{"id":"https://openalex.org/W2201628125","doi":"https://doi.org/10.1007/s11837-003-0143-6","title":"Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu","display_name":"Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu","publication_year":2003,"publication_date":"2003-06-01","ids":{"openalex":"https://openalex.org/W2201628125","doi":"https://doi.org/10.1007/s11837-003-0143-6","mag":"2201628125"},"language":"en","primary_location":{"id":"doi:10.1007/s11837-003-0143-6","doi":"https://doi.org/10.1007/s11837-003-0143-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-003-0143-6","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111811639","display_name":"Sung K. Kang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung K. Kang","raw_affiliation_strings":["IBM T.J. Watson Research Center in Yorktown Heights, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center in Yorktown Heights, USA","institution_ids":["https://openalex.org/I4210114115"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109937570","display_name":"Da\u2010Yuan Shih","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Da-Yuan Shih","raw_affiliation_strings":["IBM T.J. Watson Research Center in Yorktown Heights, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center in Yorktown Heights, USA","institution_ids":["https://openalex.org/I4210114115"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045100852","display_name":"NY. Donald","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"NY. Donald","raw_affiliation_strings":["IBM Corporation in Endicott, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Endicott, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":null,"display_name":"W. Henderson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. Henderson","raw_affiliation_strings":["IBM Corporation in Endicott, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Endicott, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068522275","display_name":"Timothy Gosselin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy Gosselin","raw_affiliation_strings":["IBM Corporation in Endicott, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Endicott, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058119206","display_name":"Amit Sarkhel","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amit Sarkhel","raw_affiliation_strings":["IBM Corporation in Endicott, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Endicott, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009270209","display_name":"NY. Charles Goldsmith","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"NY. Charles Goldsmith","raw_affiliation_strings":["IBM Corporation in Hopewell Junction, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Hopewell Junction, NY","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055903416","display_name":"Karl J. Puttlitz","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Karl J. Puttlitz","raw_affiliation_strings":["IBM Corporation in Hopewell Junction, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation in Hopewell Junction, NY","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100861874","display_name":"Won Kyoung Choi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4399598381","display_name":"Samsung Advanced Institute of Technology (South Korea)","ror":"https://ror.org/04axnyp10","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Won Kyoung Choi","raw_affiliation_strings":["Samsung Advanced Institute of Technology, Suwon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Advanced Institute of Technology, Suwon, Korea","institution_ids":["https://openalex.org/I2250650973","https://openalex.org/I4399598381"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":3790,"currency":"USD","value_usd":3790},"apc_paid":null,"fwci":8.2738,"has_fulltext":false,"cited_by_count":172,"citation_normalized_percentile":{"value":0.97888157,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"55","issue":"6","first_page":"61","last_page":"65"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11087","display_name":"Solidification and crystal growth phenomena","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.9150000214576721},{"id":"https://openalex.org/keywords/solidification","display_name":"solidification","score":0.6019999980926514},{"id":"https://openalex.org/keywords/cu6sn5","display_name":"Cu6Sn5","score":0.8420000076293945},{"id":"https://openalex.org/keywords/beta-sn","display_name":"\u03b2-Sn","score":0.7440000176429749},{"id":"https://openalex.org/keywords/solder-joints","display_name":"solder joints","score":0.890999972820282},{"id":"https://openalex.org/keywords/solder-balls","display_name":"solder balls","score":0.6990000009536743},{"id":"https://openalex.org/keywords/fatigue-life","display_name":"fatigue life","score":0.6990000009536743},{"id":"https://openalex.org/keywords/mechanical-behavior","display_name":"mechanical behavior","score":0.5410000085830688}],"concepts":[{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.9339044094085693},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8660719990730286},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8230499625205994},{"id":"https://openalex.org/C64452783","wikidata":"https://www.wikidata.org/wiki/Q1524945","display_name":"Ternary operation","level":2,"score":0.7206898927688599},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6466487050056458},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.567861020565033},{"id":"https://openalex.org/C44280652","wikidata":"https://www.wikidata.org/wiki/Q104837","display_name":"Phase (matter)","level":2,"score":0.47089651226997375},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3236854672431946},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.24183350801467896},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.040308594703674316},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s11837-003-0143-6","doi":"https://doi.org/10.1007/s11837-003-0143-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11837-003-0143-6","pdf_url":null,"source":{"id":"https://openalex.org/S116826539","display_name":"JOM","issn_l":"0148-6608","issn":["0148-6608","1047-4838","1543-1851"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"JOM","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.620.3317","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.620.3317","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://iweb.tms.org/pbf/jom-0306-61.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1864720492","https://openalex.org/W1991153001","https://openalex.org/W2004929495","https://openalex.org/W2017959119","https://openalex.org/W2030123997","https://openalex.org/W2062476281","https://openalex.org/W2067486409","https://openalex.org/W2068860515","https://openalex.org/W2072084473","https://openalex.org/W2152651883","https://openalex.org/W2164925406"],"related_works":["https://openalex.org/W7101026123","https://openalex.org/W2152651883","https://openalex.org/W2167534208","https://openalex.org/W2051084601","https://openalex.org/W2153796397","https://openalex.org/W2092927805","https://openalex.org/W2024922418","https://openalex.org/W1971523374","https://openalex.org/W4323310189","https://openalex.org/W3082870925"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":7},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":7},{"year":2019,"cited_by_count":10},{"year":2018,"cited_by_count":6},{"year":2017,"cited_by_count":10},{"year":2016,"cited_by_count":9},{"year":2015,"cited_by_count":7},{"year":2014,"cited_by_count":11},{"year":2013,"cited_by_count":9},{"year":2012,"cited_by_count":4}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}