{"id":"https://openalex.org/W2152249156","doi":"https://doi.org/10.1109/irps.2013.6532030","title":"Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading","display_name":"Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W2152249156","doi":"https://doi.org/10.1109/irps.2013.6532030","mag":"2152249156"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2013.6532030","doi":"https://doi.org/10.1109/irps.2013.6532030","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2013.6532030","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047264137","display_name":"Holm Geisler","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"H. Geisler","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062169624","display_name":"E. Schuchardt","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"E. Schuchardt","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032259093","display_name":"Martin Brueckner","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. Brueckner","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060148914","display_name":"Petra Hofmann","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"P. Hofmann","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058440554","display_name":"Kashi Vishwanath Machani","orcid":"https://orcid.org/0009-0002-1884-6795","observed_orcids":["https://orcid.org/0009-0002-1884-6795"]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. V. Machani","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108146531","display_name":"Frank Kuechenmeister","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"F. Kuechenmeister","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"middle","author":{"id":null,"display_name":"D. Breuer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"D. Breuer","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109349529","display_name":"H.J. Engelmann","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210142027","display_name":"GlobalFoundries (Germany)","ror":"https://ror.org/045jad561","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"H. Engelmann","raw_affiliation_strings":["GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES Dresden Module One LLC & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I4210142027"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210142027"],"apc_list":null,"apc_paid":null,"fwci":8.0119,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.97813665,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"5C.1.1","last_page":"5C.1.10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0017999999690800905,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mechanical-reliability","display_name":"mechanical reliability","score":0.8259999752044678},{"id":"https://openalex.org/keywords/front-end-of-line","display_name":"front-end-of-line","score":0.5509999990463257},{"id":"https://openalex.org/keywords/chip-package-interaction","display_name":"chip-package interaction","score":0.8009999990463257},{"id":"https://openalex.org/keywords/copper-pillars","display_name":"copper pillars","score":0.5559999942779541},{"id":"https://openalex.org/keywords/ultra-low-k-dielectrics","display_name":"ultra low-k dielectrics","score":0.9330000281333923},{"id":"https://openalex.org/keywords/wafer-level-testing","display_name":"wafer-level testing","score":0.7720000147819519},{"id":"https://openalex.org/keywords/load-transfer","display_name":"load transfer","score":0.38199999928474426}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8190059661865234},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.6999428272247314},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6800715923309326},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6621327996253967},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5906041860580444},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.5020074844360352},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44417625665664673},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41714489459991455},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.38139867782592773},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3758001923561096},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.349803626537323},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15472328662872314},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.07310110330581665},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2013.6532030","doi":"https://doi.org/10.1109/irps.2013.6532030","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2013.6532030","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7207000255584717,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1651513979","https://openalex.org/W1970015431","https://openalex.org/W2025024161","https://openalex.org/W2032981902","https://openalex.org/W2036160075","https://openalex.org/W2056408056","https://openalex.org/W2056821839","https://openalex.org/W2084233494","https://openalex.org/W2087589643","https://openalex.org/W2090357793","https://openalex.org/W2094504498","https://openalex.org/W2104908806","https://openalex.org/W2125132674","https://openalex.org/W2125177563","https://openalex.org/W2130192269","https://openalex.org/W2139534988","https://openalex.org/W2539969123","https://openalex.org/W4252629351","https://openalex.org/W4285719527","https://openalex.org/W4290647119","https://openalex.org/W6664699839"],"related_works":["https://openalex.org/W2146027687","https://openalex.org/W7010953115","https://openalex.org/W3046552133","https://openalex.org/W1969790797","https://openalex.org/W2036160075","https://openalex.org/W2740177935","https://openalex.org/W2767074879","https://openalex.org/W2743554645","https://openalex.org/W2055128113","https://openalex.org/W1604746479"],"abstract_inverted_index":{"The":[0,58,82],"introduction":[1],"of":[2,18,31,54,70,89],"fragile":[3],"ultralow-k":[4],"materials":[5],"as":[6],"interlayer":[7],"dielectrics":[8],"in":[9],"backend-of-line":[10],"interconnect":[11,76],"stacks":[12,77],"asks":[13],"for":[14],"a":[15],"thorough":[16],"analysis":[17],"potential":[19],"risks":[20,45],"due":[21],"to":[22,42,63,75,93],"chip-package":[23,65],"interaction.":[24],"This":[25],"paper":[26],"shows":[27],"how":[28],"the":[29,47,55,71,87],"application":[30],"several":[32],"ex-situ":[33],"and":[34],"in-situ":[35],"experimental":[36],"approaches":[37],"can":[38],"be":[39],"effectively":[40],"used":[41],"assess":[43],"such":[44],"on":[46,86],"wafer":[48],"level":[49],"already":[50],"at":[51],"early":[52],"stages":[53],"development":[56],"phase.":[57],"respective":[59],"analytical":[60],"techniques":[61],"try":[62],"mimic":[64],"interaction":[66],"loading":[67],"conditions.":[68],"Most":[69],"tests":[72],"transfer":[73],"loads":[74],"via":[78],"individual":[79],"copper":[80],"pillars.":[81],"investigations":[83],"take":[84],"place":[85],"scale":[88],"about":[90],"100\u03bcm":[91],"down":[92],"1\u03bcm.":[94]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}