{"id":"https://openalex.org/W2323019443","doi":"https://doi.org/10.4028/www.scientific.net/msf.847.177","title":"Effect of Chemical Plating with Ni Content on Thermoelectric and Mechanical Properties of P-Type Bi0.5Sb0.15Te3 Bulk Alloys","display_name":"Effect of Chemical Plating with Ni Content on Thermoelectric and Mechanical Properties of P-Type Bi0.5Sb0.15Te3 Bulk Alloys","publication_year":2016,"publication_date":"2016-03-01","ids":{"openalex":"https://openalex.org/W2323019443","doi":"https://doi.org/10.4028/www.scientific.net/msf.847.177","mag":"2323019443"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/msf.847.177","doi":"https://doi.org/10.4028/www.scientific.net/msf.847.177","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.847.177","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5021510417","display_name":"Xue Ting Dai","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xue Ting Dai","raw_affiliation_strings":["Hefei University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hefei University of Technology","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100444868","display_name":"Yuan Yu","orcid":"https://orcid.org/0000-0002-3148-6600","observed_orcids":["https://orcid.org/0000-0002-3148-6600","https://orcid.org/0000-0003-1860-3275"]},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Yu","raw_affiliation_strings":["Hefei University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hefei University of Technology","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026116033","display_name":"Fang\u2010Qiu Zu","orcid":"https://orcid.org/0000-0003-4952-6225","observed_orcids":["https://orcid.org/0000-0003-4952-6225"]},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fang Qiu Zu","raw_affiliation_strings":["Heifei University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Heifei University of Technology","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101951121","display_name":"Zhong Huang","orcid":"https://orcid.org/0000-0002-8282-223X","observed_orcids":["https://orcid.org/0000-0002-8282-223X"]},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhong Yue Huang","raw_affiliation_strings":["Hefei University of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hefei University of Technology","institution_ids":["https://openalex.org/I16365422"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I16365422"],"apc_list":null,"apc_paid":null,"fwci":0.1283,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.42259562,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"847","issue":null,"first_page":"177","last_page":"183"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-plating","display_name":"chemical plating","score":0.8569999933242798},{"id":"https://openalex.org/keywords/nickel-plating","display_name":"nickel plating","score":0.9169999957084656},{"id":"https://openalex.org/keywords/bi0-5sb1-5te3","display_name":"Bi0.5Sb1.5Te3","score":0.9169999957084656},{"id":"https://openalex.org/keywords/p-type-thermoelectric-materials","display_name":"p-type thermoelectric materials","score":0.7549999952316284},{"id":"https://openalex.org/keywords/nite2","display_name":"NiTe2","score":0.8190000057220459},{"id":"https://openalex.org/keywords/grain-boundary-segregation","display_name":"grain boundary segregation","score":0.6940000057220459},{"id":"https://openalex.org/keywords/seebeck-coefficient","display_name":"Seebeck coefficient","score":0.8450000286102295},{"id":"https://openalex.org/keywords/electrical-resistivity","display_name":"electrical resistivity","score":0.8840000033378601},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9940000176429749},{"id":"https://openalex.org/keywords/thermoelectric-figure-of-merit","display_name":"figure of merit ZT","score":0.9169999957084656},{"id":"https://openalex.org/keywords/hot-pressing-consolidation","display_name":"hot-pressing consolidation","score":0.6589999794960022},{"id":"https://openalex.org/keywords/hardness","display_name":"hardness","score":0.8130000233650208},{"id":"https://openalex.org/keywords/ductility","display_name":"ductility","score":0.5830000042915344},{"id":"https://openalex.org/keywords/sintering","display_name":"sintering","score":0.5690000057220459}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9378269910812378},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.8160399198532104},{"id":"https://openalex.org/C112625512","wikidata":"https://www.wikidata.org/wiki/Q1091448","display_name":"Seebeck