{"id":"https://openalex.org/W2180820161","doi":"https://doi.org/10.1109/jmems.2015.2463096","title":"Ultraviolet-Assisted Release of Microelectromechanical Systems From Polyimide Sacrificial Layer","display_name":"Ultraviolet-Assisted Release of Microelectromechanical Systems From Polyimide Sacrificial Layer","publication_year":2015,"publication_date":"2015-08-18","ids":{"openalex":"https://openalex.org/W2180820161","doi":"https://doi.org/10.1109/jmems.2015.2463096","mag":"2180820161"},"language":"en","primary_location":{"id":"doi:10.1109/jmems.2015.2463096","doi":"https://doi.org/10.1109/jmems.2015.2463096","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jmems.2015.2463096","pdf_url":null,"source":{"id":"https://openalex.org/S4210187724","display_name":"Journal of Microelectromechanical Systems","issn_l":"1057-7157","issn":["1057-7157","1941-0158"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Microelectromechanical Systems","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://stars.library.ucf.edu/scopus2015/504","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073926554","display_name":"Javaneh Boroumand","orcid":"https://orcid.org/0000-0001-5866-7404","observed_orcids":["https://orcid.org/0000-0001-5866-7404"]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Javaneh Boroumand Azad","raw_affiliation_strings":["Department of Physics, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Physics, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063390500","display_name":"Imen Rezadad","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Imen Rezadad","raw_affiliation_strings":["Department of Physics, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Physics, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111640625","display_name":"Robert E. Peale","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert E. Peale","raw_affiliation_strings":["Department of Physics, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Physics, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014870632","display_name":"Justin W. Cleary","orcid":"https://orcid.org/0000-0001-5853-9584","observed_orcids":["https://orcid.org/0000-0001-5853-9584"]},"institutions":[{"id":"https://openalex.org/I1280414376","display_name":"United States Air Force Research Laboratory","ror":"https://ror.org/02e2egq70","country_code":"US","type":"facility","lineage":["https://openalex.org/I1280414376","https://openalex.org/I1330347796","https://openalex.org/I4210102105","https://openalex.org/I4389425425"]},{"id":"https://openalex.org/I2799950915","display_name":"Wright-Patterson Air Force Base","ror":"https://ror.org/0097e1k27","country_code":"US","type":"other","lineage":["https://openalex.org/I1330347796","https://openalex.org/I2799950915","https://openalex.org/I4210089612","https://openalex.org/I4210102105"]},{"id":"https://openalex.org/I4388482690","display_name":"Wright Laboratory","ror":"https://ror.org/03jvtcb24","country_code":"US","type":"facility","lineage":["https://openalex.org/I1280414376","https://openalex.org/I1330347796","https://openalex.org/I4210102105","https://openalex.org/I4388482690","https://openalex.org/I4389425425"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Justin W. Cleary","raw_affiliation_strings":["Wright-Patterson Air Force Base, Air Force Research Laboratory, Dayton, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Wright-Patterson Air Force Base, Air Force Research Laboratory, Dayton, OH, USA","institution_ids":["https://openalex.org/I1280414376","https://openalex.org/I2799950915","https://openalex.org/I4388482690"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5067599189","display_name":"Kurt G. Eyink","orcid":"https://orcid.org/0000-0002-8503-620X","observed_orcids":["https://orcid.org/0000-0002-8503-620X"]},"institutions":[{"id":"https://openalex.org/I1280414376","display_name":"United States Air Force Research Laboratory","ror":"https://ror.org/02e2egq70","country_code":"US","type":"facility","lineage":["https://openalex.org/I1280414376","https://openalex.org/I1330347796","https://openalex.org/I4210102105","https://openalex.org/I4389425425"]},{"id":"https://openalex.org/I2799950915","display_name":"Wright-Patterson Air Force Base","ror":"https://ror.org/0097e1k27","country_code":"US","type":"other","lineage":["https://openalex.org/I1330347796","https://openalex.org/I2799950915","https://openalex.org/I4210089612","https://openalex.org/I4210102105"]},{"id":"https://openalex.org/I4388482690","display_name":"Wright Laboratory","ror":"https://ror.org/03jvtcb24","country_code":"US","type":"facility","lineage":["https://openalex.org/I1280414376","https://openalex.org/I1330347796","https://openalex.org/I4210102105","https://openalex.org/I4388482690","https://openalex.org/I4389425425"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kurt Eyink","raw_affiliation_strings":["Wright-Patterson Air Force Base, Air Force Research Laboratory, Dayton, OH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Wright-Patterson Air Force Base, Air Force Research Laboratory, Dayton, OH, USA","institution_ids":["https://openalex.org/I1280414376","https://openalex.org/I2799950915","https://openalex.org/I4388482690"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.1607,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.59829743,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"24","issue":"6","first_page":"2027","last_page":"2032"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mems-release","display_name":"MEMS release","score":0.9020000100135803},{"id":"https://openalex.org/keywords/etch-rate","display_name":"etch rate","score":0.640999972820282},{"id":"https://openalex.org/keywords/optical-constants","display_name":"optical constants","score":0.7919999957084656},{"id":"https://openalex.org/keywords/wet-etching","display_name":"wet etching","score":0.8370000123977661},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"reactive ion etching","score":0.9300000071525574},{"id":"https://openalex.org/keywords/heat-hardening","display_name":"thermal