{"id":"https://openalex.org/W2159754341","doi":"https://doi.org/10.1109/soi.1995.526518","title":"\"Smart cut\": a promising new SOI material technology","display_name":"\"Smart cut\": a promising new SOI material technology","publication_year":2002,"publication_date":"2002-11-19","ids":{"openalex":"https://openalex.org/W2159754341","doi":"https://doi.org/10.1109/soi.1995.526518","mag":"2159754341"},"language":"en","primary_location":{"id":"doi:10.1109/soi.1995.526518","doi":"https://doi.org/10.1109/soi.1995.526518","is_oa":false,"landing_page_url":"https://doi.org/10.1109/soi.1995.526518","pdf_url":null,"source":{"id":"https://openalex.org/S4210190736","display_name":"IEEE International SOI Conference (SOI)","issn_l":"1078-621X","issn":["1078-621X","2577-2295"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"1995 IEEE International SOI Conference Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111954617","display_name":"MICHEL BRUEL","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"M. Bruel","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056434593","display_name":"B. Aspar","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B. Aspar","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002619828","display_name":"Barbara Charlet","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B. Charlet","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061938708","display_name":"Christophe Maleville","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Maleville","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034851243","display_name":"T. Poumeyrol","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"T. Poumeyrol","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066691456","display_name":"A. Soubie","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Soubie","raw_affiliation_strings":["DMETEC, LETI (CEA Technologies Avancees), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"DMETEC, LETI (CEA Technologies Avancees), Grenoble, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110236136","display_name":"A.J. Auberton\u2010Herv\u00e9","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A.J. Auberton-Herve","raw_affiliation_strings":["SOITEC SA, Site technologique ASTEC, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SOITEC SA, Site technologique ASTEC, Grenoble, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049708155","display_name":"J.M. Lamure","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"J.M. Lamure","raw_affiliation_strings":["SOITEC SA, Site technologique ASTEC, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SOITEC SA, Site technologique ASTEC, Grenoble, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020881662","display_name":"T. Barge","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"T. Barge","raw_affiliation_strings":["SOITEC SA, Site technologique ASTEC, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SOITEC SA, Site technologique ASTEC, Grenoble, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018967052","display_name":"F. Metral","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"F. Metral","raw_affiliation_strings":["SOITEC SA, Site technologique ASTEC, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SOITEC SA, Site technologique ASTEC, Grenoble, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029160642","display_name":"S. Trucchi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Trucchi","raw_affiliation_strings":["SOITEC SA, Site technologique ASTEC, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SOITEC SA, Site technologique ASTEC, Grenoble, France","institution_ids":["https://openalex.org/I108523894"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.623,"has_fulltext":false,"cited_by_count":59,"citation_normalized_percentile":{"value":0.95954763,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"178","last_page":"179"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9463000297546387,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9463000297546387,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.015399999916553497,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.01360000018030405,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/smart-cut","display_name":"Smart Cut","score":0.5690000057220459},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"silicon-on-insulator","score":0.9409999847412109},{"id":"https://openalex.org/keywords/simox","display_name":"SIMOX","score":0.8489999771118164},{"id":"https://openalex.org/keywords/ion-implantation","display_name":"ion implantation","score":0.6420000195503235},{"id":"https://openalex.org/keywords/proton-implantation","display_name":"proton implantation","score":0.8569999933242798},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"wafer bonding","score":0.8320000171661377},{"id":"https://openalex.org/keywords/ulsi","display_name":"ULSI","score":0.7039999961853027}],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.9230786561965942},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6638442873954773},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6599220037460327},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5721345543861389},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5575430393218994},{"id":"https://openalex.org/C41823505","wikidata":"https://www.wikidata.org/wiki/Q1436752","display_name":"Ion implantation","level":3,"score":0.5159679055213928},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4330596327781677},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4202900528907776},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.40302982926368713},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4012620449066162},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.37234652042388916},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22929516434669495},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.1606743037700653},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.06342366337776184},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/soi.1995.526518","doi":"https://doi.org/10.1109/soi.1995.526518","is_oa":false,"landing_page_url":"https://doi.org/10.1109/soi.1995.526518","pdf_url":null,"source":{"id":"https://openalex.org/S4210190736","display_name":"IEEE International SOI Conference (SOI)","issn_l":"1078-621X","issn":["1078-621X","2577-2295"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"1995 IEEE International SOI Conference Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7207000255584717,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1973671776","https://openalex.org/W1988067337","https://openalex.org/W2070236316","https://openalex.org/W4234144150"],"related_works":["https://openalex.org/W2069336020","https://openalex.org/W2138637063","https://openalex.org/W2362298899","https://openalex.org/W2097518590","https://openalex.org/W2005013826","https://openalex.org/W1969402752","https://openalex.org/W2057933222","https://openalex.org/W1560229858","https://openalex.org/W2186660428","https://openalex.org/W2143752791"],"abstract_inverted_index":{"Silicon":[0],"On":[1],"Insulator":[2],"technologies":[3,13,30],"appear":[4],"to":[5,74,100],"be":[6],"a":[7,20,57,63],"key":[8],"issue":[9],"for":[10,107],"low-power,":[11],"low-voltage":[12],"(/spl":[14],"ap/1.5":[15],"V)":[16],"and":[17,46,49,96],"will":[18],"play":[19],"major":[21],"role":[22],"in":[23,32,34],"ULSI":[24],"developments.":[25],"Today":[26],"two":[27],"SOI":[28,38,59],"material":[29,60],"are":[31],"competition":[33],"the":[35,76,81,89],"very":[36],"thin":[37],"film":[39],"market:":[40],"SIMOX":[41],"(Separation":[42],"by":[43],"IMplanted":[44],"OXygen)":[45],"BESOI":[47],"(Bond":[48],"Etch":[50],"Back":[51],"SOI)":[52],"Technology.":[53],"We":[54],"have":[55],"developed":[56,87],"new":[58],"technology":[61],"using":[62],"bonding":[64],"technique":[65],"combined":[66],"with":[67],"an":[68],"ion":[69],"implantation":[70],"step,":[71],"which":[72],"aims":[73],"overcome":[75],"remaining":[77],"limitations":[78],"of":[79,109],"both":[80],"above":[82],"techniques.":[83],"This":[84],"process":[85,95,104],"was":[86],"as":[88,101],"\"IMPROVE\"":[90],"(IMplanted":[91],"PROtons":[92],"Voids":[93],"Engineering)":[94],"is":[97,105],"henceforth":[98],"referred":[99],"\"Smart-cut\".":[102],"The":[103],"implemented":[106],"fabrication":[108],"Unibond":[110],"wafers.":[111]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}