{"id":"https://openalex.org/W2334010046","doi":"https://doi.org/10.1115/imece2007-43699","title":"Finite Element Analysis for Demolding Process in Thermal Imprint Lithography","display_name":"Finite Element Analysis for Demolding Process in Thermal Imprint Lithography","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W2334010046","doi":"https://doi.org/10.1115/imece2007-43699","mag":"2334010046"},"language":"en","primary_location":{"id":"doi:10.1115/imece2007-43699","doi":"https://doi.org/10.1115/imece2007-43699","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2007-43699","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 10: Mechanics of Solids and Structures, Parts A and B","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102297651","display_name":"Zhichao Song","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhichao Song","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083755825","display_name":"Jaejong Lee","orcid":"https://orcid.org/0000-0001-7684-2667","observed_orcids":["https://orcid.org/0000-0001-7684-2667"]},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery & Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaejong Lee","raw_affiliation_strings":["Korea Institute of Machinery & Materials, Daejeon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Machinery & Materials, Daejeon, Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083652053","display_name":"Sunggook Park","orcid":"https://orcid.org/0000-0003-0424-6318","observed_orcids":["https://orcid.org/0000-0003-0424-6318"]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sunggook Park","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.33804539,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"877","last_page":"883"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/demolding","display_name":"demolding","score":0.925000011920929},{"id":"https://openalex.org/keywords/residual-stress","display_name":"residual stress","score":0.6639999747276306},{"id":"https://openalex.org/keywords/stress-distribution","display_name":"stress distribution","score":0.753000020980835},{"id":"https://openalex.org/keywords/structural-failure","display_name":"structural failure","score":0.6200000047683716},{"id":"https://openalex.org/keywords/angular-offset","display_name":"angular offset","score":0.5519999861717224},{"id":"https://openalex.org/keywords/yield-stress","display_name":"yield stress","score":0.628000020980835}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7837648391723633},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.7131154537200928},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6321302652359009},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5942026972770691},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5909426808357239},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5617196559906006},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.5114304423332214},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4776638448238373},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.4397137463092804},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.42108285427093506},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3135213851928711},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.31159132719039917},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12018850445747375},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/imece2007-43699","doi":"https://doi.org/10.1115/imece2007-43699","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2007-43699","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 10: Mechanics of Solids and Structures, Parts A and B","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2090894317","https://openalex.org/W2170919459","https://openalex.org/W2803734415","https://openalex.org/W1997476216","https://openalex.org/W2320682679","https://openalex.org/W2072264922","https://openalex.org/W2184709396","https://openalex.org/W2098822234","https://openalex.org/W1984431257","https://openalex.org/W2029050880"],"abstract_inverted_index":{"In":[0,47,172],"thermal":[1,56],"imprint":[2,7,57],"lithography,":[3],"most":[4],"of":[5,27,44,179],"the":[6,16,20,32,36,41,45,52,60,66,80,85,90,94,100,104,110,142,148,152,157,163,169,177],"failures":[8],"occur":[9,126],"during":[10,76],"demolding,":[11,79],"a":[12,122],"process":[13,54,181],"to":[14,40,64,99,156],"separate":[15],"mold":[17],"insert":[18],"from":[19,151,168],"substrate":[21,158],"after":[22],"conformal":[23],"molding.":[24],"The":[25,138],"success":[26],"demolding":[28,53,108,130,136,155,186],"is":[29],"determined":[30],"by":[31],"stress":[33,43,67,81,113],"generated":[34],"in":[35,55,71],"resist":[37,75],"with":[38,103],"respect":[39],"yield":[42],"resist.":[46],"this":[48],"paper":[49],"we":[50,174],"simulated":[51],"lithography":[58],"using":[59],"finite":[61],"element":[62],"method":[63],"study":[65],"distribution":[68],"and":[69,93,97,182,188],"deformation":[70],"poly(methyl":[72],"methacrylate)":[73],"(PMMA)":[74],"demolding.":[77],"During":[78],"concentrates":[82],"both":[83,115],"at":[84,141],"transition":[86],"corner":[87],"zone":[88],"between":[89],"residual":[91],"layer":[92],"replicated":[95],"pattern,":[96],"close":[98],"contact":[101],"region":[102],"moving":[105],"stamp.":[106],"As":[107],"proceeds,":[109],"highest":[111],"local":[112],"for":[114,162],"locations":[116],"shows":[117],"two":[118],"maximums,":[119],"indicating":[120],"that":[121],"structural":[123,139],"failure":[124,140],"may":[125],"not":[127],"only":[128],"when":[129],"starts,":[131],"but":[132],"also":[133],"immediately":[134],"before":[135],"ends.":[137],"second":[143],"maximum":[144],"becomes":[145],"dominant":[146],"as":[147],"angular":[149],"offset":[150],"ideal":[153],"normal":[154],"surface":[159],"increases":[160],"or":[161],"structures":[164],"located":[165],"far":[166],"away":[167],"symmetric":[170],"centerline.":[171],"addition,":[173],"will":[175],"discuss":[176],"influence":[178],"other":[180],"geometry":[183],"parameters,":[184],"including":[185],"rate":[187],"stamp":[189],"aspect":[190],"ratio.":[191]},"counts_by_year":[],"updated_date":"2026-11-01T11:40:01.658920","created_date":"2016-06-24T00:00:00"}