{"id":"https://openalex.org/W2201296148","doi":"https://doi.org/10.2172/902216","title":"Advancement in thermal interface materials for future high-performance electronic applications. Part 1.","display_name":"Advancement in thermal interface materials for future high-performance electronic applications. Part 1.","publication_year":2006,"publication_date":"2006-02-01","ids":{"openalex":"https://openalex.org/W2201296148","doi":"https://doi.org/10.2172/902216","mag":"2201296148"},"language":"en","primary_location":{"id":"doi:10.2172/902216","doi":"https://doi.org/10.2172/902216","is_oa":false,"landing_page_url":"https://doi.org/10.2172/902216","pdf_url":null,"source":{"id":"https://openalex.org/S4306402487","display_name":"OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I139351228","host_organization_name":"Office of Scientific and Technical Information","host_organization_lineage":["https://openalex.org/I139351228"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sandia National Laboratories (SNL)","raw_type":"report"},"volume":null,"type":"report","is_traditional":false,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://www.osti.gov/servlets/purl/902216","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017888145","display_name":"Blake E. Jakaboski","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Blake Jakaboski","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103884585","display_name":"Chung-Nin Channy Wong","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chung-Nin Wong","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003420811","display_name":"Dale L. Huber","orcid":"https://orcid.org/0000-0001-6872-8469","observed_orcids":["https://orcid.org/0000-0001-6872-8469"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dale Huber","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051539402","display_name":"Michael J. Rightley","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michael Rightley","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5111936614","display_name":"John A. Emerson","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"John Emerson","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":6,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9926999807357788,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9926999807357788,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.005400000140070915,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0005000000237487257,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-interface-materials","display_name":"thermal interface materials","score":1.0},{"id":"https://openalex.org/keywords/interfacial-thermal-conductivity","display_name":"interfacial thermal conductivity","score":0.8149999976158142},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"contact resistance","score":0.8149999976158142},{"id":"https://openalex.org/keywords/bond-line","display_name":"bondline","score":0.4869999885559082},{"id":"https://openalex.org/keywords/thermal-modeling","display_name":"thermal modeling","score":0.6819999814033508},{"id":"https://openalex.org/keywords/nanomaterials","display_name":"nanomaterials","score":0.6539999842643738},{"id":"https://openalex.org/keywords/microelectronics-packaging","display_name":"microelectronic packaging","score":0.8140000104904175},{"id":"https://openalex.org/keywords/thermal-insulation","display_name":"thermal insulation","score":0.6499999761581421},{"id":"https://openalex.org/keywords/electronic-cooling","display_name":"electronics cooling","score":0.44600000977516174}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.8486554622650146},{"id":"https://openalex.org/C200657195","wikidata":"https://www.wikidata.org/wiki/Q868947","display_name":"Thermal grease","level":3,"score":0.7320511937141418},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6201696991920471},{"id":"https://openalex.org/C151054161","wikidata":"https://www.wikidata.org/wiki/Q379385","display_name":"Microsystem","level":2,"score":0.6190575361251831},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5620574951171875},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5485535264015198},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.515898585319519},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.5143747925758362},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5031799674034119},{"id":"https://openalex.org/C142014798","wikidata":"https://www.wikidata.org/wiki/Q7783037","display_name":"Thermal contact","level":3,"score":0.4879853129386902},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.48178502917289734},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.47616785764694214},{"id":"https://openalex.org/C45058047","wikidata":"https://www.wikidata.org/wiki/Q4119687","display_name":"Thermal contact conductance","level":4,"score":0.4703027606010437},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4631955027580261},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.4606916904449463},{"id":"https://openalex.org/C2779478220","wikidata":"https://www.wikidata.org/wiki/Q3312622","display_name":"Thermal transfer","level":3,"score":0.4577942490577698},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4368378818035126},{"id":"https://openalex.org/C197424675","wikidata":"https://www.wikidata.org/wiki/Q1337802","display_name":"Thermal bridge","level":4,"score":0.4276091158390045},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.41511207818984985},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2002931535243988},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19875949621200562},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17334914207458496},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.15587496757507324},{"id":"https://openalex.org/C64839514","wikidata":"https://www.wikidata.org/wiki/Q918306","display_name":"Thermal insulation","level":3,"score":0.11126559972763062},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10156384110450745},{"id":"https://openalex.org/C6556556","wikidata":"https://www.wikidata.org/wiki/Q899239","display_name":"Contact angle","level":2,"score":0.10116180777549744},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.09439560770988464},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C54517805","wikidata":"https://www.wikidata.org/wiki/Q7456118","display_name":"Sessile drop technique","level":3,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.2172/902216","doi":"https://doi.org/10.2172/902216","is_oa":false,"landing_page_url":"https://doi.org/10.2172/902216","pdf_url":null,"source":{"id":"https://openalex.org/S4306402487","display_name":"OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I139351228","host_organization_name":"Office