{"id":"https://openalex.org/W2328869864","doi":"https://doi.org/10.1149/1.4717502","title":"(Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV)","display_name":"(Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV)","publication_year":2012,"publication_date":"2012-05-04","ids":{"openalex":"https://openalex.org/W2328869864","doi":"https://doi.org/10.1149/1.4717502","mag":"2328869864"},"language":"en","primary_location":{"id":"doi:10.1149/1.4717502","doi":"https://doi.org/10.1149/1.4717502","is_oa":false,"landing_page_url":"https://doi.org/10.1149/1.4717502","pdf_url":null,"source":{"id":"https://openalex.org/S4210205149","display_name":"ECS Transactions","issn_l":"1938-5862","issn":["1938-5862","1938-6737","2151-2051"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1","poland-20"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Transactions","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023661088","display_name":"Tar\u014d Hayashi","orcid":"https://orcid.org/0000-0002-4246-3535","observed_orcids":["https://orcid.org/0000-0002-4246-3535","https://orcid.org/0009-0005-0145-8042"]},"institutions":[{"id":"https://openalex.org/I15807432","display_name":"Osaka Prefecture University","ror":"https://ror.org/02cf1je33","country_code":"JP","type":"education","lineage":["https://openalex.org/I15807432","https://openalex.org/I4387152983"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Taro Hayashi","raw_affiliation_strings":["Osaka Prefecture University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka Prefecture University","institution_ids":["https://openalex.org/I15807432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101525233","display_name":"Kazuo N. Kondo","orcid":"https://orcid.org/0000-0002-6525-4824","observed_orcids":["https://orcid.org/0000-0002-6525-4824"]},"institutions":[{"id":"https://openalex.org/I15807432","display_name":"Osaka Prefecture University","ror":"https://ror.org/02cf1je33","country_code":"JP","type":"education","lineage":["https://openalex.org/I15807432","https://openalex.org/I4387152983"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kazuo Kondo","raw_affiliation_strings":["Osaka Prefecture University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka Prefecture University","institution_ids":["https://openalex.org/I15807432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112036441","display_name":"Minoru Takeuchi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210133192","display_name":"Nitto Boseki (Japan)","ror":"https://ror.org/03c55am86","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210133192"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Minoru Takeuchi","raw_affiliation_strings":["Nittobo Medical Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nittobo Medical Co., Ltd","institution_ids":["https://openalex.org/I4210133192"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100676223","display_name":"Yushi Suzuki","orcid":"https://orcid.org/0000-0002-2203-8240","observed_orcids":["https://orcid.org/0000-0002-2203-8240"]},"institutions":[{"id":"https://openalex.org/I15807432","display_name":"Osaka Prefecture University","ror":"https://ror.org/02cf1je33","country_code":"JP","type":"education","lineage":["https://openalex.org/I15807432","https://openalex.org/I4387152983"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yushi Suzuki","raw_affiliation_strings":["Osaka Prefecture University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka Prefecture University","institution_ids":["https://openalex.org/I15807432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003122353","display_name":"Takeyasu Saito","orcid":"https://orcid.org/0000-0002-5437-584X","observed_orcids":["https://orcid.org/0000-0002-5437-584X"]},"institutions":[{"id":"https://openalex.org/I15807432","display_name":"Osaka Prefecture University","ror":"https://ror.org/02cf1je33","country_code":"JP","type":"education","lineage":["https://openalex.org/I15807432","https://openalex.org/I4387152983"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takeyasu Saito","raw_affiliation_strings":["Osaka Prefecture University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka Prefecture University","institution_ids":["https://openalex.org/I15807432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040862498","display_name":"Naoki Okamoto","orcid":"https://orcid.org/0000-0003-2371-5060","observed_orcids":["https://orcid.org/0000-0003-2371-5060"]},"institutions":[{"id":"https://openalex.org/I15807432","display_name":"Osaka Prefecture University","ror":"https://ror.org/02cf1je33","country_code":"JP","type":"education","lineage":["https://openalex.org/I15807432","https://openalex.org/I4387152983"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Naoki Okamoto","raw_affiliation_strings":["Osaka Prefecture University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Osaka Prefecture University","institution_ids":["https://openalex.org/I15807432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011075895","display_name":"Masao Marunaka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405263874","display_name":"Shinmaywa Industries, Ltd. (Japan)","ror":"https://ror.org/009wkcd89","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405263874"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masao Marunaka","raw_affiliation_strings":["ShinMaywa Industries, Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ShinMaywa Industries, Ltd","institution_ids":["https://openalex.org/I4405263874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112105691","display_name":"Takayuki