{"id":"https://openalex.org/W2349846136","doi":null,"title":"The detecting system of stress wave velocity for laminated veneer lumber bending strength based on single chip","display_name":"The detecting system of stress wave velocity for laminated veneer lumber bending strength based on single chip","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W2349846136","mag":"2349846136"},"language":"en","primary_location":{"id":"mag:2349846136","doi":null,"is_oa":false,"landing_page_url":"http://en.cnki.com.cn/Article_en/CJFDTOTAL-MCJG200801003.htm","pdf_url":null,"source":{"id":"https://openalex.org/S2765003933","display_name":"Wood Processing Machinery","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Wood Processing Machinery","raw_type":null},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103670680","display_name":"Li Li","orcid":"https://orcid.org/0009-0003-4288-6612","observed_orcids":["https://orcid.org/0009-0003-4288-6612"]},"institutions":[{"id":"https://openalex.org/I31683504","display_name":"Beijing Forestry University","ror":"https://ror.org/04xv2pc41","country_code":"CN","type":"education","lineage":["https://openalex.org/I1327237609","https://openalex.org/I31683504","https://openalex.org/I4210127390"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Li Li","raw_affiliation_strings":["School of technology, Beijing Forestry University, Beijing 100083, China"],"raw_orcid":"https://orcid.org/0009-0003-4288-6612","affiliations":[{"raw_affiliation_string":"School of technology, Beijing Forestry University, Beijing 100083, China","institution_ids":["https://openalex.org/I31683504"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5103670680"],"corresponding_institution_ids":["https://openalex.org/I31683504"],"apc_list":null,"apc_paid":null,"fwci":1.2024,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.87271734,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10484","display_name":"Wood Treatment and Properties","score":0.9628999829292297,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10484","display_name":"Wood Treatment and Properties","score":0.9628999829292297,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.00800000037997961,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12941","display_name":"Embedded Systems and FPGA Design","score":0.004000000189989805,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/laminated-veneer-lumber","display_name":"laminated veneer lumber","score":0.9950000047683716},{"id":"https://openalex.org/keywords/stress-wave-velocity","display_name":"stress wave velocity","score":0.9789999723434448},{"id":"https://openalex.org/keywords/dynamic-elastic-modulus","display_name":"dynamic modulus of elasticity","score":0.8640000224113464},{"id":"https://openalex.org/keywords/flexural-strength","display_name":"flexural strength","score":0.9629999995231628},{"id":"https://openalex.org/keywords/single-chip-sensor","display_name":"single-chip sensor","score":0.5590000152587891},{"id":"https://openalex.org/keywords/online-detection","display_name":"online detection","score":0.5809999704360962},{"id":"https://openalex.org/keywords/hardware-circuit-design","display_name":"hardware circuit design","score":0.7139999866485596},{"id":"https://openalex.org/keywords/software-design","display_name":"software design","score":0.7559999823570251}],"concepts":[{"id":"https://openalex.org/C128056066","wikidata":"https://www.wikidata.org/wiki/Q5791381","display_name":"Laminated veneer lumber","level":3,"score":0.840227484703064},{"id":"https://openalex.org/C2993434580","wikidata":"https://www.wikidata.org/wiki/Q14097093","display_name":"Stress wave","level":2,"score":0.6536046862602234},{"id":"https://openalex.org/C2779225514","wikidata":"https://www.wikidata.org/wiki/Q1686140","display_name":"Veneer","level":2,"score":0.5685503482818604},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.5651377439498901},{"id":"https://openalex.org/C178405089","wikidata":"https://www.wikidata.org/wiki/Q857201","display_name":"Flexural strength","level":2,"score":0.5491570830345154},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.5413252711296082},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4493909776210785},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.44101062417030334},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.431680828332901},{"id":"https://openalex.org/C196029304","wikidata":"https://www.wikidata.org/wiki/Q2091584","display_name":"Young's modulus","level":2,"score":0.4139094948768616},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.402534544467926},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3630492687225342},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13635793328285217},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:2349846136","doi":null,"is_oa":false,"landing_page_url":"http://en.cnki.com.cn/Article_en/CJFDTOTAL-MCJG200801003.htm","pdf_url":null,"source":{"id":"https://openalex.org/S2765003933","display_name":"Wood Processing Machinery","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":"Wood Processing Machinery","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1975374421","https://openalex.org/W2333788507","https://openalex.org/W2358811091","https://openalex.org/W2028802146","https://openalex.org/W2391042618","https://openalex.org/W2105252733","https://openalex.org/W2351211730","https://openalex.org/W63582857","https://openalex.org/W2356949058","https://openalex.org/W2363472867"],"abstract_inverted_index":{"The":[0],"detection":[1],"system":[2,68],"takes":[3],"single":[4],"chip":[5],"as":[6,41],"the":[7,15,27,32,37,44,51,67],"core":[8],"of":[9,21,30,47],"data":[10],"processing":[11],"by":[12,71],"on-line":[13],"detecting":[14,53],"wave":[16,23],"speed":[17],"and":[18,36,61,66],"other":[19],"parameters":[20],"stress":[22,45],"to":[24,42],"work":[25],"out":[26],"dynamic":[28],"modulus":[29],"elasticity(MOE)of":[31],"laminated":[33,48],"veneer":[34,49],"lumber":[35],"bending":[38],"strength":[39],"so":[40],"realizing":[43],"rating":[46],"lumber.In":[50],"article,the":[52],"principle":[54],"is":[55,69],"discussed,the":[56],"specific":[57],"hardware":[58],"implement":[59],"circuit":[60],"software":[62],"designing":[63],"are":[64],"given":[65],"proved":[70],"experiment.":[72]},"counts_by_year":[],"updated_date":"2025-10-10T17:16:08.811792","created_date":"2016-06-24T00:00:00"}