{"id":"https://openalex.org/W2287065249","doi":"https://doi.org/10.4071/isom-ta35","title":"PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACH","display_name":"PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACH","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2287065249","doi":"https://doi.org/10.4071/isom-ta35","mag":"2287065249"},"language":"en","primary_location":{"id":"doi:10.4071/isom-ta35","doi":"https://doi.org/10.4071/isom-ta35","is_oa":false,"landing_page_url":"https://doi.org/10.4071/isom-ta35","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5030648709","display_name":"Sihai Chen","orcid":"https://orcid.org/0000-0002-0640-5936","observed_orcids":["https://orcid.org/0000-0002-0640-5936"]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Sihai Chen","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Guangyu Fan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Guangyu Fan","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101849379","display_name":"Xue Sheng Yan","orcid":"https://orcid.org/0000-0003-3925-4086","observed_orcids":["https://orcid.org/0000-0003-3925-4086"]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Xue Yan","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015818160","display_name":"Chris LaBarbera","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Chris LaBarbera","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076750316","display_name":"Lee Kresge","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Lee Kresge","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027295110","display_name":"Ning-Cheng Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ning-Cheng Lee","raw_affiliation_strings":["Indium Corporation, Clinton, NY USA,askus@indium.com"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY USA,askus@indium.com","institution_ids":["https://openalex.org/I4210113846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5015818160","https://openalex.org/A5027295110","https://openalex.org/A5030648709","https://openalex.org/A5076750316","https://openalex.org/A5101849379"],"corresponding_institution_ids":["https://openalex.org/I4210113846"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"2014","issue":"1","first_page":"000092","last_page":"000098"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pressureless-sintering","display_name":"pressureless sintering","score":0.9520000219345093},{"id":"https://openalex.org/keywords/die-attach","display_name":"die attach","score":0.9350000023841858},{"id":"https://openalex.org/keywords/low-porosity","display_name":"low porosity","score":0.7269999980926514},{"id":"https://openalex.org/keywords/solder-paste","display_name":"solder paste","score":0.44999998807907104},{"id":"https://openalex.org/keywords/thermal-aging","display_name":"thermal aging","score":0.7490000128746033},{"id":"https://openalex.org/keywords/shear-strength","display_name":"shear strength","score":0.546999990940094},{"id":"https://openalex.org/keywords/thermal-shock","display_name":"thermal shock","score":0.6480000019073486},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6150000095367432}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8168058395385742},{"id":"https://openalex.org/C193523891","wikidata":"https://www.wikidata.org/wiki/Q1771950","display_name":"dBc","level":3,"score":0.7355943322181702},{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.7321763038635254},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.7106215953826904},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6729360818862915},{"id":"https://openalex.org/C2780357685","wikidata":"https://www.wikidata.org/wiki/Q154357","display_name":"Nano-","level":2,"score":0.6314367055892944},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5185856819152832},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5075629949569702},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4951860010623932},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.48796242475509644},{"id":"https://openalex.org/C64355373","wikidata":"https://www.wikidata.org/wiki/Q1024411","display_name":"Spall","level":2,"score":0.4807812571525574},{"id":"https://openalex.org/C127893833","wikidata":"https://www.wikidata.org/wiki/Q7492185","display_name":"Shear strength (soil)","level":3,"score":0.46394965052604675},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.4403698444366455},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.41800886392593384},{"id":"https://openalex.org/C157777378","wikidata":"https://www.wikidata.org/wiki/Q41716","display_name":"Boiling","level":2,"score":0.4106552004814148},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.40132734179496765},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13329431414604187},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.08583566546440125},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C159750122","wikidata":"https://www.wikidata.org/wiki/Q96621023","display_name":"Soil water","level":2,"score":0.0},{"id":"https://openalex.org/C159390177","wikidata":"https://www.wikidata.org/wiki/Q9161265","display_name":"Soil science","level":1,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.0},{"id":"https://openalex.org/C39432304","wikidata":"https://www.wikidata.org/wiki/Q188847","display_name":"Environmental science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/isom-ta35","doi":"https://doi.org/10.4071/isom-ta35","is_oa":false,"landing_page_url":"https://doi.org/10.4071/isom-ta35","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W1763353248","https://openalex.org/W1995312262"],"related_works":["https://openalex.org/W4416880294","https://openalex.org/W4416879179","https://openalex.org/W1480083062","https://openalex.org/W1502855615","https://openalex.org/W2288598068","https://openalex.org/W2253040063","https://openalex.org/W4416879981","https://openalex.org/W2280133656","https://openalex.org/W1635399039","https://openalex.org/W4408085016"],"abstract_inverted_index":{"A":[0,138],"novel":[1],"nano-Ag":[2,85,136],"sintering":[3,12],"paste":[4],"C":[5,17],"has":[6],"been":[7],"developed":[8],"for":[9,41,83,156],"a":[10,29,49,76],"pressureless":[11],"process":[13],"under":[14],"air.":[15],"Paste":[16],"was":[18,81,149,152],"sintered":[19],"at":[20,39,123],"250\u00b0C":[21,40],"(C1)":[22],"and":[23,46,67,92,121,127,151],"280\u00b0C":[24],"(C2),":[25],"respectively;":[26],"C1":[27,45,91],"showed":[28],"slightly":[30],"higher":[31,34],"porosity":[32],"but":[33],"shear":[35],"strength":[36],"after":[37,64],"aging":[38,66],"840":[42],"hours.":[43],"Both":[44],"C2":[47,93],"exhibited":[48],"microstructure":[50],"much":[51],"more":[52,95],"stable":[53],"than":[54],"the":[55,72,98,108,124,133,157],"control":[56],"solder":[57],"92.5Pb/5Sn/2.5Ag,":[58],"which":[59],"suffered":[60],"both":[61],"IMC":[62],"spalling":[63],"thermal":[65,142],"voiding.":[68],"Ag":[69,102,111],"migration":[70,99,103],"toward":[71],"DBC":[73,125],"to":[74,107,112,129,140,147],"form":[75,113],"dense":[77],"layer":[78],"of":[79,110,135],"AgCuNi(Au)":[80],"observed":[82],"all":[84],"pastes":[86],"that":[87],"were":[88],"studied,":[89],"with":[90,116,118],"being":[94],"moderate":[96],"in":[97,161],"rate.":[100],"The":[101],"could":[104],"be":[105,130],"attributed":[106],"tendency":[109],"an":[114],"alloy":[115],"Au,":[117],"abundant":[119],"Ni":[120],"Cu":[122],"side,":[126],"appeared":[128],"affected":[131],"by":[132],"chemistry":[134],"paste.":[137],"liquid":[139,141],"shock":[143],"test":[144],"from":[145],"\u221245\u00b0C":[146],"240\u00b0C":[148],"attempted,":[150],"considered":[153],"too":[154],"harsh":[155],"die/DBC":[158],"system":[159],"employed":[160],"this":[162],"study.":[163]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}