{"id":"https://openalex.org/W2298557017","doi":"https://doi.org/10.1016/j.mee.2016.01.018","title":"Stamp degradation for high volume UV enhanced substrate conformal imprint lithography (UV-SCIL)","display_name":"Stamp degradation for high volume UV enhanced substrate conformal imprint lithography (UV-SCIL)","publication_year":2016,"publication_date":"2016-01-21","ids":{"openalex":"https://openalex.org/W2298557017","doi":"https://doi.org/10.1016/j.mee.2016.01.018","mag":"2298557017"},"language":"en","primary_location":{"id":"doi:10.1016/j.mee.2016.01.018","doi":"https://doi.org/10.1016/j.mee.2016.01.018","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mee.2016.01.018","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050613954","display_name":"Michael J. Haslinger","orcid":"https://orcid.org/0000-0002-0127-5554","observed_orcids":["https://orcid.org/0000-0002-0127-5554"]},"institutions":[{"id":"https://openalex.org/I4210132502","display_name":"PROFACTOR GmbH (Austria)","ror":"https://ror.org/043rjaw23","country_code":"AT","type":"company","lineage":["https://openalex.org/I132118926","https://openalex.org/I4210132502"]}],"countries":["AT"],"is_corresponding":true,"raw_author_name":"M.J. Haslinger","raw_affiliation_strings":["Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria","institution_ids":["https://openalex.org/I4210132502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061689824","display_name":"Marc A. Verschuuren","orcid":"https://orcid.org/0000-0001-8013-1593","observed_orcids":["https://orcid.org/0000-0001-8013-1593"]},"institutions":[{"id":"https://openalex.org/I4210122849","display_name":"Philips (Netherlands)","ror":"https://ror.org/02p2bgp27","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210122849"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"M.A. Verschuuren","raw_affiliation_strings":["Philips Intellectual Property & Standards, High Tech Campus 5, 5656 AE Eindhoven, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Philips Intellectual Property & Standards, High Tech Campus 5, 5656 AE Eindhoven, The Netherlands","institution_ids":["https://openalex.org/I4210122849"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059758175","display_name":"Remco van Brakel","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210122849","display_name":"Philips (Netherlands)","ror":"https://ror.org/02p2bgp27","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210122849"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"R. van Brakel","raw_affiliation_strings":["Philips Intellectual Property & Standards, High Tech Campus 5, 5656 AE Eindhoven, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Philips Intellectual Property & Standards, High Tech Campus 5, 5656 AE Eindhoven, The Netherlands","institution_ids":["https://openalex.org/I4210122849"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069837016","display_name":"J. Danzberger","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210132502","display_name":"PROFACTOR GmbH (Austria)","ror":"https://ror.org/043rjaw23","country_code":"AT","type":"company","lineage":["https://openalex.org/I132118926","https://openalex.org/I4210132502"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"J. Danzberger","raw_affiliation_strings":["Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria","institution_ids":["https://openalex.org/I4210132502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077578896","display_name":"Iris Bergmair","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210108843","display_name":"Sony Digital Audio Disc Corporation (Austria)","ror":"https://ror.org/01ngvra90","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210108843"]},{"id":"https://openalex.org/I4210132502","display_name":"PROFACTOR GmbH (Austria)","ror":"https://ror.org/043rjaw23","country_code":"AT","type":"company","lineage":["https://openalex.org/I132118926","https://openalex.org/I4210132502"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"I. Bergmair","raw_affiliation_strings":["Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria","SONY DADC Austria AG, 5081 Anif, Salzburg, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria","institution_ids":["https://openalex.org/I4210132502"]},{"raw_affiliation_string":"SONY DADC Austria AG, 5081 Anif, Salzburg, Austria","institution_ids":["https://openalex.org/I4210108843"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036233556","display_name":"Michael M. M\u00fchlberger","orcid":"https://orcid.org/0000-0001-7542-8552","observed_orcids":["https://orcid.org/0000-0001-7542-8552"]},"institutions":[{"id":"https://openalex.org/I4210132502","display_name":"PROFACTOR GmbH (Austria)","ror":"https://ror.org/043rjaw23","country_code":"AT","type":"company","lineage":["https://openalex.org/I132118926","https://openalex.org/I4210132502"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"M. M\u00fchlberger","raw_affiliation_strings":["Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Functional Surfaces and Nanostructures, Profactor GmbH, 4407 Steyr-Gleink, Austria","institution_ids":["https://openalex.org/I4210132502"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5050613954"],"corresponding_institution_ids":["https://openalex.org/I4210132502"],"apc_list":{"value":2860,"currency":"USD","value_usd":2860},"apc_paid":null,"fwci":1.1984,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.7479097,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"153","issue":null,"first_page":"66","last_page":"70"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.00139999995008111,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pdms-stamp","display_name":"PDMS stamp","score":0.7179999947547913},{"id":"https://openalex.org/keywords/pattern-accuracy","display_name":"pattern accuracy","score":0.5419999957084656}],"concepts":[{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7549015879631042},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.7393549680709839},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5652879476547241},{"id":"https://openalex.org/C118524077","wikidata":"https://www.wikidata.org/wiki/Q7554001","display_name":"Soft lithography","level":4,"score":0.562556266784668},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.5163084864616394},{"id":"https://openalex.org/C2777682490","wikidata":"https://www.wikidata.org/wiki/Q18355911","display_name":"UV curing","level":3,"score":0.5005543231964111},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.47772976756095886},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4333820939064026},{"id":"https://openalex.org/C98214594","wikidata":"https://www.wikidata.org/wiki/Q850275","display_name":"Conformal map","level":2,"score":0.4278997480869293},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.4218481183052063},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.41902726888656616},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4001254439353943},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.37751469016075134},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2607119083404541},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.12097182869911194},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11906680464744568},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09683391451835632},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mee.2016.01.018","doi":"https://doi.org/10.1016/j.mee.2016.01.018","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mee.2016.01.018","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320310617","display_name":"Klima- und Energiefonds","ror":"https://ror.org/044ym4p17"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1602756525","https://openalex.org/W1993262467","https://openalex.org/W1993604118","https://openalex.org/W2022521351","https://openalex.org/W2022948920","https://openalex.org/W2034214952","https://openalex.org/W2061969166","https://openalex.org/W2064295892","https://openalex.org/W2068276297","https://openalex.org/W2153271082","https://openalex.org/W4234109392"],"related_works":["https://openalex.org/W2061969166","https://openalex.org/W7006111359","https://openalex.org/W2617353793","https://openalex.org/W2064295892","https://openalex.org/W2249304343","https://openalex.org/W7039149810","https://openalex.org/W2924966955","https://openalex.org/W2036951758","https://openalex.org/W2792519483","https://openalex.org/W2002333829"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}