{"id":"https://openalex.org/W2155294129","doi":"https://doi.org/10.1109/mcmc.1995.512005","title":"Design considerations for implementing a modularly configured attached processor in a multi chip module","display_name":"Design considerations for implementing a modularly configured attached processor in a multi chip module","publication_year":2002,"publication_date":"2002-11-19","ids":{"openalex":"https://openalex.org/W2155294129","doi":"https://doi.org/10.1109/mcmc.1995.512005","mag":"2155294129"},"language":"en","primary_location":{"id":"doi:10.1109/mcmc.1995.512005","doi":"https://doi.org/10.1109/mcmc.1995.512005","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mcmc.1995.512005","pdf_url":null,"source":{"id":"https://openalex.org/S4306418792","display_name":"IEEE Multi-Chip Module Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"J.S. Singh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.S. Singh","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009965795","display_name":"BUCK W. GREMEL","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B.W. Gremel","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100737404","display_name":"Vijay P. Singh","orcid":"https://orcid.org/0000-0002-1345-6002","observed_orcids":["https://orcid.org/0000-0002-1345-6002"]},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V.P. Singh","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5035489678","display_name":"Glenn A. Gibson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I164936912","display_name":"The University of Texas at El Paso","ror":"https://ror.org/04d5vba33","country_code":"US","type":"education","lineage":["https://openalex.org/I164936912"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G.A. Gibson","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Texas, El Paso, El Paso, TX, USA","institution_ids":["https://openalex.org/I164936912"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I164936912"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.31164115,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"62","last_page":"68"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.5619999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.5619999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.27390000224113464,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.08860000222921371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multichip-modules","display_name":"multichip modules","score":0.9229999780654907},{"id":"https://openalex.org/keywords/mcm-d","display_name":"MCM-D","score":0.8180000185966492},{"id":"https://openalex.org/keywords/processor-architecture","display_name":"processor architecture","score":0.7229999899864197},{"id":"https://openalex.org/keywords/time-delay-estimation","display_name":"time delay estimation","score":0.550000011920929},{"id":"https://openalex.org/keywords/power-dissipation","display_name":"power dissipation","score":0.8700000047683716},{"id":"https://openalex.org/keywords/chip-area","display_name":"chip area","score":0.546999990940094},{"id":"https://openalex.org/keywords/air-cooling","display_name":"air cooling","score":0.8629999756813049},{"id":"https://openalex.org/keywords/rent-s-rule","display_name":"Rent's rule","score":0.6129999756813049}],"concepts":[{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6714919805526733},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.6323859095573425},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.625751256942749},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6227656602859497},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.49718835949897766},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.4949113726615906},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4362087547779083},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.43453627824783325},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4165365695953369},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3894810080528259},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31471964716911316},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18424132466316223},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11706399917602539},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08132344484329224},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mcmc.1995.512005","doi":"https://doi.org/10.1109/mcmc.1995.512005","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mcmc.1995.512005","pdf_url":null,"source":{"id":"https://openalex.org/S4306418792","display_name":"IEEE Multi-Chip Module Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W239283595","https://openalex.org/W1544533045","https://openalex.org/W1556480701","https://openalex.org/W1842467025","https://openalex.org/W1967346171","https://openalex.org/W2006097283"],"related_works":["https://openalex.org/W2026695486","https://openalex.org/W1972380833","https://openalex.org/W1957021781","https://openalex.org/W2165144544","https://openalex.org/W7098976407","https://openalex.org/W2082176121","https://openalex.org/W1620592151","https://openalex.org/W2158815778","https://openalex.org/W2292672015","https://openalex.org/W2152152477"],"abstract_inverted_index":{"Implementation":[0],"of":[1],"a":[2],"novel":[3],"modularly":[4],"configured":[5],"attached":[6],"processor":[7],"(MCAP)":[8],"architecture":[9],"was":[10,24,47,54,67,79],"evaluated":[11],"using":[12,41],"1":[13],"/spl":[14],"mu/m":[15],"CMOS":[16],"logic":[17],"on":[18,30],"an":[19],"MCM-D":[20],"The":[21,63],"transistor":[22],"count":[23],"approximately":[25],"ten":[26],"million":[27],"transistors,":[28],"distributed":[29],"twenty-five":[31],"chip":[32],"dice.":[33],"Delay,":[34],"area,":[35],"and":[36],"power":[37],"calculations":[38],"were":[39],"performed":[40],"the":[42,59],"SUSPENS":[43],"model.":[44],"Rent's":[45],"rule":[46],"found":[48,68],"to":[49,56,69,82],"be":[50,57,70],"not":[51],"applicable.":[52],"Speed":[53],"calculated":[55],"in":[58],"100":[60],"MHz":[61],"range.":[62],"module":[64],"foot":[65],"print":[66],"90":[71],"cm/sup":[72],"2/.":[73],"Power":[74],"dissipation":[75],"per":[76],"unit":[77],"area":[78],"low":[80],"enough":[81],"allow":[83],"air":[84],"cooling.":[85]},"counts_by_year":[],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}