hardening","score":0.42800000309944153}],"concepts":[{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.9430533647537231},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8198557496070862},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7523906230926514},{"id":"https://openalex.org/C2776798109","wikidata":"https://www.wikidata.org/wiki/Q11391","display_name":"Ultraviolet","level":2,"score":0.7250111699104309},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6851406693458557},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5910664200782776},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5560575127601624},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.550446629524231},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5056917667388916},{"id":"https://openalex.org/C141354745","wikidata":"https://www.wikidata.org/wiki/Q17227","display_name":"Cantilever","level":2,"score":0.47973838448524475},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.4451026916503906},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.42782458662986755},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4270518124103546},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.42242228984832764},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3514212965965271},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/jmems.2015.2463096","doi":"https://doi.org/10.1109/jmems.2015.2463096","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jmems.2015.2463096","pdf_url":null,"source":{"id":"https://openalex.org/S4210187724","display_name":"Journal of Microelectromechanical Systems","issn_l":"1057-7157","issn":["1057-7157","1941-0158"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Microelectromechanical Systems","raw_type":"journal-article"},{"id":"pmh:oai:stars.library.ucf.edu:scopus2015-1503","doi":null,"is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/scopus2015/504","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","vabb-shw"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Scopus Export 2015-2019","raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:stars.library.ucf.edu:scopus2015-1503","doi":null,"is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/scopus2015/504","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","vabb-shw"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Scopus Export 2015-2019","raw_type":"text"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320338279","display_name":"Air Force Office of Scientific Research","ror":"https://ror.org/011e9bt93"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":46,"referenced_works":["https://openalex.org/W1505667826","https://openalex.org/W1552556231","https://openalex.org/W1573193244","https://openalex.org/W1785774197","https://openalex.org/W1852437800","https://openalex.org/W1979975611","https://openalex.org/W1983256684","https://openalex.org/W1985841158","https://openalex.org/W1994339459","https://openalex.org/W1995432159","https://openalex.org/W2011679258","https://openalex.org/W2011835910","https://openalex.org/W2020091176","https://openalex.org/W2033041552","https://openalex.org/W2037504181","https://openalex.org/W2041298953","https://openalex.org/W2047257331","https://openalex.org/W2055993378","https://openalex.org/W2058379753","https://openalex.org/W2058681251","https://openalex.org/W2061887527","https://openalex.org/W2062614615","https://openalex.org/W2067409787","https://openalex.org/W2073424008","https://openalex.org/W2078543349","https://openalex.org/W2083952291","https://openalex.org/W2095899914","https://openalex.org/W2107151940","https://openalex.org/W2107303399","https://openalex.org/W2113093187","https://openalex.org/W2114978189","https://openalex.org/W2121047400","https://openalex.org/W2126685585","https://openalex.org/W2128566844","https://openalex.org/W2130300793","https://openalex.org/W2142339367","https://openalex.org/W2144266159","https://openalex.org/W2152987229","https://openalex.org/W2154700838","https://openalex.org/W2155721926","https://openalex.org/W2165596839","https://openalex.org/W2169357815","https://openalex.org/W2294914853","https://openalex.org/W2328303680","https://openalex.org/W3117551632","https://openalex.org/W7061331928"],"related_works":["https://openalex.org/W2037504181","https://openalex.org/W315017491","https://openalex.org/W2159454779","https://openalex.org/W2083952291","https://openalex.org/W2116539747","https://openalex.org/W2372397764","https://openalex.org/W2955911712","https://openalex.org/W1985841158","https://openalex.org/W2353519322","https://openalex.org/W2011679258"],"abstract_inverted_index":{"Process":[0],"heating":[1],"of":[2,78,83,118,140,153,159,167],"microelectromechanical":[3],"systems":[4],"(MEMSs)":[5],"devices":[6],"hardens":[7],"polyimide":[8,43,80],"sacrificial":[9,48,120],"layers,":[10],"complicating":[11],"the":[12,55,74,84,119,138,157,165],"final":[13],"release":[14,166],"and":[15,66,144],"lowering":[16],"yield":[17],"for":[18],"delicate":[19,88],"structures.":[20,90],"This":[21],"paper":[22],"reports":[23],"ultraviolet":[24],"(UV)-assisted":[25],"release,":[26],"which":[27,123],"is":[28,93,110],"demonstrated":[29,163],"on":[30],"an":[31,36],"MEMS":[32,89,169],"cantilever":[33],"fabricated":[34],"by":[35],"eight-mask":[37],"photolithographic":[38],"process.":[39],"A":[40],"commercial":[41],"co-developable":[42],"ProLift":[44],"100":[45],"(Brewer":[46],"Science)":[47],"layer":[49,121],"was":[50],"used.":[51],"The":[52,91,106],"process":[53],"subjects":[54],"device":[56],"to":[57,86,103,114,126,136],"multiple":[58],"heat":[59],"treatment":[60],"steps.":[61],"Both":[62],"wet":[63],"chemical":[64],"etching":[65,70],"dry":[67,145],"reactive":[68],"ion":[69],"were":[71,124,134,148,162],"explored.":[72],"During":[73],"former,":[75],"large":[76],"sheets":[77],"hardened":[79],"floated":[81],"free":[82],"substrate":[85],"damage":[87],"latter":[92],"typically":[94],"slow,":[95],"so":[96],"that":[97],"grass":[98],"appears":[99],"during":[100,130,164],"long":[101],"exposures":[102],"plasma":[104],"ions.":[105],"solution":[107],"reported":[108],"here":[109],"UV":[111,141,154,160],"exposure":[112],"prior":[113],"release.":[115],"Optical":[116],"constants":[117],"material,":[122],"baked":[125],"simulate":[127],"thermal":[128],"histories":[129],"various":[131],"fabrication":[132],"steps,":[133],"measured":[135,149],"understand":[137],"effectiveness":[139],"exposure.":[142],"Wet":[143],"etch":[146],"rates":[147],"as":[150],"a":[151],"function":[152],"dose.":[155],"Finally,":[156],"advantages":[158],"pretreatment":[161],"actual":[168],"cantilevers.":[170]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}