{"id":"https://openalex.org/W2145702144","doi":"https://doi.org/10.1109/smic.2009.4770511","title":"High Performance and High Current Integrated Inductors using a Double Ultra Thick Copper Module in an Advanced 65 nm RF CMOS Technology","display_name":"High Performance and High Current Integrated Inductors using a Double Ultra Thick Copper Module in an Advanced 65 nm RF CMOS Technology","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2145702144","doi":"https://doi.org/10.1109/smic.2009.4770511","mag":"2145702144"},"language":"en","primary_location":{"id":"doi:10.1109/smic.2009.4770511","doi":"https://doi.org/10.1109/smic.2009.4770511","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smic.2009.4770511","pdf_url":null,"source":{"id":"https://openalex.org/S7407088454","display_name":"IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015814515","display_name":"Carine Pastore","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4400573202","display_name":"Centre de Radiofr\u00e9quences, Optique et Micro-nano\u00e9lectronique des Alpes","ror":"https://ror.org/050rs7291","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4400573202","https://openalex.org/I70900168","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Pastore","raw_affiliation_strings":["IMEP-LAHC GRENOBLE, Grenoble, France","Research and Development, STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC GRENOBLE, Grenoble, France","institution_ids":["https://openalex.org/I4210139715","https://openalex.org/I4400573202"]},{"raw_affiliation_string":"Research and Development, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110624066","display_name":"F. Gianesello","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"F. Gianesello","raw_affiliation_strings":["Research and Development, STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Research and Development, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102821697","display_name":"Daniel Gloria","orcid":"https://orcid.org/0000-0003-2763-8453","observed_orcids":["https://orcid.org/0000-0003-2763-8453"]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"D. Gloria","raw_affiliation_strings":["Research and Development, STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Research and Development, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052982503","display_name":"J.-C. Giraudin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"J. C. Giraudin","raw_affiliation_strings":["Research and Development, STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Research and Development, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022174235","display_name":"O. Noblanc","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"O. Noblanc","raw_affiliation_strings":["Research and Development, STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Research and Development, STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027043887","display_name":"Philippe Benech","orcid":"https://orcid.org/0009-0003-0999-7206","observed_orcids":["https://orcid.org/0009-0003-0999-7206"]},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4400573202","display_name":"Centre de Radiofr\u00e9quences, Optique et Micro-nano\u00e9lectronique des Alpes","ror":"https://ror.org/050rs7291","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4400573202","https://openalex.org/I70900168","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Ph. Benech","raw_affiliation_strings":["IMEP-LAHC GRENOBLE, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC GRENOBLE, Grenoble, France","institution_ids":["https://openalex.org/I4210139715","https://openalex.org/I4400573202"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4685,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.60203767,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/on-chip-inductors","display_name":"on-chip inductors","score":0.9769999980926514},{"id":"https://openalex.org/keywords/quality-factor","display_name":"quality factor","score":0.8349999785423279},{"id":"https://openalex.org/keywords/integrated-inductors","display_name":"integrated inductors","score":0.6800000071525574}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.8646219968795776},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.8359115123748779},{"id":"https://openalex.org/C2776628375","wikidata":"https://www.wikidata.org/wiki/Q4839229","display_name":"Back end of line","level":3,"score":0.6859414577484131},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.6289517283439636},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5919358730316162},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5300633311271667},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4671109914779663},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.43127143383026123},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42188090085983276},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4217481017112732},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3719329535961151},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23062607645988464},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1257496476173401},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12474191188812256},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.06395137310028076},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/smic.2009.4770511","doi":"https://doi.org/10.1109/smic.2009.4770511","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smic.2009.4770511","pdf_url":null,"source":{"id":"https://openalex.org/S7407088454","display_name":"IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-00602807v1","doi":null,"is_oa":false,"landing_page_url":"https://hal.science/hal-00602807","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4405252976","host_organization_name":"Centre pour la Communication Scientifique Directe","host_organization_lineage":["https://openalex.org/I4405252976"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"SIRF 2009, Jan 2009, San Diego, Californie, United States","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:HAL:hal-01075260v1","doi":null,"is_oa":false,"landing_page_url":"https://hal.archives-ouvertes.fr/hal-01075260","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4405252976","host_organization_name":"Centre pour la Communication Scientifique Directe","host_organization_lineage":["https://openalex.org/I4405252976"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"SiRF 2009","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5378999710083008}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W4213185357","https://openalex.org/W4242790591"],"related_works":["https://openalex.org/W2050500303","https://openalex.org/W1991971691","https://openalex.org/W2163633990","https://openalex.org/W2158110501","https://openalex.org/W1505217536","https://openalex.org/W2055233472","https://openalex.org/W2022454220","https://openalex.org/W2167222234","https://openalex.org/W1942843660","https://openalex.org/W2949802115"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"high":[3,6],"Q":[4,82],"and":[5,62,86],"current":[7,65,87],"on-chip":[8],"inductors":[9,43,78],"manufactured":[10],"in":[11,32,68],"an":[12,33],"innovative":[13],"Radio":[14],"Frequency":[15],"(RF)":[16],"Back":[17],"End":[18],"Of":[19],"Line":[20],"(BEOL),":[21],"made":[22],"of":[23],"two":[24],"3":[25],"mum":[26],"thick":[27,58],"top":[28],"copper":[29,59],"levels,":[30],"integrated":[31],"Advanced":[34],"Low":[35],"Power":[36],"65":[37],"nm":[38],"RF":[39,47,98],"CMOS":[40,71],"technology.":[41],"Achieved":[42],"using":[44,55],"this":[45],"optimized":[46],"BEOL":[48],"are":[49],"firstly":[50],"reported,":[51],"compared":[52],"with":[53,64],"those":[54],"one":[56],"single":[57],"level":[60],"BEOL,":[61],"benchmarked":[63],"ones":[66],"fabricated":[67],"a":[69],"standard":[70],"BEOL.":[72],"According":[73],"to":[74,90],"measurement":[75],"results,":[76],"reported":[77],"offer":[79],"quality":[80],"factor":[81],"greater":[83],"than":[84],"22":[85],"capability":[88],"Imaxup":[89],"20":[91],"mA/mum":[92],"@":[93],"125degC,":[94],"performances":[95],"suitable":[96],"for":[97],"power":[99],"applications.":[100]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-10-25T09:29:13.331239","created_date":"2016-06-24T00:00:00"}