{"id":"https://openalex.org/W2319086470","doi":"https://doi.org/10.4071/2013dpc-tp12","title":"3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics","display_name":"3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics","publication_year":2013,"publication_date":"2013-01-01","ids":{"openalex":"https://openalex.org/W2319086470","doi":"https://doi.org/10.4071/2013dpc-tp12","mag":"2319086470"},"language":"en","primary_location":{"id":"doi:10.4071/2013dpc-tp12","doi":"https://doi.org/10.4071/2013dpc-tp12","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2013dpc-tp12","pdf_url":null,"source":{"id":"https://openalex.org/S4210189957","display_name":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","issn_l":"2380-4491","issn":["2380-4491"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080407325","display_name":"Rabindra Nath Das","orcid":"https://orcid.org/0009-0002-0635-7230","observed_orcids":["https://orcid.org/0009-0002-0635-7230"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rabindra Das","raw_affiliation_strings":["Endicott Interconnect Technologies, Inc., Endicott, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Endicott Interconnect Technologies, Inc., Endicott, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050800070","display_name":"Frank D. Egitto","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Frank D. Egitto","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014082922","display_name":"Steven G. Rosser","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Steven G. Rosser","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009284461","display_name":"Erich Kopp","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Erich Kopp","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5087062324","display_name":"Barry Bonitz","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Barry Bonitz","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.29332526,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":"2013","issue":"DPC","first_page":"000618","last_page":"000634"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.8659999966621399},{"id":"https://openalex.org/keywords/system-in-package","display_name":"system-in-package","score":0.9559999704360962},{"id":"https://openalex.org/keywords/interposer","display_name":"interposer","score":0.7089999914169312},{"id":"https://openalex.org/keywords/flip-chip","display_name":"flip-chip packaging","score":0.7639999985694885},{"id":"https://openalex.org/keywords/embedded-passive-components","display_name":"embedded passives","score":0.8169999718666077},{"id":"https://openalex.org/keywords/plated-through-holes","display_name":"plated through holes","score":0.6340000033378601},{"id":"https://openalex.org/keywords/electrically-conductive-adhesives","display_name":"conductive adhesives","score":0.7680000066757202},{"id":"https://openalex.org/keywords/printed-circuit-board-assembly","display_name":"printed circuit board assembly","score":0.5799999833106995},{"id":"https://openalex.org/keywords/high-density-interconnects","display_name":"high-density interconnects","score":0.4519999921321869}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9316704273223877},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.9273443222045898},{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.7966201305389404},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.5613918900489807},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.551616907119751},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48034512996673584},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.46803808212280273},{"id":"https://openalex.org/C110925319","wikidata":"https://www.wikidata.org/wiki/Q12855","display_name":"Cable gland","level":2,"score":0.4540674090385437},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.44276732206344604},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.43707650899887085},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.41655397415161133},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.413392037153244},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.361549437046051},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.33797022700309753},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3077681064605713},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25594672560691833},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.19761845469474792},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10442674160003662},