{"id":"https://openalex.org/W2398586336","doi":"https://doi.org/10.7567/jjap.55.06je03","title":"Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi\u2013Te and Sb\u2013Te thermoelectric films","display_name":"Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi\u2013Te and Sb\u2013Te thermoelectric films","publication_year":2016,"publication_date":"2016-05-26","ids":{"openalex":"https://openalex.org/W2398586336","doi":"https://doi.org/10.7567/jjap.55.06je03","mag":"2398586336"},"language":"en","primary_location":{"id":"doi:10.7567/jjap.55.06je03","doi":"https://doi.org/10.7567/jjap.55.06je03","is_oa":true,"landing_page_url":"https://doi.org/10.7567/jjap.55.06je03","pdf_url":"https://iopscience.iop.org/article/10.7567/JJAP.55.06JE03/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://iopscience.iop.org/article/10.7567/JJAP.55.06JE03/pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047278225","display_name":"Ho Yong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery & Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]},{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ho Yong","raw_affiliation_strings":["Korea Institute of Machinery and Materials","Sungkyunkwan University","Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea","School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Machinery and Materials","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000212274","display_name":"Sekwon Na","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sekwon Na","raw_affiliation_strings":["Sungkyunkwan University","School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064352007","display_name":"Jun-Gu Gang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jun-Gu Gang","raw_affiliation_strings":["Sungkyunkwan University","School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074460603","display_name":"Haesun Shin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"HaeSun Shin","raw_affiliation_strings":["Sungkyunkwan University","School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113560852","display_name":"Seong-jae Jeon","orcid":"https://orcid.org/0000-0002-3283-8276","observed_orcids":["https://orcid.org/0000-0002-3283-8276"]},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery & Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Jae Jeon","raw_affiliation_strings":["Korea Institute of Machinery and Materials","Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Machinery and Materials","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004899832","display_name":"Seungmin Hyun","orcid":"https://orcid.org/0000-0002-7286-9026","observed_orcids":["https://orcid.org/0000-0002-7286-9026"]},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery & Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"SeungMin Hyun","raw_affiliation_strings":["Korea Institute of Machinery and Materials","Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Machinery and Materials","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Division of Nano-Mechanical Systems Research, Korea Institute of Machinery and Materials, Daejeon 34103, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032449911","display_name":"Hoo-Jeong Lee","orcid":"https://orcid.org/0000-0002-7393-1223","observed_orcids":["https://orcid.org/0000-0002-7393-1223"]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Hoo-Jeong Lee","raw_affiliation_strings":["Sungkyunkwan University","School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","Sungkyunkwan Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"Sungkyunkwan Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Republic of Korea","institution_ids":["https://openalex.org/I848706"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5032449911"],"corresponding_institution_ids":["https://openalex.org/I848706"],"apc_list":{"value":2210,"currency":"USD","value_usd":2210},"apc_paid":null,"fwci":0.5129,"has_fulltext":true,"cited_by_count":8,"citation_normalized_percentile":{"value":0.57584746,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"55","issue":"6S3","first_page":"06JE03","last_page":"06JE03"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/contact-resistance","display_name":"contact resistance","score":0.9300000071525574},{"id":"https://openalex.org/keywords/thermoelectric-films","display_name":"thermoelectric films","score":0.8840000033378601},{"id":"https://openalex.org/keywords/bismuth-telluride","display_name":"Bi2Te3","score":0.9760000109672546},{"id":"https://openalex.org/keywords/sb2te3","display_name":"Sb2Te3","score":1.0},{"id":"https://openalex.org/keywords/gold-electrode","display_name":"gold electrode","score":0.7260000109672546},{"id":"https://openalex.org/keywords/titanium-electrodes","display_name":"titanium electrodes","score":0.9940000176429749},{"id":"https://openalex.org/keywords/antimony-electrode","display_name":"antimony electrode","score":0.9890000224113464},{"id":"https://openalex.org/keywords/specific-contact-resistivity","display_name":"specific contact resistance","score":0.8140000104904175},{"id":"https://openalex.org/keywords/interface-states","display_name":"interface states","score":0.8539999723434448},{"id":"https://openalex.org/keywords/annealing","display_name":"annealing","score":0.8450000286102295},{"id":"https://openalex.org/keywords/carrier-transport","display_name":"carrier transport","score":0.7879999876022339},{"id":"https://openalex.org/keywords/carrier-concentration","display_name":"carrier