{"id":"https://openalex.org/W2267608136","doi":"https://doi.org/10.4071/2014dpc-tp25","title":"Solderability Challenges in Emerging BGA Packages","display_name":"Solderability Challenges in Emerging BGA Packages","publication_year":2014,"publication_date":"2014-01-01","ids":{"openalex":"https://openalex.org/W2267608136","doi":"https://doi.org/10.4071/2014dpc-tp25","mag":"2267608136"},"language":"en","primary_location":{"id":"doi:10.4071/2014dpc-tp25","doi":"https://doi.org/10.4071/2014dpc-tp25","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2014dpc-tp25","pdf_url":null,"source":{"id":"https://openalex.org/S4210189957","display_name":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","issn_l":"2380-4491","issn":["2380-4491"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011924526","display_name":"Maria Durham","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Maria Durham","raw_affiliation_strings":["Indium Corporation, Clinton, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, USA","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100351164","display_name":"Yan Liu","orcid":"https://orcid.org/0000-0003-3046-9566","observed_orcids":["https://orcid.org/0000-0003-3046-9566"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yan Liu","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5089981154","display_name":"Andy C. Mackie","orcid":"https://orcid.org/0000-0001-6720-1008","observed_orcids":["https://orcid.org/0000-0001-6720-1008"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Andy Mackie","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2014","issue":"DPC","first_page":"000913","last_page":"000929"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/solderability","display_name":"solderability","score":0.9950000047683716},{"id":"https://openalex.org/keywords/ball-grid-array-packages","display_name":"ball grid array packages","score":0.6800000071525574},{"id":"https://openalex.org/keywords/flip-chip-bga","display_name":"flip-chip BGA","score":0.7940000295639038},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"chip scale package","score":0.8299999833106995},{"id":"https://openalex.org/keywords/wafer-level-chip-scale-package","display_name":"wafer level chip scale package","score":0.8980000019073486},{"id":"https://openalex.org/keywords/package-warpage","display_name":"package warpage","score":0.8730000257492065}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.8554244637489319},{"id":"https://openalex.org/C2778115343","wikidata":"https://www.wikidata.org/wiki/Q7557224","display_name":"Solderability","level":3,"score":0.836451530456543},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7173049449920654},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6373288631439209},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.43595242500305176},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3802279829978943}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/2014dpc-tp25","doi":"https://doi.org/10.4071/2014dpc-tp25","is_oa":false,"landing_page_url":"https://doi.org/10.4071/2014dpc-tp25","pdf_url":null,"source":{"id":"https://openalex.org/S4210189957","display_name":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","issn_l":"2380-4491","issn":["2380-4491"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2344447826","https://openalex.org/W2101673620","https://openalex.org/W2002954914","https://openalex.org/W1963719467","https://openalex.org/W4406014603","https://openalex.org/W2112344134","https://openalex.org/W2249130389","https://openalex.org/W1607060045","https://openalex.org/W7093765699","https://openalex.org/W2543860907"],"abstract_inverted_index":{"The":[0,129],"final":[1,43,51,83,113],"step":[2],"of":[3,13,36,48,72,91,102,105,111,119,125,131,143,155],"reflowing":[4],"solder":[5],"spheres":[6],"to":[7,24,41,59,81,139],"solderable":[8,121],"pads":[9],"on":[10,108],"the":[11,31,46,69,82,89,100,109,112,120,126,153,159],"bottom":[12],"substrates":[14,78],"in":[15,94,158],"FCBGA,":[16],"CSP,":[17],"and":[18,34,65,76,98,123,148,150],"WLCSP":[19],"packages":[20],"is":[21,53,137],"often":[22],"considered":[23],"be":[25,140],"a":[26,49,132,141],"trivial":[27],"step.":[28],"However,":[29],"with":[30],"increasing":[32],"complexity":[33],"number":[35],"assembly":[37],"processes":[38,92,107],"taken":[39],"prior":[40,80,106],"this":[42,61],"soldering":[44],"step,":[45],"formation":[47],"reliable":[50],"joint":[52],"far":[54],"from":[55],"certain.":[56],"In":[57],"order":[58],"eliminate":[60],"problem,":[62],"many":[63],"OSATs":[64],"ODMs":[66],"are":[67],"adopting":[68],"non-value-added":[70],"process":[71,146],"prefluxing,":[73],"reflowing,":[74],"cleaning,":[75],"drying":[77],"immediately":[79],"ball-attach":[84,135],"process.":[85],"This":[86],"paper":[87],"details":[88,117],"sequence":[90],"seen":[93],"typical":[95],"BGA":[96],"assembly,":[97],"examines":[99],"effects":[101],"each":[103],"set":[104],"solderability":[110],"pad.":[114,128],"It":[115],"also":[116,151],"investigations":[118],"surface":[122],"metallurgy":[124],"substrate":[127],"introduction":[130],"\u201cone-step\u201d":[133],"pin-transfer":[134],"flux":[136],"shown":[138],"means":[142],"reducing":[144,152],"both":[145],"cost":[147],"time,":[149],"risk":[154],"significant":[156],"warpage":[157],"finished":[160],"package.":[161]},"counts_by_year":[],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-06-24T00:00:00"}