Tsuchiya","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405263874","display_name":"Shinmaywa Industries, Ltd. (Japan)","ror":"https://ror.org/009wkcd89","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405263874"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takayuki Tsuchiya","raw_affiliation_strings":["ShinMaywa Industries, Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ShinMaywa Industries, Ltd","institution_ids":["https://openalex.org/I4405263874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040392273","display_name":"Masaru Bunya","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210133192","display_name":"Nitto Boseki (Japan)","ror":"https://ror.org/03c55am86","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210133192"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masaru Bunya","raw_affiliation_strings":["Nittobo Medical Co., Ltd"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nittobo Medical Co., Ltd","institution_ids":["https://openalex.org/I4210133192"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4052,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.44114152,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"41","issue":"43","first_page":"45","last_page":"51"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9014000296592712,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9014000296592712,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.09520000219345093,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9210000038146973},{"id":"https://openalex.org/keywords/copper-electrodeposition","display_name":"copper electrodeposition","score":0.9869999885559082},{"id":"https://openalex.org/keywords/microcontact-printing","display_name":"microcontact printing","score":0.6819999814033508},{"id":"https://openalex.org/keywords/surface-passivation-layer","display_name":"surface passivation layer","score":0.38199999928474426},{"id":"https://openalex.org/keywords/additive-optimization","display_name":"additive optimization","score":0.4339999854564667},{"id":"https://openalex.org/keywords/cyclic-voltammetry","display_name":"cyclic voltammetry","score":0.6370000243186951}],"concepts":[{"id":"https://openalex.org/C58943365","wikidata":"https://www.wikidata.org/wiki/Q6839191","display_name":"Microcontact printing","level":2,"score":0.8820449113845825},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8057106733322144},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7356887459754944},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6471787095069885},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.567482054233551},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4437859058380127},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.406080424785614},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3801576495170593},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3749259114265442},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3060407340526581}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1149/1.4717502","doi":"https://doi.org/10.1149/1.4717502","is_oa":false,"landing_page_url":"https://doi.org/10.1149/1.4717502","pdf_url":null,"source":{"id":"https://openalex.org/S4210205149","display_name":"ECS Transactions","issn_l":"1938-5862","issn":["1938-5862","1938-6737","2151-2051"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1","poland-20"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Transactions","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2155044490","https://openalex.org/W2046730245","https://openalex.org/W2110759625","https://openalex.org/W2167452111","https://openalex.org/W2132593501","https://openalex.org/W2349964196","https://openalex.org/W2282054302","https://openalex.org/W2603376784","https://openalex.org/W1570637809","https://openalex.org/W4394712324"],"abstract_inverted_index":{"High-speed":[0],"copper":[1,38],"electrodeposition":[2,16,140],"is":[3,141],"needed":[4],"to":[5,60,85,135],"optimize":[6],"the":[7,18,22,24,29,37,41,52,77,112,122,128,138,144],"TSV":[8,129,139],"process":[9],"with":[10,68,115],"a":[11],"high":[12],"throughput.":[13],"To":[14],"inhibit":[15],"on":[17,28,40],"top":[19,30,42],"surface":[20],"of":[21,121,143],"TSV,":[23],"ODT":[25,33],"was":[26,108],"microcontact-printed":[27],"surface.":[31,43],"The":[32,118,131],"microcontact-printing":[34],"effectively":[35],"inhibits":[36],"electrodepositon":[39],"With":[44],"1.0":[45],"ppm":[46,70],"SDDACC,":[47,71],"V-shapes":[48,72],"were":[49,73],"formed":[50,75],"in":[51,76,91],"via":[53,62,78,87],"cross":[54,79],"sections":[55,80],"and":[56,67,81,96],"these":[57,82],"shapes":[58,83],"lead":[59,84],"bottom-up":[61,86],"filling":[63,92],"[1].":[64],"Without":[65],"micro-contact-printing,":[66],"1.5":[69],"again":[74],"filling.":[88],"We":[89],"succeeded":[90],"10":[93],"\u03bcm":[94,98],"diameter":[95],"70":[97],"deep":[99],"vias":[100],"within":[101],"35":[102],"minutes":[103],"without":[104],"micro-":[105],"contact-printing.":[106],"This":[107],"achieved":[109],"by":[110],"optimizing":[111],"SDDACC":[113],"concentration":[114],"CVS":[116],"measurements.":[117],"inhibition":[119],"layer":[120],"micro-contact-printing":[123],"does":[124],"not":[125],"speed":[126,136],"up":[127,137],"electrodeposition.":[130],"most":[132],"important":[133],"factor":[134],"optimization":[142],"additives.":[145]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-09-24T07:57:37.273135","created_date":"2016-06-24T00:00:00"}