{"id":"https://openalex.org/W2321687378","doi":"https://doi.org/10.1115/imece2009-11639","title":"Control of Internal Stress for High Quality Nickel Large Area Mold Inserts","display_name":"Control of Internal Stress for High Quality Nickel Large Area Mold Inserts","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2321687378","doi":"https://doi.org/10.1115/imece2009-11639","mag":"2321687378"},"language":"en","primary_location":{"id":"doi:10.1115/imece2009-11639","doi":"https://doi.org/10.1115/imece2009-11639","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2009-11639","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 12: Micro and Nano Systems, Parts A and B","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047382647","display_name":"D. S. Park","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. S. Park","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033360492","display_name":"Varshni Singh","orcid":"https://orcid.org/0000-0002-3772-8025","observed_orcids":["https://orcid.org/0000-0002-3772-8025"]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V. Singh","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031008697","display_name":"B. H. You","orcid":"https://orcid.org/0009-0009-0547-0304","observed_orcids":["https://orcid.org/0009-0009-0547-0304"]},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. H. You","raw_affiliation_strings":["Texas State University at San Marcos, San Marcos, TX"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas State University at San Marcos, San Marcos, TX","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004351206","display_name":"Namwon Kim","orcid":"https://orcid.org/0000-0001-7738-9593","observed_orcids":["https://orcid.org/0000-0001-7738-9593"]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"N. Kim","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004815516","display_name":"P.-C. Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P.-C. Chen","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038208939","display_name":"Steven A. Soper","orcid":"https://orcid.org/0000-0002-8292-7058","observed_orcids":["https://orcid.org/0000-0002-8292-7058"]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. A. Soper","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113638144","display_name":"D. E. Nikitopoulos","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. E. Nikitopoulos","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013659856","display_name":"Jost S. Goettert","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Goettert","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5087283200","display_name":"Michael C. Murphy","orcid":"https://orcid.org/0000-0003-1108-3238","observed_orcids":["https://orcid.org/0000-0003-1108-3238"]},"institutions":[{"id":"https://openalex.org/I121820613","display_name":"Louisiana State University","ror":"https://ror.org/05ect4e57","country_code":"US","type":"education","lineage":["https://openalex.org/I121820613"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. C. Murphy","raw_affiliation_strings":["Louisiana State University, Baton Rouge, LA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Louisiana State University, Baton Rouge, LA","institution_ids":["https://openalex.org/I121820613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.30460408,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"263","last_page":"269"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nickel","display_name":"nickel","score":0.4009999930858612},{"id":"https://openalex.org/keywords/internal-stress","display_name":"internal stress","score":0.9359999895095825},{"id":"https://openalex.org/keywords/electrodeposition","display_name":"electrodeposition","score":0.6259999871253967},{"id":"https://openalex.org/keywords/liga","display_name":"LIGA","score":0.7289999723434448},{"id":"https://openalex.org/keywords/uv-liga","display_name":"UV-LIGA","score":0.9919999837875366},{"id":"https://openalex.org/keywords/su-8-mold","display_name":"SU-8 mold","score":0.6869999766349792},{"id":"https://openalex.org/keywords/flatness","display_name":"flatness","score":0.6039999723434448},{"id":"https://openalex.org/keywords/polymer-microfluidic-devices","display_name":"polymer microfluidic devices","score":0.7900000214576721},{"id":"https://openalex.org/keywords/dimensional-control","display_name":"dimensional control","score":0.6349999904632568},{"id":"https://openalex.org/keywords/current-density","display_name":"current density","score":0.8840000033378601}],"concepts":[{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.8340158462524414},{"id":"https://openalex.org/C504270822","wikidata":"https://www.wikidata.org/wiki/Q744","display_name":"Nickel","level":2,"score":0.8109179735183716},{"id":"https://openalex.org/C2778530986","wikidata":"https://www.wikidata.org/wiki/Q5457948","display_name":"Flatness (cosmology)","level":3,"score":0.7907658815383911},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7733813524246216},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.742009162902832},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6385562419891357},{"id":"https://openalex.org/C145695476","wikidata":"https://www.wikidata.org/wiki/Q1638483","display_name":"LIGA","level":4,"score":0.6206966042518616},{"id":"https://openalex.org/C137808972","wikidata":"https://www.wikidata.org/wiki/Q5358014","display_name":"Electroforming","level":3,"score":0.5848448276519775},{"id":"https://openalex.org/C2988361403","wikidata":"https://www.wikidata.org/wiki/Q206175","display_name":"Internal stress","level":2,"score":0.56293123960495},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5491684079170227},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5284951329231262},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.42574605345726013},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.40881022810935974},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.3429754376411438},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.20567861199378967},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C26405456","wikidata":"https://www.wikidata.org/wiki/Q338","display_name":"Cosmology","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1115/imece2009-11639","doi":"https://doi.org/10.1115/imece2009-11639","is_oa":false,"landing_page_url":"https://doi.org/10.1115/imece2009-11639","pdf_url":null,"source":{"id":"https://openalex.org/S4363606942","display_name":"ASME International Mechanical Engineering Congress and Exposition (IMECE)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 12: Micro and Nano Systems, Parts A and B","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.lsu.edu:mechanical_engineering_pubs-2789","doi":null,"is_oa":false,"landing_page_url":"https://repository.lsu.edu/mechanical_engineering_pubs/1789","pdf_url":null,"source":{"id":"https://openalex.org/S4210169993","display_name":"Civil War Book Review","issn_l":"1528-6592","issn":["1528-6592"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315936","host_organization_name":"Louisiana State University","host_organization_lineage":["https://openalex.org/P4310315936"],"host_organization_lineage_names":["Louisiana State University"],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Faculty Publications","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W616886611","https://openalex.org/W7155897180","https://openalex.org/W2014087972","https://openalex.org/W2068495275","https://openalex.org/W2018015244","https://openalex.org/W2188517460","https://openalex.org/W4414994034","https://openalex.org/W2084450428","https://openalex.org/W875512096","https://openalex.org/W2561141278"],"abstract_inverted_index":{"Metallic":[0],"large":[1,23],"area":[2],"mold":[3,34],"inserts":[4],"(LAMIs)":[5],"are":[6],"essential":[7,61],"for":[8,62,165],"the":[9,29,33,42,52,56,64,68,80,108,126,131,134,138,141,152,158,166],"replication":[10],"of":[11,17,32,55,67,79,107,125,137,151,175],"polymer":[12],"microfluidic":[13],"devices.":[14],"Successful":[15],"molding":[16],"micro-":[18],"or":[19,44],"nanoscale":[20],"features":[21],"over":[22],"areas":[24],"is":[25],"dependent":[26],"on":[27,113,117],"improving":[28],"dimensional":[30],"control":[31],"inserts,":[35],"particularly":[36],"those":[37],"fabricated":[38],"by":[39],"electrodeposition":[40],"using":[41,90],"LIGA":[43],"UV-LIGA":[45],"processes.":[46],"A":[47],"systematic":[48],"approach":[49],"to":[50,71,129],"controlling":[51],"internal":[53,77,142,159],"stress":[54,78,94,143,160],"nickel":[57,81,85,109,127,169],"deposits,":[58],"which":[59],"was":[60,73,88,111],"predicting":[63],"final":[65],"flatness":[66,136,174],"LAMIs":[69,110,128,139,170],"prior":[70],"electroplating,":[72],"carried":[74],"out.":[75],"The":[76],"deposits":[82],"from":[83],"a":[84,91,145],"sulfamate":[86],"solution":[87],"estimated":[89],"bent":[92],"strip":[93],"measurement":[95],"method":[96],"after":[97],"maintaining":[98],"electroplating":[99,115],"chemicals":[100],"and":[101,103,140,157],"conditions":[102],"reducing":[104],"contamination.":[105],"Over-electroplating":[106],"performed":[112],"SU-8":[114],"molds":[116],"150":[118],"mm":[119],"diameter":[120],"Si":[121],"wafers.":[122],"Detailed":[123],"characterization":[124],"determine":[130],"relationship":[132],"between":[133],"overall":[135,173],"identified":[144],"suitable":[146],"process":[147],"window":[148],"in":[149],"terms":[150],"current":[153],"densities":[154],"(10\u201320":[155],"mA/cm2)":[156],"(\u22128.3":[161],"\u223c":[162],"\u22123.0":[163],"MPa)":[164],"high":[167],"quality":[168],"with":[171],"an":[172],"100":[176],"\u03bcm.":[177]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-11-01T11:40:01.658920","created_date":"2016-06-24T00:00:00"}