of Scientific and Technical Information","host_organization_lineage":["https://openalex.org/I139351228"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Sandia National Laboratories (SNL)","raw_type":"report"},{"id":"pmh:oai:osti.gov:902216","doi":null,"is_oa":true,"landing_page_url":"https://www.osti.gov/biblio/902216","pdf_url":"https://www.osti.gov/servlets/purl/902216","source":{"id":"https://openalex.org/S4306402487","display_name":"OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I139351228","host_organization_name":"Office of Scientific and Technical Information","host_organization_lineage":["https://openalex.org/I139351228"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},{"id":"pmh:info:ark/67531/metadc880829","doi":null,"is_oa":false,"landing_page_url":"https://digital.library.unt.edu/ark:/67531/metadc880829/","pdf_url":null,"source":{"id":"https://openalex.org/S4306400792","display_name":"University of North Texas Digital Library (University of North Texas)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I123534392","host_organization_name":"University of North Texas","host_organization_lineage":["https://openalex.org/I123534392"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Report"}],"best_oa_location":{"id":"pmh:oai:osti.gov:902216","doi":null,"is_oa":true,"landing_page_url":"https://www.osti.gov/biblio/902216","pdf_url":"https://www.osti.gov/servlets/purl/902216","source":{"id":"https://openalex.org/S4306402487","display_name":"OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I139351228","host_organization_name":"Office of Scientific and Technical Information","host_organization_lineage":["https://openalex.org/I139351228"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4943999946117401}],"study_designs":[],"awards":[{"id":"https://openalex.org/G194215011","display_name":null,"funder_award_id":"DE\u2013AC04\u201394AL85000","funder_id":"https://openalex.org/F4320306084","funder_display_name":"U.S. Department of Energy"},{"id":"https://openalex.org/G2075401295","display_name":null,"funder_award_id":"DE-AC04- 94AL85000","funder_id":"https://openalex.org/F4320332369","funder_display_name":"National Nuclear Security Administration"},{"id":"https://openalex.org/G3469581542","display_name":null,"funder_award_id":"94AL85000","funder_id":"https://openalex.org/F4320338291","funder_display_name":"Sandia National Laboratories"},{"id":"https://openalex.org/G351415096","display_name":null,"funder_award_id":"DEAC04-94AL85000","funder_id":"https://openalex.org/F4320338291","funder_display_name":"Sandia National Laboratories"},{"id":"https://openalex.org/G7318852158","display_name":null,"funder_award_id":"AC04-94AL85000","funder_id":"https://openalex.org/F4320338291","funder_display_name":"Sandia National Laboratories"},{"id":"https://openalex.org/G8456466421","display_name":null,"funder_award_id":"AC04-94AL85000","funder_id":"https://openalex.org/F4320306084","funder_display_name":"U.S. Department of Energy"}],"funders":[{"id":"https://openalex.org/F4320306084","display_name":"U.S. Department of Energy","ror":"https://ror.org/01bj3aw27"},{"id":"https://openalex.org/F4320332369","display_name":"National Nuclear Security Administration","ror":"https://ror.org/03sk1we31"},{"id":"https://openalex.org/F4320338291","display_name":"Sandia National Laboratories","ror":"https://ror.org/01apwpt12"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2201296148.pdf","grobid_xml":"https://content.openalex.org/works/W2201296148.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W101865677","https://openalex.org/W2101930907","https://openalex.org/W2286581539","https://openalex.org/W7124490446","https://openalex.org/W2148630703","https://openalex.org/W4402749190","https://openalex.org/W2605822643","https://openalex.org/W3154948443","https://openalex.org/W7116653777","https://openalex.org/W4297546687"],"abstract_inverted_index":{"As":[0],"electronic":[1],"assemblies":[2],"become":[3,15],"more":[4,16],"compact":[5],"and":[6,47,70,78,87,101,126,168],"increase":[7],"in":[8,55,83],"processing":[9],"bandwidth,":[10],"escalating":[11],"thermal":[12,29,37,125,139,157,179],"energy":[13],"has":[14,23],"difficult":[17],"to":[18,114,131],"manage.":[19],"The":[20,33,60],"major":[21,44],"limitation":[22],"been":[24],"nonmetallic":[25],"joining":[26],"using":[27,124],"poor":[28],"interface":[30],"materials":[31],"(TIM).":[32],"interfacial,":[34],"versus":[35],"bulk,":[36],"conductivity":[38,56],"of":[39,68,85,118,141,155,172,181,190],"an":[40,51],"adhesive":[41],"is":[42,104],"the":[43,79,116,138,147,156,170,188],"loss":[45,54],"mechanism":[46],"normally":[48],"accounts":[49],"for":[50,177],"order":[52],"magnitude":[53],"per":[57],"equivalent":[58],"thickness.":[59],"next":[61],"generation":[62],"TIM":[63],"requires":[64],"a":[65,107],"sophisticated":[66],"understanding":[67],"material":[69],"surface":[71],"sciences,":[72],"heat":[73,165],"transport":[74,158],"at":[75],"submicron":[76],"scales,":[77],"manufacturing":[80,98],"processes":[81],"used":[82],"packaging":[84],"microelectronics":[86],"other":[88],"target":[89],"applications.":[90],"Only":[91],"when":[92],"this":[93,185],"relationship":[94],"between":[95],"bond":[96,142],"line":[97],"processes,":[99],"structure,":[100],"contact":[102,149],"resistance":[103,175],"well-understood":[105],"on":[106,146],"fundamental":[108],"level":[109],"will":[110,186],"it":[111],"be":[112],"possible":[113],"advance":[115],"development":[117],"miniaturized":[119],"microsystems.":[120],"This":[121],"report":[122],"examines":[123],"squeeze-flow":[127],"modeling":[128],"as":[129,198],"approaches":[130],"formulate":[132],"TIMs":[133],"incorporating":[134],"nanoscience":[135],"concepts.":[136],"Understanding":[137],"behavior":[140],"lines":[143],"allows":[144,169],"focus":[145],"interfacial":[148],"region.":[150],"In":[151],"addition,":[152],"careful":[153],"study":[154],"across":[159],"these":[160],"interfaces":[161,176],"provides":[162],"greatly":[163],"augmented":[164],"transfer":[166],"paths":[167],"formulation":[171],"very":[173],"high":[174],"total":[178],"isolation":[180],"circuits.":[182],"For":[183],"example,":[184],"allow":[187],"integration":[189],"systems":[191],"that":[192],"exhibit":[193],"multiple":[194],"operational":[195],"temperatures,":[196],"such":[197],"cryogenically":[199],"cooled":[200],"detectors.":[201]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}