{"id":"https://openalex.org/W2265023621","doi":"https://doi.org/10.1149/ma2008-02/34/2242","title":"Advanced Processing Techniques for Sub-Millimeter Wave MMICs","display_name":"Advanced Processing Techniques for Sub-Millimeter Wave MMICs","publication_year":2008,"publication_date":"2008-08-29","ids":{"openalex":"https://openalex.org/W2265023621","doi":"https://doi.org/10.1149/ma2008-02/34/2242","mag":"2265023621"},"language":"en","primary_location":{"id":"doi:10.1149/ma2008-02/34/2242","doi":"https://doi.org/10.1149/ma2008-02/34/2242","is_oa":true,"landing_page_url":"https://doi.org/10.1149/ma2008-02/34/2242","pdf_url":"https://iopscience.iop.org/article/10.1149/MA2008-02/34/2242/pdf","source":{"id":"https://openalex.org/S4210168594","display_name":"ECS Meeting Abstracts","issn_l":"1091-8213","issn":["1091-8213","2151-2035","2151-2043","2152-8365"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Meeting Abstracts","raw_type":"journal-article"},"volume":null,"type":"conference-abstract","is_traditional":false,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://iopscience.iop.org/article/10.1149/MA2008-02/34/2242/pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080024611","display_name":"J. Uyeda","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jansen J. Uyeda","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110193881","display_name":"X. B. Mei","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaobing (Gerry) Mei","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025652767","display_name":"Ling-Shine Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ling-Shine (Jane) Lee","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002449091","display_name":"Danny H.W. Li","orcid":"https://orcid.org/0000-0003-0436-2001","observed_orcids":["https://orcid.org/0000-0003-0436-2001"]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Danny Li","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078048109","display_name":"Wayne Yoshida","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wayne Yoshida","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060094174","display_name":"Po-Hsin Liu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Po-Hsin Liu","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114777898","display_name":"Linh Dang","orcid":"https://orcid.org/0000-0002-3892-5469","observed_orcids":["https://orcid.org/0000-0002-3892-5469"]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Linh Dang","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ke Luo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ke Luo","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023784436","display_name":"Raffi Elmadjian","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Raffi Elmadjian","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103414343","display_name":"Joe Zhou","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Joe Zhou","raw_affiliation_strings":["NGST"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"NGST","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078379335","display_name":"William R. Deal","orcid":"https://orcid.org/0000-0002-6343-9489","observed_orcids":["https://orcid.org/0000-0002-6343-9489"]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William Deal","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069272465","display_name":"Vesna Radisic","orcid":"https://orcid.org/0000-0001-9740-1836","observed_orcids":["https://orcid.org/0000-0001-9740-1836"]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vesna Radisic","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112353229","display_name":"Richard K. Lai","orcid":"https://orcid.org/0009-0002-9101-6675","observed_orcids":["https://orcid.org/0009-0002-9101-6675"]},"institutions":[{"id":"https://openalex.org/I2948394018","display_name":"Northrop Grumman (United States)","ror":"https://ror.org/05kewds18","country_code":"US","type":"company","lineage":["https://openalex.org/I2948394018"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard Lai","raw_affiliation_strings":["Northrop Grumman Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Northrop Grumman Corporation","institution_ids":["https://openalex.org/I2948394018"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"MA2008-02","issue":"34","first_page":"2242","last_page":"2242"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.6147000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.6147000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10752","display_name":"Terahertz technology and applications","score":0.0681999996304512,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.052799999713897705,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/submillimeter-wave","display_name":"submillimeter waves","score":0.9610000252723694},{"id":"https://openalex.org/keywords/mmic","display_name":"MMIC","score":0.8109999895095825},{"id":"https://openalex.org/keywords/monolithic-microwave-integrated-circuits","display_name":"monolithic microwave integrated circuits","score":0.7979999780654907}],"concepts":[{"id":"https://openalex.org/C45764600","wikidata":"https://www.wikidata.org/wiki/Q570342","display_name":"Extremely high frequency","level":2,"score":0.7078179121017456},{"id":"https://openalex.org/C109792285","wikidata":"https://www.wikidata.org/wiki/Q174789","display_name":"Millimeter","level":2,"score":0.4577994644641876},{"id":"https://openalex.org/C128450285","wikidata":"https://www.wikidata.org/wiki/Q1945036","display_name":"Monolithic microwave integrated circuit","level":4,"score":0.4169904589653015},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37538352608680725},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3752893805503845},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3127509355545044},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.27950170636177063},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2532691955566406},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.10848256945610046},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.09149143099784851},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.052715182304382324}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1149/ma2008-02/34/2242","doi":"https://doi.org/10.1149/ma2008-02/34/2242","is_oa":true,"landing_page_url":"https://doi.org/10.1149/ma2008-02/34/2242","pdf_url":"https://iopscience.iop.org/article/10.1149/MA2008-02/34/2242/pdf","source":{"id":"https://openalex.org/S4210168594","display_name":"ECS Meeting Abstracts","issn_l":"1091-8213","issn":["1091-8213","2151-2035","2151-2043","2152-8365"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Meeting Abstracts","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1149/ma2008-02/34/2242","doi":"https://doi.org/10.1149/ma2008-02/34/2242","is_oa":true,"landing_page_url":"https://doi.org/10.1149/ma2008-02/34/2242","pdf_url":"https://iopscience.iop.org/article/10.1149/MA2008-02/34/2242/pdf","source":{"id":"https://openalex.org/S4210168594","display_name":"ECS Meeting Abstracts","issn_l":"1091-8213","issn":["1091-8213","2151-2035","2151-2043","2152-8365"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Meeting Abstracts","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2265023621.pdf"},"referenced_works_count":1,"referenced_works":["https://openalex.org/W1990104550"],"related_works":["https://openalex.org/W2208265982","https://openalex.org/W3017000521","https://openalex.org/W3126323838","https://openalex.org/W3027162691","https://openalex.org/W211920822","https://openalex.org/W3145459435","https://openalex.org/W2958514328","https://openalex.org/W2336208902","https://openalex.org/W4250915106","https://openalex.org/W1634934472"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-11-08T12:12:28.789561","created_date":"2016-06-24T00:00:00"}