{"id":"https://openalex.org/W2175390504","doi":"https://doi.org/10.1109/33.62529","title":"The impact of packaging on the reliability of flip-chip solder bonded devices","display_name":"The impact of packaging on the reliability of flip-chip solder bonded devices","publication_year":1990,"publication_date":"1990-01-01","ids":{"openalex":"https://openalex.org/W2175390504","doi":"https://doi.org/10.1109/33.62529","mag":"2175390504"},"language":"en","primary_location":{"id":"doi:10.1109/33.62529","doi":"https://doi.org/10.1109/33.62529","is_oa":false,"landing_page_url":"https://doi.org/10.1109/33.62529","pdf_url":null,"source":{"id":"https://openalex.org/S3582665","display_name":"IEEE Transactions on Components Hybrids and Manufacturing Technology","issn_l":"0148-6411","issn":["0148-6411","1558-3082"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Hybrids, and Manufacturing Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082609493","display_name":"K.J. Lodge","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K.J. Lodge","raw_affiliation_strings":["Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086801546","display_name":"D.J. Pedder","orcid":"https://orcid.org/0000-0002-5194-4082","observed_orcids":["https://orcid.org/0000-0002-5194-4082"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D.J. Pedder","raw_affiliation_strings":["Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.3395,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.86030884,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"13","issue":"4","first_page":"847","last_page":"855"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip-solder-joints","display_name":"flip-chip solder joints","score":0.7950000166893005},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.8970000147819519},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.5590000152587891},{"id":"https://openalex.org/keywords/hermetic-packaging","display_name":"hermetic packaging","score":0.7310000061988831},{"id":"https://openalex.org/keywords/fatigue-failure","display_name":"fatigue failure","score":0.8809999823570251}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.839478611946106},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.756725549697876},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.671476423740387},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.6658563017845154},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6403211355209351},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5379536747932434},{"id":"https://openalex.org/C33574316","wikidata":"https://www.wikidata.org/wiki/Q917260","display_name":"Passivation","level":3,"score":0.5219137668609619},{"id":"https://openalex.org/C125619702","wikidata":"https://www.wikidata.org/wiki/Q7783038","display_name":"Thermal copper pillar bump","level":5,"score":0.48447442054748535},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4479415714740753},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.41727495193481445},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3893871307373047},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3280182480812073},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23663371801376343},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23100224137306213},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.20332416892051697},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15057846903800964},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.14939814805984497},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/33.62529","doi":"https://doi.org/10.1109/33.62529","is_oa":false,"landing_page_url":"https://doi.org/10.1109/33.62529","pdf_url":null,"source":{"id":"https://openalex.org/S3582665","display_name":"IEEE Transactions on Components Hybrids and Manufacturing Technology","issn_l":"0148-6411","issn":["0148-6411","1558-3082"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Components, Hybrids, and Manufacturing Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4943999946117401,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1511002212","https://openalex.org/W1552058488","https://openalex.org/W1834741233","https://openalex.org/W1974177187","https://openalex.org/W2011666675","https://openalex.org/W2015153513","https://openalex.org/W2026793411","https://openalex.org/W2030949590","https://openalex.org/W2031304507","https://openalex.org/W2044005881","https://openalex.org/W2044335829","https://openalex.org/W2083385727","https://openalex.org/W2086405230","https://openalex.org/W2114416422","https://openalex.org/W2122965933","https://openalex.org/W2131722625","https://openalex.org/W2150302928","https://openalex.org/W2151712893","https://openalex.org/W2162226124","https://openalex.org/W3120910154"],"related_works":["https://openalex.org/W2097713900","https://openalex.org/W2013281444","https://openalex.org/W591489555","https://openalex.org/W6999276386","https://openalex.org/W4317381708","https://openalex.org/W2170396292","https://openalex.org/W4236182026","https://openalex.org/W2086209657","https://openalex.org/W2151712893","https://openalex.org/W1993449951"],"abstract_inverted_index":{"An":[0],"assessment":[1],"of":[2,51,112],"flip-chip":[3,20,75],"solder":[4,53,76],"joint":[5],"reliability":[6],"for":[7],"a":[8,14,23],"hybrid":[9],"device":[10,29,52],"assembly":[11,30],"in":[12,65,90,100],"which":[13],"zirconium-titanium-stannate":[15],"dielectric":[16],"ceramic":[17],"chip":[18,57],"is":[19,26],"bonded":[21],"to":[22,33,40,45,105],"silicon":[24],"circuit":[25],"presented.":[27],"The":[28,71],"was":[31],"subjected":[32],"severe":[34],"thermal":[35],"cycling":[36],"testing,":[37],"involving":[38],"up":[39],"2000":[41],"cycles":[42],"from":[43],"-55":[44],"+125":[46],"degrees":[47],"C.":[48],"A":[49],"range":[50],"bond":[54],"geometries":[55],"and":[56,68,115],"passivation":[58],"structures":[59],"were":[60,93,98],"investigated,":[61],"with":[62,85],"devices":[63,91],"packaged":[64,102],"both":[66],"hermetic":[67],"nonhermetic":[69],"enclosures.":[70],"results":[72],"show":[73],"that":[74,92],"bonds":[77],"can":[78],"be":[79],"extremely":[80],"reliable":[81],"under":[82],"such":[83],"tests,":[84],"no":[86],"failures":[87,97],"being":[88],"detected":[89],"hermetically":[94],"packaged.":[95],"Fatigue":[96],"observed":[99],"nonhermetically":[101],"devices.":[103],"Extrapolation":[104],"likely":[106],"operating":[107],"conditions":[108],"predicts":[109],"field":[110],"lifetimes":[111],"between":[113],"15":[114],"300":[116],"years.>":[117]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}