{"id":"https://openalex.org/W2147802575","doi":"https://doi.org/10.1109/ectc.2001.927949","title":"Characterization and analysis on the solder ball shear testing conditions","display_name":"Characterization and analysis on the solder ball shear testing conditions","publication_year":2002,"publication_date":"2002-11-13","ids":{"openalex":"https://openalex.org/W2147802575","doi":"https://doi.org/10.1109/ectc.2001.927949","mag":"2147802575"},"language":"en","primary_location":{"id":"doi:10.1109/ectc.2001.927949","doi":"https://doi.org/10.1109/ectc.2001.927949","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2001.927949","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103549759","display_name":"Xingjia Huang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Xingjia Huang","raw_affiliation_strings":["Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061913080","display_name":"S. W. Ricky Lee","orcid":"https://orcid.org/0000-0002-7706-522X","observed_orcids":["https://orcid.org/0000-0002-7706-522X"]},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"S.-W.R. Lee","raw_affiliation_strings":["Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007585126","display_name":"Chien Chun Yan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Chien Chun Yan","raw_affiliation_strings":["Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"last","author":{"id":null,"display_name":"S. Hui","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Hui","raw_affiliation_strings":["Department of Physics, University of Stanford, Stanford, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Physics, University of Stanford, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":6.0453,"has_fulltext":false,"cited_by_count":74,"citation_normalized_percentile":{"value":0.97368057,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":93,"max":98},"biblio":{"volume":"10","issue":null,"first_page":"1065","last_page":"1071"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array-packages","display_name":"ball grid array packages","score":0.9229999780654907},{"id":"https://openalex.org/keywords/solder-joint-shear-strength","display_name":"solder joint shear strength","score":0.7910000085830688},{"id":"https://openalex.org/keywords/friction-velocity","display_name":"friction velocity","score":0.9860000014305115},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.7269999980926514},{"id":"https://openalex.org/keywords/load-displacement-curve","display_name":"load-displacement curve","score":0.7509999871253967},{"id":"https://openalex.org/keywords/stress-analysis","display_name":"stress analysis","score":0.4970000088214874}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.941166877746582},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6695429086685181},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6669721007347107},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.6350878477096558},{"id":"https://openalex.org/C41151612","wikidata":"https://www.wikidata.org/wiki/Q5280388","display_name":"Direct shear test","level":3,"score":0.5852768421173096},{"id":"https://openalex.org/C96035792","wikidata":"https://www.wikidata.org/wiki/Q43606218","display_name":"Shear (geology)","level":2,"score":0.5692192316055298},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4868678152561188},{"id":"https://openalex.org/C21141959","wikidata":"https://www.wikidata.org/wiki/Q657936","display_name":"Shear stress","level":2,"score":0.4738132059574127},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.4427903890609741},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3852522373199463},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3624073266983032},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16656982898712158},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.08299335837364197},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.077384352684021}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/ectc.2001.927949","doi":"https://doi.org/10.1109/ectc.2001.927949","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc.2001.927949","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-47071","doi":null,"is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-47071","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320323537","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W571002254","https://openalex.org/W1756687492","https://openalex.org/W1856565664","https://openalex.org/W1930169318","https://openalex.org/W1954035747","https://openalex.org/W1962350987","https://openalex.org/W2119684719","https://openalex.org/W2125855892","https://openalex.org/W2126907177","https://openalex.org/W2131501335","https://openalex.org/W2136389601","https://openalex.org/W2150093483","https://openalex.org/W2169295691","https://openalex.org/W2502507749","https://openalex.org/W3158761656","https://openalex.org/W3211629071","https://openalex.org/W4238713580","https://openalex.org/W4241946454"],"related_works":["https://openalex.org/W2031542975","https://openalex.org/W2144774848","https://openalex.org/W2088081976","https://openalex.org/W2053291093","https://openalex.org/W2968447368","https://openalex.org/W2003501325","https://openalex.org/W2155375600","https://openalex.org/W1995644862","https://openalex.org/W1998066563","https://openalex.org/W2990702580"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"both":[3],"experimental":[4,23,97],"investigation":[5],"and":[6,35,56],"computational":[7,89,102],"analysis":[8,90],"on":[9,42,100],"the":[10,32,36,43,76,96,101,111,119],"solder":[11,26,44,77,115],"ball":[12,17,27,45,64,78,120],"shear":[13,28,37,46,58,65,79,121],"testing":[14],"conditions":[15],"for":[16],"grid":[18],"array":[19],"(BGA)":[20],"packages.":[21],"The":[22,48,81],"data":[24],"of":[25,85,114],"tests":[29],"indicate":[30],"that":[31,52],"ram":[33,54],"height":[34,55],"speed":[38,59],"have":[39],"substantial":[40],"effects":[41],"strength.":[47,66],"general":[49],"trend":[50],"shows":[51],"lower":[53],"faster":[57],"can":[60],"result":[61],"in":[62,83,92],"higher":[63],"A":[67],"two-dimensional":[68],"finite":[69],"element":[70],"model":[71],"is":[72,107],"established":[73],"to":[74,109,118],"simulate":[75],"tests.":[80],"results":[82],"terms":[84],"load-displacement":[86],"curve":[87],"from":[88],"are":[91],"good":[93],"agreement":[94],"with":[95],"data.":[98],"Based":[99],"stress":[103],"analysis,":[104],"an":[105],"effort":[106],"made":[108],"interpret":[110],"failure":[112],"mode":[113],"balls":[116],"subject":[117],"test.":[122]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":4}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2016-06-24T00:00:00"}