{"id":"https://openalex.org/W2293740169","doi":"https://doi.org/10.1109/temc.2015.2503729","title":"Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages","display_name":"Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages","publication_year":2016,"publication_date":"2016-02-03","ids":{"openalex":"https://openalex.org/W2293740169","doi":"https://doi.org/10.1109/temc.2015.2503729","mag":"2293740169"},"language":"en","primary_location":{"id":"doi:10.1109/temc.2015.2503729","doi":"https://doi.org/10.1109/temc.2015.2503729","is_oa":false,"landing_page_url":"https://doi.org/10.1109/temc.2015.2503729","pdf_url":null,"source":{"id":"https://openalex.org/S163644703","display_name":"IEEE Transactions on Electromagnetic Compatibility","issn_l":"0018-9375","issn":["0018-9375","1558-187X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-b","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electromagnetic Compatibility","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Yi He","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi He","raw_affiliation_strings":["System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100362118","display_name":"Jun Li","orcid":"https://orcid.org/0000-0003-4455-2707","observed_orcids":["https://orcid.org/0000-0003-4455-2707"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Li","raw_affiliation_strings":["System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072523118","display_name":"Gengxin Tian","orcid":"https://orcid.org/0000-0002-7992-1819","observed_orcids":["https://orcid.org/0000-0002-7992-1819"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Gengxin Tian","raw_affiliation_strings":["System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075413332","display_name":"Fengman Liu","orcid":"https://orcid.org/0000-0002-3579-1151","observed_orcids":["https://orcid.org/0000-0002-3579-1151","https://orcid.org/0000-0001-5134-3079"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fengman Liu","raw_affiliation_strings":["System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083314215","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-0859-1437","observed_orcids":["https://orcid.org/0000-0002-0859-1437"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"System Packaging and Integration Research Center, Institute of MicroElectronics of the Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.9156,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.74036533,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":"58","issue":"2","first_page":"442","last_page":"447"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9115999937057495,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9115999937057495,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11851","display_name":"Electromagnetic Compatibility and Measurements","score":0.059300001710653305,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0142000000923872,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrically-conductive-adhesives","display_name":"conductive adhesives","score":0.7990000247955322},{"id":"https://openalex.org/keywords/molding-compound","display_name":"molding compound","score":0.9340000152587891},{"id":"https://openalex.org/keywords/3d-packaging","display_name":"3D packaging","score":0.8569999933242798},{"id":"https://openalex.org/keywords/electromagnetic-interference","display_name":"electromagnetic interference","score":0.7519999742507935},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"signal integrity","score":0.7120000123977661},{"id":"https://openalex.org/keywords/die-stacking","display_name":"die stacking","score":0.7540000081062317},{"id":"https://openalex.org/keywords/near-field-coupling","display_name":"near-field coupling","score":0.8009999990463257},{"id":"https://openalex.org/keywords/sound-insulation","display_name":"sound insulation","score":0.9049999713897705}],"concepts":[{"id":"https://openalex.org/C2265751","wikidata":"https://www.wikidata.org/wiki/Q332007","display_name":"Electromagnetic shielding","level":2,"score":0.9321836233139038},{"id":"https://openalex.org/C43461449","wikidata":"https://www.wikidata.org/wiki/Q2495531","display_name":"EMI","level":3,"score":0.756845235824585},{"id":"https://openalex.org/C184892835","wikidata":"https://www.wikidata.org/wiki/Q1474513","display_name":"Electromagnetic interference","level":2,"score":0.6933062672615051},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6429328918457031},{"id":"https://openalex.org/C98214594","wikidata":"https://www.wikidata.org/wiki/Q850275","display_name":"Conformal