{"id":"https://openalex.org/W2195710941","doi":"https://doi.org/10.4071/isom-2015-wp51","title":"Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains","display_name":"Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains","publication_year":2015,"publication_date":"2015-10-01","ids":{"openalex":"https://openalex.org/W2195710941","doi":"https://doi.org/10.4071/isom-2015-wp51","mag":"2195710941"},"language":"en","primary_location":{"id":"doi:10.4071/isom-2015-wp51","doi":"https://doi.org/10.4071/isom-2015-wp51","is_oa":false,"landing_page_url":"https://doi.org/10.4071/isom-2015-wp51","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019808670","display_name":"Jan O. Gaudestad","orcid":"https://orcid.org/0009-0008-1777-3073","observed_orcids":["https://orcid.org/0009-0008-1777-3073"]},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Gaudestad","raw_affiliation_strings":["Neocera, 10000 Virginia Manor Road, Beltsville, MD, 20705, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Neocera, 10000 Virginia Manor Road, Beltsville, MD, 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075572496","display_name":"Antonio Orozco","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Orozco","raw_affiliation_strings":["Neocera, 10000 Virginia Manor Road, Beltsville, MD, 20705, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Neocera, 10000 Virginia Manor Road, Beltsville, MD, 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073310038","display_name":"Ingrid De Wolf","orcid":"https://orcid.org/0000-0003-3822-5953","observed_orcids":["https://orcid.org/0000-0003-3822-5953"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"I. De Wolf","raw_affiliation_strings":["*Also at Dept. MTM, Fac. Engineering, KULeuven, Leuven, Belgium","IMEC, Kapeldreef 75, B-3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"*Also at Dept. MTM, Fac. Engineering, KULeuven, Leuven, Belgium","institution_ids":["https://openalex.org/I99464096"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, B-3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113265276","display_name":"T. Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"T. Wang","raw_affiliation_strings":["IMEC, Kapeldreef 75, B-3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, B-3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027513846","display_name":"Tomas Webers","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"T. Webers","raw_affiliation_strings":["IMEC, Kapeldreef 75, B-3001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, B-3001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":null,"display_name":"R. Kelley","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Kelley","raw_affiliation_strings":["FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"T. Morrison","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Morrison","raw_affiliation_strings":["FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001735064","display_name":"Siddarth Madala","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. Madala","raw_affiliation_strings":["FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FEI, 5350 NE Dawson Creek Drive, Hillsboro, Oregon 97124, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6653,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.82942306,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"2015","issue":"1","first_page":"000469","last_page":"000473"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8184000253677368,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8184000253677368,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.17720000445842743,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.00139999995008111,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.8330000042915344},{"id":"https://openalex.org/keywords/3d-stacked-integrated-circuits","display_name":"3D stacked integrated circuits","score":0.6399999856948853},{"id":"https://openalex.org/keywords/daisy-chain","display_name":"daisy chain","score":0.6359999775886536},{"id":"https://openalex.org/keywords/magnetic-field-imaging","display_name":"magnetic field imaging","score":0.8180000185966492},{"id":"https://openalex.org/keywords/fault-isolation","display_name":"fault isolation","score":0.628000020980835},{"id":"https://openalex.org/keywords/physical-failure-analysis","display_name":"physical failure analysis","score":0.7559999823570251},{"id":"https://openalex.org/keywords/root-cause-analysis","display_name":"root cause analysis","score":0.6209999918937683},{"id":"https://openalex.org/keywords/cross-sectioning","display_name":"cross-sectioning","score":0.42399999499320984}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7106655240058899},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.6611030697822571},{"id":"https://openalex.org/C161866238","wikidata":"https://www.wikidata.org/wiki/Q258563","display_name":"Focused ion beam","level":3,"score":0.6536800265312195},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.4780607521533966},{"id":"https://openalex.org/C168834538","wikidata":"https://www.wikidata.org/wiki/Q3705329","display_name":"Beam (structure)","level":2,"score":0.4684567451477051},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3626704812049866},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17610982060432434},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14893057942390442},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.14436107873916626},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.13537323474884033},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/isom-2015-wp51","doi":"https://doi.org/10.4071/isom-2015-wp51","is_oa":false,"landing_page_url":"https://doi.org/10.4071/isom-2015-wp51","pdf_url":null,"source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Symposium on Microelectronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2059098943","https://openalex.org/W2068019452","https://openalex.org/W2118898957","https://openalex.org/W2149491662","https://openalex.org/W2171372159","https://openalex.org/W2333211644","https://openalex.org/W2541074437","https://openalex.org/W3113538835","https://openalex.org/W3116959984","https://openalex.org/W6702888321"],"related_works":["https://openalex.org/W2254229503","https://openalex.org/W2586237351","https://openalex.org/W2461117496","https://openalex.org/W2923381279","https://openalex.org/W3096297987","https://openalex.org/W2188116662","https://openalex.org/W2287331857","https://openalex.org/W2463797948","https://openalex.org/W1998402992","https://openalex.org/W2097491336"],"abstract_inverted_index":{"In":[0],"this":[1],"paper":[2],"we":[3],"show":[4],"an":[5],"efficient":[6,25],"workflow":[7],"that":[8,137],"combines":[9],"Magnetic":[10],"Field":[11],"Imaging":[12],"(MFI)":[13],"and":[14,24,28,75,90,97,112,127],"Dual":[15],"Beam":[16,20,146],"Plasma":[17],"Focused":[18,144],"Ion":[19,145],"(DB-PFIB)":[21],"for":[22,43,87],"fast":[23],"Fault":[26,45],"Isolation":[27,46],"root":[29],"cause":[30],"analysis":[31,92],"in":[32,51,60,120,129],"2.5/3D":[33,52],"devices.":[34],"The":[35],"work":[36],"proves":[37],"MFI":[38],"is":[39,110],"the":[40,67,72,94,102,108],"best":[41],"method":[42],"Electric":[44],"(EFI)":[47],"of":[48,93,101,134],"short":[49],"failures":[50],"Through":[53],"Silicon":[54],"Via":[55],"(TSV)":[56],"triple":[57],"stacked":[58],"devices":[59],"a":[61,82,106,130,141],"true":[62],"non-destructive":[63],"way":[64],"by":[65],"imaging":[66,100],"current":[68],"path.":[69],"To":[70],"confirm":[71],"failing":[73],"locations":[74],"to":[76],"do":[77],"Physical":[78],"Failure":[79],"Analysis":[80],"(PFA),":[81],"DB-PFIB":[83],"system":[84],"was":[85],"used":[86],"cross":[88],"sectioning":[89],"volume":[91],"TSV":[95],"structures":[96],"high":[98],"resolution":[99],"identified":[103],"defects.":[104],"With":[105],"DB-PFIB,":[107],"fault":[109],"exposed":[111],"analyzed":[113],"without":[114],"any":[115],"sample":[116],"prep":[117],"artifacts":[118],"seen":[119],"mechanical":[121],"polishing":[122],"or":[123],"laser":[124],"preparation":[125],"techniques":[126],"done":[128],"considerably":[131],"shorter":[132],"amount":[133],"time":[135],"than":[136],"required":[138],"when":[139],"using":[140],"traditional":[142],"Gallium":[143],"(FIB).":[147]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}