{"id":"https://openalex.org/W2161978425","doi":"https://doi.org/10.1109/icmts.2004.1309501","title":"Accuracy improvement of the \"Single Pattern Driver\" method for the characterization of interconnect capacitance in the context of nanometer technology development","display_name":"Accuracy improvement of the \"Single Pattern Driver\" method for the characterization of interconnect capacitance in the context of nanometer technology development","publication_year":2004,"publication_date":"2004-07-20","ids":{"openalex":"https://openalex.org/W2161978425","doi":"https://doi.org/10.1109/icmts.2004.1309501","mag":"2161978425"},"language":"en","primary_location":{"id":"doi:10.1109/icmts.2004.1309501","doi":"https://doi.org/10.1109/icmts.2004.1309501","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icmts.2004.1309501","pdf_url":null,"source":{"id":"https://openalex.org/S7407085999","display_name":"IEEE International Conference on Microelectronic Test Structures (ICMTS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058128381","display_name":"H. Brut","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"H. Brut","raw_affiliation_strings":["STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040059705","display_name":"Steven M. Martin","orcid":"https://orcid.org/0000-0002-7832-1088","observed_orcids":["https://orcid.org/0000-0002-7832-1088","https://orcid.org/0000-0002-6838-3808"]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Martin","raw_affiliation_strings":["STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5022807978","display_name":"Benoit Froment","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B. Froment","raw_affiliation_strings":["STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210104693"],"apc_list":null,"apc_paid":null,"fwci":0.8304,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.72749894,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"303","last_page":"308"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.35569998621940613,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.35569998621940613,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.32839998602867126,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.07890000194311142,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnect-capacitance","display_name":"interconnect capacitance","score":0.9700000286102295},{"id":"https://openalex.org/keywords/nanometer-cmos","display_name":"nanometer CMOS","score":0.781000018119812},{"id":"https://openalex.org/keywords/bicmos","display_name":"BiCMOS","score":0.949999988079071},{"id":"https://openalex.org/keywords/circuit-delay","display_name":"circuit delay","score":0.7350000143051147},{"id":"https://openalex.org/keywords/on-chip-interconnects","display_name":"on-chip interconnects","score":0.5519999861717224}],"concepts":[{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.7653707265853882},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6791784763336182},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6614638566970825},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.6272551417350769},{"id":"https://openalex.org/C77066764","wikidata":"https://www.wikidata.org/wiki/Q178674","display_name":"Nanometre","level":2,"score":0.6110950708389282},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5675174593925476},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5359265208244324},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48884910345077515},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.46421530842781067},{"id":"https://openalex.org/C15485314","wikidata":"https://www.wikidata.org/wiki/Q467463","display_name":"Varicap","level":4,"score":0.45129793882369995},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3662809133529663},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3015291392803192},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2706511318683624},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11668804287910461},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.11450952291488647},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09038114547729492},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icmts.2004.1309501","doi":"https://doi.org/10.1109/icmts.2004.1309501","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icmts.2004.1309501","pdf_url":null,"source":{"id":"https://openalex.org/S7407085999","display_name":"IEEE International Conference on Microelectronic Test Structures (ICMTS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4943999946117401,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1790208943","https://openalex.org/W2095910443","https://openalex.org/W2106174017","https://openalex.org/W2124747208","https://openalex.org/W2180566257","https://openalex.org/W2493562493","https://openalex.org/W2542067837"],"related_works":["https://openalex.org/W2493562493","https://openalex.org/W1990064822","https://openalex.org/W1495438351","https://openalex.org/W2160010361","https://openalex.org/W2123249456","https://openalex.org/W2166082410","https://openalex.org/W2570392076","https://openalex.org/W2134342517","https://openalex.org/W2164555976","https://openalex.org/W2145347667"],"abstract_inverted_index":{"Characterization,":[0],"modelling":[1],"and":[2,13,41,64],"monitoring":[3],"of":[4,8,24,48,51],"interconnect":[5],"capacitance":[6],"are":[7],"first":[9],"interest":[10],"for":[11,18],"CMOS":[12],"BiCMOS":[14],"technology":[15],"development,":[16],"especially":[17],"circuit":[19],"delay":[20],"evaluation.":[21],"An":[22],"improvement":[23],"the":[25,49],"Single":[26],"Pattern":[27],"Driver":[28],"method":[29],"is":[30,61],"proposed":[31],"in":[32,55],"this":[33],"paper":[34],"to":[35],"take":[36],"into":[37],"account":[38],"MOST":[39],"intrinsic":[40],"diode":[42],"leakages":[43],"which":[44],"can":[45],"introduce":[46],"errors":[47],"order":[50],"few":[52],"hundred":[53],"aF":[54],"advanced":[56],"nanometer":[57],"technologies.":[58],"The":[59],"accuracy":[60],"hugely":[62],"improved":[63],"reaches":[65],"now":[66],"10aF.":[67]},"counts_by_year":[{"year":2013,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}