{"id":"https://openalex.org/W2152307346","doi":"https://doi.org/10.1109/eptc.2009.5416440","title":"3D integration of image sensor SiP using TSV silicon interposer","display_name":"3D integration of image sensor SiP using TSV silicon interposer","publication_year":2009,"publication_date":"2009-12-01","ids":{"openalex":"https://openalex.org/W2152307346","doi":"https://doi.org/10.1109/eptc.2009.5416440","mag":"2152307346"},"language":"en","primary_location":{"id":"doi:10.1109/eptc.2009.5416440","doi":"https://doi.org/10.1109/eptc.2009.5416440","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2009.5416440","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 11th Electronics Packaging Technology Conference","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083945050","display_name":"M. J\u00fcrgen Wolf","orcid":"https://orcid.org/0000-0003-2476-7954","observed_orcids":["https://orcid.org/0000-0003-2476-7954"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. Juergen Wolf","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057715745","display_name":"Kai Zoschke","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Zoschke","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041335101","display_name":"Armin Klumpp","orcid":"https://orcid.org/0009-0007-4430-5550","observed_orcids":["https://orcid.org/0009-0007-4430-5550"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"A. Klumpp","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035777173","display_name":"Robert Wieland","orcid":"https://orcid.org/0000-0002-5153-6492","observed_orcids":["https://orcid.org/0000-0002-5153-6492"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"R. Wieland","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074730505","display_name":"Matthias Klein","orcid":"https://orcid.org/0000-0002-0434-5888","observed_orcids":["https://orcid.org/0000-0002-0434-5888"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. Klein","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081497113","display_name":"L. Nebrich","orcid":"https://orcid.org/0009-0009-4350-5619","observed_orcids":["https://orcid.org/0009-0009-4350-5619"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"L. Nebrich","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042850631","display_name":"Andy Heinig","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210095661","display_name":"Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS","ror":"https://ror.org/00s5yp124","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210095661","https://openalex.org/I4210124274","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4210124274","display_name":"Fraunhofer Institute for Integrated Circuits","ror":"https://ror.org/024ape423","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210124274","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"A. Heinig","raw_affiliation_strings":["Fraunhofer Institute for Integrated Circuits (IIS) Design Automation Division, Dresden, Germany","Design Automation Division, Fraunhofer Institute of Integrated Circuits and Systems, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Integrated Circuits (IIS) Design Automation Division, Dresden, Germany","institution_ids":["https://openalex.org/I4210095661","https://openalex.org/I4210124274"]},{"raw_affiliation_string":"Design Automation Division, Fraunhofer Institute of Integrated Circuits and Systems, Dresden, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068521610","display_name":"I. Limansyah","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"I. Limansyah","raw_affiliation_strings":["Infineon Technologies, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Munich, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101914544","display_name":"Walter Michael Weber","orcid":"https://orcid.org/0000-0001-9504-5671","observed_orcids":["https://orcid.org/0000-0001-9504-5671"]},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"W. Weber","raw_affiliation_strings":["Infineon Technologies, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Munich, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078074960","display_name":"O. Ehrmann","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"O. Ehrmann","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066255890","display_name":"H. Reichl","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"H. Reichl","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin","institution_ids":["https://openalex.org/I4210134425"]},{"raw_affiliation_string":"Fraunhofer Institute of Reliability and Microintegration (IZM), Berlin, Germany","institution_ids":["https://openalex.org/I4210134425"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":7.0272,"has_fulltext":false,"cited_by_count":24,"citation_normalized_percentile":{"value":0.9817845,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"795","last_page":"800"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.8939999938011169},{"id":"https://openalex.org/keywords/system-in-package","display_name":"system-in-package","score":0.6679999828338623},{"id":"https://openalex.org/keywords/image-sensors","display_name":"image sensors","score":0.7239999771118164},{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.9760000109672546},{"id":"https://openalex.org/keywords/silicon-interposer","display_name":"silicon