{"id":"https://openalex.org/W2150180486","doi":"https://doi.org/10.1109/issm.1997.664485","title":"Measurable improvements in cycle-time-constrained capacity","display_name":"Measurable improvements in cycle-time-constrained capacity","publication_year":2002,"publication_date":"2002-11-23","ids":{"openalex":"https://openalex.org/W2150180486","doi":"https://doi.org/10.1109/issm.1997.664485","mag":"2150180486"},"language":"en","primary_location":{"id":"doi:10.1109/issm.1997.664485","doi":"https://doi.org/10.1109/issm.1997.664485","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issm.1997.664485","pdf_url":null,"source":{"id":"https://openalex.org/S4210217557","display_name":"IEEE International Symposium on Semiconductor Manufacturing conference proceedings","issn_l":"1523-553X","issn":["1523-553X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019888542","display_name":"John Fowler","orcid":"https://orcid.org/0000-0002-7112-8031","observed_orcids":["https://orcid.org/0000-0002-7112-8031"]},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.W. Fowler","raw_affiliation_strings":["AZ, USA","Arizona State University Tempe, az USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AZ, USA","institution_ids":[]},{"raw_affiliation_string":"Arizona State University Tempe, az USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102084906","display_name":"S. Brown","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"S. Brown","raw_affiliation_strings":["Siemens AG, Munchen, Germany","Arizona State University**"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens AG, Munchen, Germany","institution_ids":["https://openalex.org/I1325886976"]},{"raw_affiliation_string":"Arizona State University**","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":null,"display_name":"H. Gold","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"H. Gold","raw_affiliation_strings":["Siemens AG, Regensburg, Germany","Arizona State University**"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens AG, Regensburg, Germany","institution_ids":["https://openalex.org/I1325886976"]},{"raw_affiliation_string":"Arizona State University**","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058886980","display_name":"A. Schoeming","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Schoeming","raw_affiliation_strings":["Arizona State University**"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Arizona State University**","institution_ids":["https://openalex.org/I55732556"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":11.7258,"has_fulltext":false,"cited_by_count":50,"citation_normalized_percentile":{"value":0.99262295,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":87,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"A21","last_page":"A24"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.7231000065803528,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.7231000065803528,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14270","display_name":"Simulation and Modeling Applications","score":0.061400000005960464,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.04960000142455101,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-manufacturing","display_name":"semiconductor manufacturing","score":0.699999988079071},{"id":"https://openalex.org/keywords/batching","display_name":"batching","score":0.6499999761581421},{"id":"https://openalex.org/keywords/lot-release","display_name":"lot release","score":0.9430000185966492},{"id":"https://openalex.org/keywords/dispatching-rules","display_name":"dispatching rules","score":0.9660000205039978},{"id":"https://openalex.org/keywords/photolithography","display_name":"photolithography","score":0.8080000281333923},{"id":"https://openalex.org/keywords/inventory-reduction","display_name":"inventory reduction","score":0.7720000147819519},{"id":"https://openalex.org/keywords/production-scheduling","display_name":"production scheduling","score":0.4020000100135803},{"id":"https://openalex.org/keywords/productivity-improvement","display_name":"productivity improvement","score":0.4399999976158142}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5427572727203369}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/issm.1997.664485","doi":"https://doi.org/10.1109/issm.1997.664485","is_oa":false,"landing_page_url":"https://doi.org/10.1109/issm.1997.664485","pdf_url":null,"source":{"id":"https://openalex.org/S4210217557","display_name":"IEEE International Symposium on Semiconductor Manufacturing conference proceedings","issn_l":"1523-553X","issn":["1523-553X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.8970999717712402,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2055995772","https://openalex.org/W2065104323","https://openalex.org/W2145856886"],"related_works":["https://openalex.org/W2108746728","https://openalex.org/W1950459565","https://openalex.org/W2122155558","https://openalex.org/W2621301368","https://openalex.org/W2170726572","https://openalex.org/W2613412250","https://openalex.org/W1969920159","https://openalex.org/W1988573876","https://openalex.org/W2164379187","https://openalex.org/W2016438112"],"abstract_inverted_index":{"This":[0],"study":[1],"uses":[2],"simulation-based":[3],"analysis":[4,49],"to":[5,74],"evaluate":[6],"the":[7,17,54,59,97,104,111],"operating":[8,56],"practices":[9,57,67],"of":[10,19,53,58,103],"a":[11,29,88,101,114],"high-volume,":[12],"multiple-product":[13],"semiconductor":[14],"fab,":[15],"with":[16],"goal":[18],"finding":[20],"potential":[21,80],"areas":[22],"for":[23,79,82],"productivity":[24],"improvement":[25,81],"that":[26,51],"will":[27],"yield":[28],"quantifiable":[30],"increase":[31,69],"in":[32,86,96,117],"fab":[33,99],"capacity.":[34],"The":[35,48,93],"parameters":[36],"setup,":[37],"batching,":[38],"tool/operator":[39],"dedication,":[40],"lot":[41],"release,":[42],"and":[43,120],"dispatch":[44],"rule":[45],"were":[46,61],"studied.":[47],"revealed":[50],"some":[52,65],"current":[55],"factory":[60,84,112],"beneficial":[62],"while":[63],"changing":[64],"other":[66],"would":[68],"\"cycle-time-constrained":[70],"capacity\"":[71],"by":[72],"up":[73],"12%.":[75],"A":[76],"significant":[77],"opportunity":[78],"this":[83],"lies":[85],"implementing":[87],"strict":[89],"setup":[90],"avoidance":[91],"policy.":[92],"first":[94],"implementation":[95],"actual":[98],"is":[100],"relaxation":[102],"photolithography":[105],"equipment":[106],"dedication":[107],"which":[108],"has":[109],"helped":[110],"achieve":[113],"25%":[115],"reduction":[116],"cycle":[118],"time":[119],"inventory.":[121]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}