{"id":"https://openalex.org/W2167562829","doi":"https://doi.org/10.1109/stherm.1999.762422","title":"A computational study of two phase jet impingement cooling of an electronic chip","display_name":"A computational study of two phase jet impingement cooling of an electronic chip","publication_year":2003,"publication_date":"2003-01-20","ids":{"openalex":"https://openalex.org/W2167562829","doi":"https://doi.org/10.1109/stherm.1999.762422","mag":"2167562829"},"language":"en","primary_location":{"id":"doi:10.1109/stherm.1999.762422","doi":"https://doi.org/10.1109/stherm.1999.762422","is_oa":false,"landing_page_url":"https://doi.org/10.1109/stherm.1999.762422","pdf_url":null,"source":{"id":"https://openalex.org/S4210186239","display_name":"Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings","issn_l":"1065-2221","issn":["1065-2221","2577-1000"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100391555","display_name":"Dong Wang","orcid":"https://orcid.org/0000-0003-3649-1078","observed_orcids":["https://orcid.org/0000-0003-3649-1078"]},"institutions":[{"id":"https://openalex.org/I4210153148","display_name":"CFD Research Corporation (United States)","ror":"https://ror.org/04wd31514","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153148"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Wang","raw_affiliation_strings":["CFD Research Corporation, Huntsville, AL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CFD Research Corporation, Huntsville, AL, USA","institution_ids":["https://openalex.org/I4210153148"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035494726","display_name":"Enchao C. Yu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210153148","display_name":"CFD Research Corporation (United States)","ror":"https://ror.org/04wd31514","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153148"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E. Yu","raw_affiliation_strings":["CFD Research Corporation, Huntsville, AL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CFD Research Corporation, Huntsville, AL, USA","institution_ids":["https://openalex.org/I4210153148"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031116518","display_name":"Andrzej J. Przekwas","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210153148","display_name":"CFD Research Corporation (United States)","ror":"https://ror.org/04wd31514","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153148"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Przekwas","raw_affiliation_strings":["CFD Research Corporation, Huntsville, AL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CFD Research Corporation, Huntsville, AL, USA","institution_ids":["https://openalex.org/I4210153148"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210153148"],"apc_list":null,"apc_paid":null,"fwci":3.3512,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.92088572,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"10","last_page":"15"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.6410999894142151,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.6410999894142151,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11945","display_name":"Heat Transfer Mechanisms","score":0.08380000293254852,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.06650000065565109,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/jet-impingement-cooling","display_name":"jet impingement cooling","score":0.984000027179718},{"id":"https://openalex.org/keywords/two-phase-flow","display_name":"two-phase flow","score":0.8090000152587891},{"id":"https://openalex.org/keywords/boiling-heat-transfer","display_name":"boiling heat transfer","score":0.8519999980926514},{"id":"https://openalex.org/keywords/chip-cooling","display_name":"chip cooling","score":0.8040000200271606},{"id":"https://openalex.org/keywords/eulerian-eulerian-two-fluid-model","display_name":"Eulerian-Eulerian two-fluid model","score":0.9240000247955322},{"id":"https://openalex.org/keywords/natural-convection-cooling","display_name":"natural convection cooling","score":0.9710000157356262},{"id":"https://openalex.org/keywords/flow-rate-optimization","display_name":"flow rate optimization","score":0.800000011920929},{"id":"https://openalex.org/keywords/silicon-chip","display_name":"silicon chip","score":0.421999990940094}],"concepts":[{"id":"https://openalex.org/C91914117","wikidata":"https://www.wikidata.org/wiki/Q1056832","display_name":"Coolant","level":2,"score":0.7789711952209473},{"id":"https://openalex.org/C157777378","wikidata":"https://www.wikidata.org/wiki/Q41716","display_name":"Boiling","level":2,"score":0.6804963946342468},{"id":"https://openalex.org/C119947313","wikidata":"https://www.wikidata.org/wiki/Q5596635","display_name":"Jet (fluid)","level":2,"score":0.6520477533340454},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6091924905776978},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.5711708068847656},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.56314617395401},{"id":"https://openalex.org/C188596812","wikidata":"https://www.wikidata.org/wiki/Q1003183","display_name":"Boiling point","level":2,"score":0.527273952960968},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.4773254990577698},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.45643770694732666},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.22869035601615906},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.19676169753074646},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.16565343737602234},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08954858779907227}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/stherm.1999.762422","doi":"https://doi.org/10.1109/stherm.1999.762422","is_oa":false,"landing_page_url":"https://doi.org/10.1109/stherm.1999.762422","pdf_url":null,"source":{"id":"https://openalex.org/S4210186239","display_name":"Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings","issn_l":"1065-2221","issn":["1065-2221","2577-1000"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1619737676","https://openalex.org/W1973287095","https://openalex.org/W1981786107","https://openalex.org/W2005676385","https://openalex.org/W2038114685","https://openalex.org/W2105564249","https://openalex.org/W2164048643","https://openalex.org/W2349484747","https://openalex.org/W4248363372"],"related_works":["https://openalex.org/W3043305731","https://openalex.org/W2795960575","https://openalex.org/W1891688785","https://openalex.org/W3043067279","https://openalex.org/W2016967844","https://openalex.org/W2114675510","https://openalex.org/W4389061035","https://openalex.org/W7000963345","https://openalex.org/W2889827613","https://openalex.org/W2744393331"],"abstract_inverted_index":{"A":[0,71],"two":[1],"phase":[2],"model":[3,20],"has":[4,90],"been":[5,92],"developed":[6],"and":[7,41],"demonstrated":[8],"for":[9,23,61,66,94],"jet":[10,68,83,97],"impingement":[11,69,84,96],"cooling":[12,39,64,98],"of":[13,25,29,74,99],"a":[14,30],"silicon":[15],"chip.":[16],"The":[17,33,52],"Eulerian":[18],"two-fluid":[19],"is":[21,42,55,78],"applied":[22],"resolution":[24],"boiling":[26,53,76],"heat":[27],"transfer":[28],"phase-change":[31],"coolant.":[32],"simulation":[34],"result":[35],"predicts":[36],"the":[37,48,67,75,82,95,100],"overall":[38],"performance":[40],"in":[43,81],"reasonably":[44],"good":[45],"agreement":[46],"with":[47],"reported":[49],"experimental":[50],"data.":[51],"effect":[54,77],"found":[56,93],"to":[57],"be":[58],"more":[59],"pronounced":[60],"natural":[62],"convection":[63],"than":[65],"scheme.":[70],"saturation":[72],"point":[73],"also":[79,91],"observed":[80],"case.":[85],"An":[86],"optimized":[87],"flow":[88],"rate":[89],"chip":[101],"considered.":[102]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2016-06-24T00:00:00"}