concentration","score":0.7760000228881836},{"id":"https://openalex.org/keywords/thermoelectric-power-generation","display_name":"thermoelectric power generation","score":0.5960000157356262}],"concepts":[{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.8225522041320801},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.8006314039230347},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7449496388435364},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7344262003898621},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.7325245141983032},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.4585343301296234},{"id":"https://openalex.org/C112625512","wikidata":"https://www.wikidata.org/wiki/Q1091448","display_name":"Seebeck coefficient","level":3,"score":0.43800193071365356},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3377585709095001},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24562659859657288},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23354876041412354},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.10705888271331787},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09343060851097107},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.05990055203437805},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.7567/jjap.55.06je03","doi":"https://doi.org/10.7567/jjap.55.06je03","is_oa":true,"landing_page_url":"https://doi.org/10.7567/jjap.55.06je03","pdf_url":"https://iopscience.iop.org/article/10.7567/JJAP.55.06JE03/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.7567/jjap.55.06je03","doi":"https://doi.org/10.7567/jjap.55.06je03","is_oa":true,"landing_page_url":"https://doi.org/10.7567/jjap.55.06je03","pdf_url":"https://iopscience.iop.org/article/10.7567/JJAP.55.06JE03/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321681","display_name":"Ministry of Trade, Industry and Energy","ror":"https://ror.org/008nkqk13"},{"id":"https://openalex.org/F4320322030","display_name":"Ministry of Science, ICT and Future Planning","ror":"https://ror.org/032e49973"},{"id":"https://openalex.org/F4320322103","display_name":"Korea Research Institute of Standards and Science","ror":"https://ror.org/01az7b475"},{"id":"https://openalex.org/F4320330746","display_name":"Korea Semiconductor Research Consortium","ror":"https://ror.org/03dy4eg44"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2398586336.pdf","grobid_xml":"https://content.openalex.org/works/W2398586336.grobid-xml"},"referenced_works_count":28,"referenced_works":["https://openalex.org/W1976037442","https://openalex.org/W1986467501","https://openalex.org/W2002490458","https://openalex.org/W2007758945","https://openalex.org/W2018970253","https://openalex.org/W2019848084","https://openalex.org/W2023724157","https://openalex.org/W2032148024","https://openalex.org/W2036938439","https://openalex.org/W2042056247","https://openalex.org/W2045233117","https://openalex.org/W2065235250","https://openalex.org/W2067597251","https://openalex.org/W2082404621","https://openalex.org/W2086103622","https://openalex.org/W2093759949","https://openalex.org/W2098327756","https://openalex.org/W2102109582","https://openalex.org/W2112425685","https://openalex.org/W2151592156","https://openalex.org/W2152457228","https://openalex.org/W2163517070","https://openalex.org/W2241851736","https://openalex.org/W2415172341","https://openalex.org/W2418627898","https://openalex.org/W2488961534","https://openalex.org/W3147289055","https://openalex.org/W4256261780"],"related_works":["https://openalex.org/W4392138649","https://openalex.org/W4393987953","https://openalex.org/W2981561871","https://openalex.org/W2734936394","https://openalex.org/W2128265141","https://openalex.org/W2014085910","https://openalex.org/W2086936370","https://openalex.org/W4408856401","https://openalex.org/W4400078401","https://openalex.org/W4408992209"],"abstract_inverted_index":{"Abstract":[0],"In":[1],"this":[2],"study,":[3],"we":[4,36],"explore":[5],"various":[6],"electrode":[7],"materials":[8,17],"(Au,":[9],"Ti,":[10],"and":[11,23,72],"Sb)":[12],"for":[13,53,67,80,96,112,123,154],"use":[14],"as":[15],"contact":[16,51,88,98,106],"on":[18],"Bi":[19,68,114],"2":[20,25,66,69,79,82,115,126],"Te":[21,26,70,83,116,127],"3":[22,27,71,84,117,128],"Sb":[24,81,125],"thermoelectric":[28,56,148],"films.":[29],"Using":[30],"the":[31,38,42,49,55,93,97,105,113,124,132,137,143,147,155],"transmission":[32],"line":[33],"method":[34],"(TLM),":[35],"measured":[37],"specific":[39,87],"resistivity":[40,52,89,107],"of":[41,131],"contacts,":[43],"which":[44],"showed":[45],"that":[46,92,140],"Au":[47],"has":[48],"lowest":[50],"both":[54],"films":[57,149],"(after":[58],"annealing):":[59],"2.7":[60],"\u00d7":[61,74],"10":[62,75],"\u221210":[63],"\u03a9":[64,77],"m":[65,78],"2.9":[73],"\u221211":[76],".":[85],"The":[86],"data":[90],"suggest":[91],"dominant":[94],"factor":[95],"properties":[99],"is":[100],"interface":[101],"states.":[102],"After":[103],"annealing,":[104],"does":[108],"not":[109],"change":[110],"much":[111],"contacts":[118,138],"while":[119],"it":[120],"drops":[121],"greatly":[122],"ones.":[129],"Analysis":[130],"carrier":[133,144],"transport":[134],"mechanism":[135],"across":[136],"discloses":[139],"changes":[141],"in":[142,146],"concentration":[145],"after":[150],"annealing":[151],"are":[152],"responsible":[153],"different":[156],"behaviors.":[157]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}