interposer","score":0.9509999752044678},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"wafer-level packaging","score":0.7680000066757202},{"id":"https://openalex.org/keywords/flip-chip-bonding","display_name":"flip-chip bonding","score":0.8930000066757202},{"id":"https://openalex.org/keywords/vehicle-sensors","display_name":"automotive sensors","score":0.7689999938011169},{"id":"https://openalex.org/keywords/microcontroller-integration","display_name":"microcontroller integration","score":0.6729999780654907},{"id":"https://openalex.org/keywords/testability","display_name":"testability","score":0.6179999709129333}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8575460910797119},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.5585896372795105},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.5433334708213806},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5406818389892578},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.5322171449661255},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5190399289131165},{"id":"https://openalex.org/C173018170","wikidata":"https://www.wikidata.org/wiki/Q165678","display_name":"Microcontroller","level":2,"score":0.49151715636253357},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.45645400881767273},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.453274130821228},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.44905757904052734},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43988174200057983},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4294326603412628},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.4175449013710022},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.41228634119033813},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.336894154548645},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3118026852607727},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2976728677749634},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2917933464050293},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.11719164252281189},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10633277893066406},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/eptc.2009.5416440","doi":"https://doi.org/10.1109/eptc.2009.5416440","is_oa":false,"landing_page_url":"https://doi.org/10.1109/eptc.2009.5416440","pdf_url":null,"source":{"id":"https://openalex.org/S4363608031","display_name":"IEEE Electronics Packaging Technology Conference (EPTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 11th Electronics Packaging Technology Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:fraunhofer.de:N-147528","doi":null,"is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-147528.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IZM","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/365066","doi":null,"is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/365066","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.651199996471405,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321114","display_name":"Bundesministerium f\u00fcr Bildung und Forschung","ror":"https://ror.org/04pz7b180"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W116944279","https://openalex.org/W2060653071","https://openalex.org/W2124641522","https://openalex.org/W2141746519","https://openalex.org/W2158776760","https://openalex.org/W2172281986","https://openalex.org/W4239250096"],"related_works":["https://openalex.org/W2166642074","https://openalex.org/W7037597129","https://openalex.org/W7000976381","https://openalex.org/W4416878787","https://openalex.org/W7065557314","https://openalex.org/W1972563478","https://openalex.org/W2124589504","https://openalex.org/W7065432930","https://openalex.org/W2158152750","https://openalex.org/W2288834378"],"abstract_inverted_index":{"3D":[0,71],"system":[1,74,79,105],"integration":[2,56],"is":[3,80],"a":[4,19,69,94,101],"fast":[5],"growing":[6],"field":[7],"that":[8],"encompasses":[9],"different":[10],"types":[11],"of":[12,31],"technologies.":[13],"[1]":[14],"The":[15,66,78,103],"technology":[16,85],"chosen":[17],"for":[18,49,75],"specific":[20,51,70,104],"application":[21],"will":[22],"be":[23],"selected":[24],"according":[25],"to":[26,39],"the":[27,32,34,45,50,107],"required":[28],"electrical":[29],"performance":[30],"systems,":[33],"footprint,":[35],"cost":[36],"and":[37,64,100,110],"time":[38],"market.":[40],"Other":[41],"important":[42],"factors":[43],"are":[44,112],"boundary":[46],"conditions":[47],"given":[48],"components":[52],"e.g.":[53],"die":[54],"size,":[55],"compatibility,":[57],"component":[58],"availability":[59],"(wafer":[60],"vs.":[61],"bare":[62],"die)":[63],"testability.":[65],"paper":[67],"discusses":[68],"image":[72],"sensor":[73,98],"automotive":[76],"applications.":[77],"based":[81],"on":[82],"wafer":[83],"level":[84],"using":[86],"silicon":[87],"interposer":[88],"with":[89],"Through":[90],"Silicon":[91],"Vias":[92],"(TSV\u00b4s),":[93],"flip":[95],"chip":[96],"assembled":[97],"element":[99],"microcontroller.":[102],"concept,":[106],"technical":[108],"solution":[109],"results":[111],"discussed.":[113]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":8}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}