{"id":"https://openalex.org/W2171907321","doi":"https://doi.org/10.1109/eptc.2009.5416563","title":"Compact thermal modeling of hot spots in advanced 3D-stacked ICs","display_name":"Compact thermal modeling of hot spots in advanced 3D-stacked ICs","publication_year":2009,"publication_date":"2009-12-01","ids":{"openalex":"https://openalex.org/W2171907321","doi":"https://doi.org/10.1109/eptc.2009.5416563","mag":"2171907321"},"language":"en","primary_location":{"id":"doi:10.1109/eptc.2009.5416563","doi":"https://doi.org/10.1109/eptc.2009.5416563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2009.5416563","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 11th Electronics Packaging Technology Conference","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076713285","display_name":"Cristina Torregiani","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"C. Torregiani","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049476718","display_name":"Herman Oprins","orcid":"https://orcid.org/0000-0003-0680-4969","observed_orcids":["https://orcid.org/0000-0003-0680-4969"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"H. Oprins","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026709733","display_name":"Bart Vandevelde","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"B. Vandevelde","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X","observed_orcids":["https://orcid.org/0000-0002-3096-050X"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073310038","display_name":"Ingrid De Wolf","orcid":"https://orcid.org/0000-0003-3822-5953","observed_orcids":["https://orcid.org/0000-0003-3822-5953"]},"institutions":[{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"I. De Wolf","raw_affiliation_strings":["Department MTM, Katholieke Universiteit Leuven, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department MTM, Katholieke Universiteit Leuven, Leuven, Belgium","institution_ids":["https://openalex.org/I99464096"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":7.1827,"has_fulltext":false,"cited_by_count":37,"citation_normalized_percentile":{"value":0.98177722,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"131","last_page":"136"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-stacked-integrated-circuits","display_name":"3D stacked integrated circuits","score":0.8240000009536743},{"id":"https://openalex.org/keywords/hot-spots","display_name":"hot spots","score":0.8759999871253967},{"id":"https://openalex.org/keywords/temperature-distribution","display_name":"temperature distribution","score":0.8050000071525574},{"id":"https://openalex.org/keywords/non-uniform-heat-source","display_name":"non-uniform heat source","score":0.9110000133514404},{"id":"https://openalex.org/keywords/package-thermal-resistance","display_name":"package thermal resistance","score":0.5809999704360962},{"id":"https://openalex.org/keywords/thermal-management","display_name":"thermal management","score":0.6679999828338623}],"concepts":[{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.8308403491973877},{"id":"https://openalex.org/C165464430","wikidata":"https://www.wikidata.org/wiki/Q1570441","display_name":"Parameterized complexity","level":2,"score":0.5995826721191406},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5973484516143799},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.594068169593811},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.5640822649002075},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5353764891624451},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4485739469528198},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.41282418370246887},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.40807703137397766},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38314780592918396},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3817339837551117},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.354775071144104},{"id":"https://openalex.org/C459310","wikidata":"https://www.wikidata.org/wiki/Q117801","display_name":"Computational science","level":1,"score":0.352740079164505},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.21424910426139832},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1642749011516571},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.15897983312606812},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14624279737472534},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09922963380813599},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09830120205879211},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/eptc.2009.5416563","doi":"https://doi.org/10.1109/eptc.2009.5416563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2009.5416563","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 11th Electronics Packaging Technology Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.4000000059604645,"id":"https://metadata.un.org/sdg/7"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1971322722","https://openalex.org/W2115505753","https://openalex.org/W2119748286","https://openalex.org/W2120618682","https://openalex.org/W2126157369","https://openalex.org/W2132238857","https://openalex.org/W2153868137","https://openalex.org/W2540437384","https://openalex.org/W4285719527","https://openalex.org/W6677037318","https://openalex.org/W6728716478"],"related_works":["https://openalex.org/W2132238857","https://openalex.org/W2136165389","https://openalex.org/W2115505753","https://openalex.org/W1994756870","https://openalex.org/W1826768222","https://openalex.org/W2120894943","https://openalex.org/W3135941719","https://openalex.org/W2021687783","https://openalex.org/W3034596539","https://openalex.org/W1594107542"],"abstract_inverted_index":{"This":[0,37],"paper":[1],"presents":[2],"a":[3,10,55,87,124,139,150,155],"new":[4],"generic":[5,57],"methodology":[6],"used":[7,137],"to":[8,24,30,41,51,77,93,148],"determine":[9],"parameterized":[11],"compact":[12],"thermal":[13,27,111,158],"model":[14],"for":[15,138,142,157],"3-D":[16,151],"stacked":[17,46],"integrated":[18],"circuits":[19],"(3D-SIC).":[20],"The":[21],"method":[22],"allows":[23,92],"calculate":[25],"the":[26,34,53,95,99,107,110,114,118,121,143],"distribution":[28,97],"due":[29],"hot":[31],"spots":[32],"in":[33,98],"die":[35,152],"stack.":[36],"approach":[38,73],"is":[39,75,130],"applied":[40],"different":[42],"case":[43],"studies":[44],"of":[45,65,113,120,123],"dies":[47,100],"configurations.":[48],"In":[49],"order":[50],"demonstrate":[52],"method,":[54],"fully":[56],"non-uniform":[58],"heat":[59],"sources":[60],"\u00bfgrid\u00bf":[61],"with":[62,86,101],"grid":[63],"size":[64],"100":[66],"\u00bfm":[67],"has":[68],"been":[69],"considered.":[70],"With":[71],"this":[72,133],"it":[74],"possible":[76],"derive":[78],"an":[79],"easy-to-use,":[80],"fast":[81,140],"prediction":[82],"tool":[83,134],"that,":[84],"together":[85],"user":[88],"friendly":[89],"graphical":[90],"interface,":[91],"obtain":[94],"temperature":[96],"good":[102],"accuracy.":[103],"Parameters":[104],"such":[105],"as":[106],"structure":[108],"geometry,":[109],"properties":[112],"materials":[115],"involved":[116],"and":[117],"effects":[119],"presence":[122],"package":[125],"resistance":[126],"are":[127],"investigated.":[128],"It":[129],"demonstrated":[131],"that":[132],"can":[135],"be":[136],"optimization":[141],"structural":[144],"parameters,":[145],"thus":[146],"helping":[147],"design":[149],"stack":[153],"when":[154],"need":[156],"management":[159],"arises.":[160]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2013,"cited_by_count":7},{"year":2012,"cited_by_count":3}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2016-06-24T00:00:00"}