{"id":"https://openalex.org/W2148619337","doi":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","title":"Thermoelectric Properties of Layer-Structured (ZnS)mIn2S3","display_name":"Thermoelectric Properties of Layer-Structured (ZnS)mIn2S3","publication_year":2000,"publication_date":"2000-05-01","ids":{"openalex":"https://openalex.org/W2148619337","doi":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","mag":"2148619337"},"language":"en","primary_location":{"id":"doi:10.4028/www.scientific.net/kem.181-182.59","doi":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036817698","display_name":"Riki Otsuka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Riki Otsuka","raw_affiliation_strings":["Nagoya University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nagoya University","institution_ids":["https://openalex.org/I60134161"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108468688","display_name":"Won Seon Seo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210110928","display_name":"Korea Institute of Ceramic Engineering and Technology","ror":"https://ror.org/024t5tt95","country_code":"KR","type":"facility","lineage":["https://openalex.org/I4210110928"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Won Seon Seo","raw_affiliation_strings":["Korea Institute of Ceramic Engineering and Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Korea Institute of Ceramic Engineering and Technology","institution_ids":["https://openalex.org/I4210110928"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041060634","display_name":"Kunihito Koumoto","orcid":"https://orcid.org/0000-0002-9170-6695","observed_orcids":["https://orcid.org/0000-0002-9170-6695"]},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kunihito Koumoto","raw_affiliation_strings":["Nagoya University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nagoya University","institution_ids":["https://openalex.org/I60134161"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":94},"biblio":{"volume":"181-182","issue":null,"first_page":"59","last_page":"62"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10590","display_name":"Chalcogenide Semiconductor Thin Films","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelectric-properties","display_name":"thermoelectric properties","score":0.9959999918937683},{"id":"https://openalex.org/keywords/znin2s4","display_name":"ZnIn2S4","score":0.7229999899864197},{"id":"https://openalex.org/keywords/thermoelectric-materials","display_name":"thermoelectric materials","score":0.6330000162124634}],"concepts":[{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.4718848466873169},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4291602075099945},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4113595485687256},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.25524356961250305},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.20284181833267212},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08381527662277222}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4028/www.scientific.net/kem.181-182.59","doi":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4028/www.scientific.net/kem.181-182.59","doi":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","is_oa":true,"landing_page_url":"https://doi.org/10.4028/www.scientific.net/kem.181-182.59","pdf_url":null,"source":{"id":"https://openalex.org/S75411654","display_name":"Key engineering materials","issn_l":"1013-9826","issn":["1013-9826","1662-9795","1662-9809"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1","vabb-shw"],"host_organization":"https://openalex.org/P4310317839","host_organization_name":"Trans Tech Publications","host_organization_lineage":["https://openalex.org/P4310317839"],"host_organization_lineage_names":["Trans Tech Publications"],"type":"book series"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Key Engineering Materials","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2061786309","https://openalex.org/W590274534","https://openalex.org/W3095636875","https://openalex.org/W2624835971","https://openalex.org/W2223252641","https://openalex.org/W2060080296","https://openalex.org/W2607318643","https://openalex.org/W2278601729","https://openalex.org/W2998645952","https://openalex.org/W7015717531"],"abstract_inverted_index":null,"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2016-06-24T00:00:00"}