map","level":2,"score":0.5768460035324097},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5586279630661011},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5439796447753906},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.49953293800354004},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48610997200012207},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.47443878650665283},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.4657588303089142},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.43158721923828125},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.415353387594223},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.40786558389663696},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.3197273910045624},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23505505919456482},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21268951892852783},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.18561109900474548},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.10718855261802673},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08520331978797913},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/temc.2015.2503729","doi":"https://doi.org/10.1109/temc.2015.2503729","is_oa":false,"landing_page_url":"https://doi.org/10.1109/temc.2015.2503729","pdf_url":null,"source":{"id":"https://openalex.org/S163644703","display_name":"IEEE Transactions on Electromagnetic Compatibility","issn_l":"0018-9375","issn":["0018-9375","1558-187X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-b","jufo-1","norway-1","poland-100","russia-white-list-2"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electromagnetic Compatibility","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G1241905224","display_name":null,"funder_award_id":"61474140","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1955489811","https://openalex.org/W2024735098","https://openalex.org/W2030499947","https://openalex.org/W2054754736","https://openalex.org/W2128454671","https://openalex.org/W2138774775","https://openalex.org/W2172103101","https://openalex.org/W2541776642","https://openalex.org/W2549178992"],"related_works":["https://openalex.org/W2549178992","https://openalex.org/W1550012771","https://openalex.org/W2083511305","https://openalex.org/W4401990847","https://openalex.org/W2344020185","https://openalex.org/W2810658524","https://openalex.org/W2054754736","https://openalex.org/W4396941309","https://openalex.org/W2079514998","https://openalex.org/W2217598715"],"abstract_inverted_index":{"With":[0],"the":[1,67,87,92,96,107,111,120,130,137],"continuous":[2],"improvement":[3],"of":[4,76,95,110],"system":[5],"integration,":[6],"3-D":[7,72,164],"packages":[8],"are":[9,24,38,83],"becoming":[10],"effective":[11,155],"solutions":[12],"for":[13,40,158],"lighter,":[14,146],"thinner,":[15,145],"shorter,":[16],"and":[17,46,99,147],"smaller":[18],"electronic":[19],"products.":[20],"Meanwhile,":[21],"packaging":[22],"engineers":[23],"faced":[25],"with":[26,58,79,98,129,134],"serious":[27],"signal":[28,166],"integrity":[29],"challenges.":[30],"Especially":[31],"significant":[32],"intrasystem":[33,68],"electromagnetic":[34],"interference":[35],"(EMI)":[36],"problems":[37,70],"aggravated":[39],"shortened":[41],"distance":[42],"between":[43],"noise":[44,93,124],"sources":[45],"sensitive":[47],"circuits.":[48],"In":[49],"this":[50],"paper,":[51],"we":[52,103],"present":[53],"a":[54,143],"conformal":[55,112,138],"shielding":[56,88,101,108,113,131,139,156],"structure":[57,140],"conductive":[59],"adhesive":[60],"coated":[61],"on":[62],"molding":[63],"compound":[64],"to":[65,85],"improve":[66],"EMI":[69],"in":[71,163],"packages.":[73,169],"Three":[74],"groups":[75],"die-stacking":[77],"samples":[78,97],"different":[80],"coupling":[81,123],"mechanisms":[82],"fabricated":[84],"evaluate":[86],"effectiveness.":[89],"By":[90],"comparing":[91],"isolation":[94,125],"without":[100],"structures,":[102],"can":[104,141],"clearly":[105],"see":[106],"capability":[109],"structure.":[114,132],"The":[115],"measurement":[116],"results":[117],"indicate":[118],"that":[119],"near":[121,160],"field":[122,161],"has":[126],"significantly":[127],"improved":[128],"Compared":[133],"traditional":[135],"methods,":[136],"realize":[142],"cheaper,":[144],"more":[148],"flexible":[149],"shielding.":[150],"It":[151],"would":[152],"be":[153],"an":[154],"solution":[157],"suppressing":[159],"radiation":[162],"mixed":[165],"or":[167],"RF/Microwave":[168]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":5},{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-01T08:54:57.152042","created_date":"2016-06-24T00:00:00"}