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08228999376296997},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/2013dpc-tp12","doi":"https://doi.org/10.4071/2013dpc-tp12","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2013dpc-tp12","pdf_url":null,"source":{"id":"https://openalex.org/S4210189957","display_name":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","issn_l":"2380-4491","issn":["2380-4491"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2263926683","https://openalex.org/W1999811912","https://openalex.org/W2135963809","https://openalex.org/W2279928343","https://openalex.org/W4416878787","https://openalex.org/W2789753047","https://openalex.org/W7000976381","https://openalex.org/W2253348165","https://openalex.org/W4416876172","https://openalex.org/W2904352343"],"abstract_inverted_index":{"The":[0,61,164,279],"demand":[1,173],"for":[2,174,205],"high-performance,":[3],"lightweight,":[4],"portable":[5],"computing":[6],"power":[7],"is":[8],"driving":[9],"the":[10,17,75,78,86,100,107,118,147,155,192,242,252,296],"industry":[11],"toward":[12],"3D":[13,199,305],"integration":[14],"to":[15,32,35,77,89,189,221,267,289,303],"meet":[16],"demands":[18],"of":[19,99,115,154,216],"higher":[20,44],"functionality":[21],"in":[22,64,117,241,251],"ever":[23],"smaller":[24,47,57,59,144],"packages.":[25],"To":[26],"accomplish":[27],"this,":[28],"new":[29],"packaging":[30],"needs":[31],"be":[33,93,126,139],"able":[34],"integrate":[36],"multiple":[37,39,207],"substrates,":[38],"dies":[40],"with":[41,81,128,146,167,181,272,286],"greater":[42,50],"function,":[43],"I/O":[45],"counts,":[46],"pitches,":[48],"and":[49,58,102,161,172,184,260,277,281],"heat":[51],"densities,":[52],"while":[53],"being":[54],"pushed":[55],"into":[56,141,210],"footprints.":[60],"approaches":[62],"explored":[63],"this":[65],"paper":[66],"include":[67],"eliminating":[68],"active":[69,160],"chip":[70,76,83],"packages":[71],"by":[72,96,159,255],"directly":[73],"attaching":[74],"System-in-Package":[79],"(SiP)":[80],"flip":[82],"technology.":[84],"Additionally,":[85],"area":[87,150],"devoted":[88],"passive":[90,162],"components":[91],"can":[92,125,137],"greatly":[94],"reduced":[95,127,169],"embedding":[97],"many":[98],"capacitors":[101],"resistors.":[103],"In":[104,191,294],"some":[105],"instances,":[106],"connector":[108,132],"systems":[109],"that":[110],"were":[111,219,227,270,284],"consuming":[112],"large":[113],"amounts":[114],"space":[116],"traditional":[119],"Printed":[120],"Wiring":[121],"Board":[122],"(PWB)":[123],"assembly":[124,136],"a":[129,142,177,211,232,291],"small":[130],"pitch":[131],"system.":[133],"This":[134],"PWB":[135],"then":[138],"transformed":[140],"much":[143],"SiP":[145,166,208,310],"full":[148],"surface":[149],"on":[151,308],"both":[152],"sides":[153],"package":[156,170,180],"effectively":[157],"utilized":[158],"components.":[163],"miniaturized":[165],"its":[168],"size":[171],"passives":[175,183],"requires":[176],"high":[178],"wireability":[179],"embedded":[182],"excellent":[185],"communication":[186],"from":[187,264],"top":[188],"bottom.":[190],"present":[193,297],"study,":[194],"we":[195],"also":[196],"report":[197],"novel":[198],"\u201cPackage":[200],"Interposer":[201],"Package\u201d":[202],"(PIP)":[203],"solution":[204],"combining":[206],"substrates":[209,239,288],"single":[212],"package.":[213],"A":[214],"variety":[215],"interposer":[217],"structures":[218],"used":[220],"fabricate":[222],"SiP-Interposer-SiP":[223],"modules.":[224],"Electrical":[225],"connections":[226],"formed":[228,254],"during":[229],"reflow":[230],"using":[231,246],"tin-lead":[233],"eutectic":[234],"solder":[235],"paste.":[236],"Interconnection":[237],"among":[238],"(packages)":[240],"stack":[243],"was":[244],"achieved":[245],"interposers.":[247],"Plated":[248],"through":[249],"holes":[250],"interposers,":[253],"laser":[256],"or":[257],"mechanical":[258],"drilling":[259],"having":[261],"diameters":[262],"ranging":[263],"50":[265],"\u00ef\u0081\u00acm":[266],"250":[268],"\u00ef\u0081\u00acm,":[269],"filled":[271],"an":[273,300],"electrically":[274],"conductive":[275],"adhesive":[276],"cured.":[278],"adhesive-filled":[280],"cured":[282],"interposers":[283],"reflowed":[285],"circuitized":[287],"produce":[290],"PIP":[292,306],"structure.":[293],"summary,":[295],"work":[298],"describes":[299],"integrated":[301],"approach":[302],"develop":[304],"solutions":[307],"various":[309],"configurations.":[311]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-13T10:08:12.033832","created_date":"2016-06-24T00:00:00"}