coefficient","level":3,"score":0.6811470985412598},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6540508270263672},{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.640224277973175},{"id":"https://openalex.org/C2776512210","wikidata":"https://www.wikidata.org/wiki/Q5311608","display_name":"Ductility (Earth science)","level":3,"score":0.6066015362739563},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.5937297940254211},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.5410091280937195},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.4940076470375061},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.4805724620819092},{"id":"https://openalex.org/C2776578615","wikidata":"https://www.wikidata.org/wiki/Q5910801","display_name":"Hot pressing","level":2,"score":0.46250268816947937},{"id":"https://openalex.org/C504270822","wikidata":"https://www.wikidata.org/wiki/Q744","display_name":"Nickel","level":2,"score":0.4287072420120239},{"id":"https://openalex.org/C47908070","wikidata":"https://www.wikidata.org/wiki/Q900515","display_name":"Grain boundary","level":3,"score":0.41630250215530396},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4029715657234192},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.26537448167800903},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/msf.847.177","doi":"https://doi.org/10.4028/www.scientific.net/msf.847.177","is_oa":false,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/msf.847.177","pdf_url":null,"source":{"id":"https://openalex.org/S87940674","display_name":"Materials science forum","issn_l":"0255-5476","issn":["0255-5476","1662-9752","1662-9760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","poland-20"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science Forum","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4300816754","https://openalex.org/W2837549044","https://openalex.org/W2875370969","https://openalex.org/W4414333360","https://openalex.org/W2299627109","https://openalex.org/W2067661602","https://openalex.org/W2355923419","https://openalex.org/W4416074232","https://openalex.org/W2965425159","https://openalex.org/W2091931396"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"Bi0.5Sb1.5Te3":[3],"powders":[4,35],"were":[5],"coated":[6],"with":[7,82,115],"various":[8],"nickel":[9],"(Ni)":[10],"contents":[11],"by":[12,20],"chemical":[13,123],"plating,":[14],"and":[15,36,65,100,131,144],"then":[16,37],"consolidated":[17],"into":[18,39],"bulk":[19,63],"hot":[21,104],"pressing.":[22],"The":[23,74],"results":[24],"show":[25],"that":[26,46,95,122],"Ni":[27,57,84,94,116],"particles":[28],"uniformly":[29],"coat":[30],"on":[31],"the":[32,42,51,60,90,103,108,128,133,142,149],"surface":[33],"of":[34,54,62,77,93,112,136,146],"transform":[38],"NiTe2":[40,47],"during":[41,102],"sintering":[43],"process,":[44,106],"after":[45],"mainly":[48],"concentrated":[49],"at":[50],"grain":[52],"boundaries":[53],"bulk.":[55],"With":[56,139],"content":[58,117,145],"increasing,":[59],"resistivity":[61],"samples":[64],"Seebeck":[66],"coefficient":[67],"decreased":[68],"rapidly":[69],"while":[70],"thermal":[71],"conductivity":[72],"increased.":[73],"maximum":[75],"value":[76],"ZT":[78],"for":[79],"Bi0.5Sb1.5Te3/Ni":[80],"sample":[81],"1wt.%":[83],"is":[85],"0.55.":[86],"Moreover,":[87],"due":[88],"to":[89],"excellent":[91],"ductility":[92],"can":[96,126,152],"act":[97],"as":[98],"lubricant":[99],"binder":[101],"pressing":[105],"making":[107],"mechanical":[109,129],"properties":[110,130,135],"(hardness)":[111],"bulks":[113],"elevated":[114],"increasing.":[118],"This":[119],"work":[120],"suggests":[121],"plating":[124],"technology":[125],"improve":[127],"impact":[132],"thermoelectric":[134,137,150],"materials.":[138],"further":[140],"tuning":[141],"type":[143],"coating":[147],"elements,":[148],"performance":[151],"be":[153],"improved":[154],"prospectively.":[155]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1}],"updated_date":"2026-09-26T08:19:03.415552","created_date":"2016-06-24T00:00:00"}