{"id":"https://openalex.org/W2188901868","doi":null,"title":"Strength Improvement for the GaAs Thin Wafer","display_name":"Strength Improvement for the GaAs Thin Wafer","publication_year":2003,"publication_date":"2003-01-01","ids":{"openalex":"https://openalex.org/W2188901868","mag":"2188901868"},"language":"en","primary_location":{"id":"pmh:oai:CiteSeerX.psu:10.1.1.526.6587","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.526.6587","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.gaasmantech.org/Digests/2003/2003PDF/8-15.pdf","raw_type":"text"},"volume":null,"type":"article","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Hiep Pham","orcid":"https://orcid.org/0000-0001-7382-5319","observed_orcids":["https://orcid.org/0000-0001-7382-5319"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hiep Pham","raw_affiliation_strings":[],"raw_orcid":"https://orcid.org/0000-0001-7382-5319","affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061437152","display_name":"Chang-Hwang Hua","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chang-Hwang Hua","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5058959244","display_name":"Qiuliang Luo","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Qiuliang Luo","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.31864385,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/gallium-arsenide","display_name":"GaAs","score":0.8109999895095825},{"id":"https://openalex.org/keywords/gaas-wafers","display_name":"GaAs wafers","score":0.7730000019073486},{"id":"https://openalex.org/keywords/wafer-thinning","display_name":"wafer thinning","score":0.949999988079071},{"id":"https://openalex.org/keywords/wafer-breakage","display_name":"wafer breakage","score":0.8539999723434448},{"id":"https://openalex.org/keywords/mechanical-stress","display_name":"mechanical stress","score":0.7120000123977661},{"id":"https://openalex.org/keywords/wet-etching","display_name":"wet etching","score":0.9150000214576721},{"id":"https://openalex.org/keywords/surface-damage-removal","display_name":"surface damage removal","score":0.7440000176429749},{"id":"https://openalex.org/keywords/wafer-polishing","display_name":"wafer polishing","score":0.7110000252723694},{"id":"https://openalex.org/keywords/grinding","display_name":"grinding","score":0.4690000116825104}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.9106271266937256},{"id":"https://openalex.org/C510052550","wikidata":"https://www.wikidata.org/wiki/Q422819","display_name":"Gallium arsenide","level":2,"score":0.6907980442047119},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.654461145401001},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.6541131734848022},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6465181708335876},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6339908838272095},{"id":"https://openalex.org/C2781353100","wikidata":"https://www.wikidata.org/wiki/Q1266974","display_name":"Thinning","level":2,"score":0.5575799345970154},{"id":"https://openalex.org/C2779015675","wikidata":"https://www.wikidata.org/wiki/Q92796261","display_name":"Breakage","level":2,"score":0.46873435378074646},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.45721670985221863},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.43156829476356506},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.41551828384399414},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.3466881513595581},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2757934331893921},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2682094871997833},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"pmh:oai:CiteSeerX.psu:10.1.1.526.6587","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.526.6587","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.gaasmantech.org/Digests/2003/2003PDF/8-15.pdf","raw_type":"text"},{"id":"mag:2188901868","doi":null,"is_oa":false,"landing_page_url":"https://gaas.org/Digests/2003/2003PDF/8-15.pdf","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W652953972"],"related_works":["https://openalex.org/W2187829517","https://openalex.org/W4237013305","https://openalex.org/W2051346412","https://openalex.org/W1533271936","https://openalex.org/W1951094281","https://openalex.org/W2017178859","https://openalex.org/W2068410207","https://openalex.org/W2009461806","https://openalex.org/W2086559679","https://openalex.org/W1985098810"],"abstract_inverted_index":{"In":[0],"recent":[1],"years,":[2],"the":[3,7,20,34,47,52,61,79,86,96],"pursuit":[4],"of":[5,28,63],"improving":[6],"wafer":[8,24,29,35,75,89],"strength":[9,30,62],"after":[10,74],"thinning":[11,48,90],"step":[12,73],"has":[13],"been":[14],"an":[15],"on":[16],"going":[17],"issue":[18],"for":[19],"Gallium":[21],"Arsenide":[22],"(GaAs)":[23],"manufacturing.":[25],"The":[26],"improvement":[27,87],"will":[31,84],"significantly":[32],"decrease":[33],"breakage":[36],"during":[37],"demounting":[38],"and":[39,91],"cleaning.":[40],"It":[41],"is":[42,67],"very":[43],"critical":[44],"to":[45,50,59,68,77],"optimize":[46],"process":[49],"minimize":[51],"mechanical":[53],"stress":[54],"sources.":[55],"One":[56],"obvious":[57],"way":[58],"improve":[60],"thin":[64],"GaAs":[65],"wafers":[66],"apply":[69],"a":[70],"wet":[71],"etching":[72],"grinding":[76],"remove":[78],"surface":[80],"damage.":[81],"This":[82],"paper":[83],"discuss":[85],"in":[88],"polishing":[92],"processes":[93],"developed":[94],"at":[95],"Skyworks":[97],"facilities.":[98]},"counts_by_year":[],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2016-06-24T00:00:00"}