules.":[168],"new":[170],"set-up":[171],"evaluated":[173],"chips":[177],"daisy":[179],"chain":[180],"patterns":[181],"that":[182,193],"ACA":[184],"flip-chip":[185],"bonded":[186],"onto":[187],"Polyimide":[188],"films.":[189],"It":[190],"found":[192],"reducing":[194],"from":[198],"28\u03bcm":[199],"to":[200,203],"12\u03bcm":[201],"lead":[202],"strong":[205],"increase":[206],"strength":[209],"chip-on-film":[212],"(COF)":[213],"assemblies":[214],"tested":[215],"under":[216],"recurrent":[217],"bending.":[218]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":6},{"year":2017,"cited_by_count":3}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}