{"id":"https://openalex.org/W2140995083","doi":"https://doi.org/10.1557/proc-863-b3.10","title":"Effect of Plasma Treatment and TMCTS Vapor Annealing on the Reinforcement of Porous low-k Films","display_name":"Effect of Plasma Treatment and TMCTS Vapor Annealing on the Reinforcement of Porous low-k Films","publication_year":2005,"publication_date":"2005-01-01","ids":{"openalex":"https://openalex.org/W2140995083","doi":"https://doi.org/10.1557/proc-863-b3.10","mag":"2140995083"},"language":"en","primary_location":{"id":"doi:10.1557/proc-863-b3.10","doi":"https://doi.org/10.1557/proc-863-b3.10","is_oa":false,"landing_page_url":"https://doi.org/10.1557/proc-863-b3.10","pdf_url":null,"source":{"id":"https://openalex.org/S2530005873","display_name":"MRS Proceedings","issn_l":"0272-9172","issn":["0272-9172","1946-4274"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310311721","host_organization_name":"Cambridge University Press","host_organization_lineage":["https://openalex.org/P4310311721","https://openalex.org/P4310311702"],"host_organization_lineage_names":["Cambridge University Press","University of Cambridge"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MRS Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5075412015","display_name":"Kazuo Kohmura","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kazuo Kohmura","raw_affiliation_strings":["MIRAI-ASET, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASET, Tsukuba, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053542795","display_name":"Hirofumi Tanaka","orcid":"https://orcid.org/0000-0002-4378-5747","observed_orcids":["https://orcid.org/0000-0002-4378-5747"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hirofumi Tanaka","raw_affiliation_strings":["MIRAI-ASET, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASET, Tsukuba, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012875299","display_name":"Shunsuke Oike","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Shunsuke Oike","raw_affiliation_strings":["MIRAI-ASET, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASET, Tsukuba, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085828129","display_name":"Masami Murakami","orcid":"https://orcid.org/0000-0001-8795-5712","observed_orcids":["https://orcid.org/0000-0001-8795-5712"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Masami Murakami","raw_affiliation_strings":["MIRAI-ASET, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASET, Tsukuba, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044448017","display_name":"Tetsuo Ono","orcid":"https://orcid.org/0000-0002-6566-943X","observed_orcids":["https://orcid.org/0000-0002-6566-943X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tetsuo Ono","raw_affiliation_strings":["MIRAI-ASET, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASET, Tsukuba, Japan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044689386","display_name":"Yutaka Seino","orcid":"https://orcid.org/0000-0001-5291-8890","observed_orcids":["https://orcid.org/0000-0001-5291-8890"]},"institutions":[{"id":"https://openalex.org/I73613424","display_name":"National Institute of Advanced Industrial Science and Technology","ror":"https://ror.org/01703db54","country_code":"JP","type":"government","lineage":["https://openalex.org/I73613424"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yutaka Seino","raw_affiliation_strings":["MIRAI-ASRC-AIST, Tsukuba, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASRC-AIST, Tsukuba, Japan","institution_ids":["https://openalex.org/I73613424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078574228","display_name":"Takamaro Kikkawa","orcid":"https://orcid.org/0000-0001-5497-9734","observed_orcids":["https://orcid.org/0000-0001-5497-9734"]},"institutions":[{"id":"https://openalex.org/I113306721","display_name":"Hiroshima University","ror":"https://ror.org/03t78wx29","country_code":"JP","type":"education","lineage":["https://openalex.org/I113306721"]},{"id":"https://openalex.org/I73613424","display_name":"National Institute of Advanced Industrial Science and Technology","ror":"https://ror.org/01703db54","country_code":"JP","type":"government","lineage":["https://openalex.org/I73613424"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takamaro Kikkawa","raw_affiliation_strings":["MIRAI-ASRC-AIST, Tsukuba, Japan","RCNS, Hiroshima Univ., Higashi-Hiroshima, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIRAI-ASRC-AIST, Tsukuba, Japan","institution_ids":["https://openalex.org/I73613424"]},{"raw_affiliation_string":"RCNS, Hiroshima Univ., Higashi-Hiroshima, Japan","institution_ids":["https://openalex.org/I113306721"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.9004,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.69450962,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"863","issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9785000085830688,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9785000085830688,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.008200000040233135,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12420","display_name":"Silicone and Siloxane Chemistry","score":0.003100000089034438,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/porous-silica-films","display_name":"porous silica films","score":0.7680000066757202},{"id":"https://openalex.org/keywords/low-k-dielectric-films","display_name":"low-k dielectric films","score":0.8560000061988831},{"id":"https://openalex.org/keywords/argon-plasma-treatment","display_name":"argon plasma treatment","score":0.8270000219345093},{"id":"https://openalex.org/keywords/mechanical-reinforcement","display_name":"mechanical reinforcement","score":0.8460000157356262},{"id":"https://openalex.org/keywords/elastic-modulus","display_name":"elastic modulus","score":0.8519999980926514},{"id":"https://openalex.org/keywords/hardness","display_name":"hardness","score":0.9039999842643738},{"id":"https://openalex.org/keywords/cross-linked-polymer-networks","display_name":"crosslinked polymer networks","score":0.8970000147819519},{"id":"https://openalex.org/keywords/surface-hydroxylation","display_name":"surface hydroxylation","score":0.5350000262260437},{"id":"https://openalex.org/keywords/dielectric-constant","display_name":"dielectric constant","score":0.42399999499320984}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.909447193145752},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7326740026473999},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.6790076494216919},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6002789735794067},{"id":"https://openalex.org/C160892712","wikidata":"https://www.wikidata.org/wiki/Q901559","display_name":"Fourier transform infrared spectroscopy","level":2,"score":0.5733789205551147},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.5691500306129456},{"id":"https://openalex.org/C168651791","wikidata":"https://www.wikidata.org/wiki/Q211569","display_name":"Permittivity","level":3,"score":0.4971602261066437},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.46624770760536194},{"id":"https://openalex.org/C2779866884","wikidata":"https://www.wikidata.org/wiki/Q1872538","display_name":"Low-k dielectric","level":3,"score":0.4202693700790405},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.26396575570106506},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.05700734257698059},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1557/proc-863-b3.10","doi":"https://doi.org/10.1557/proc-863-b3.10","is_oa":false,"landing_page_url":"https://doi.org/10.1557/proc-863-b3.10","pdf_url":null,"source":{"id":"https://openalex.org/S2530005873","display_name":"MRS Proceedings","issn_l":"0272-9172","issn":["0272-9172","1946-4274"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310311721","host_organization_name":"Cambridge University Press","host_organization_lineage":["https://openalex.org/P4310311721","https://openalex.org/P4310311702"],"host_organization_lineage_names":["Cambridge University Press","University of Cambridge"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"MRS Proceedings","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1613744352","https://openalex.org/W2034830770","https://openalex.org/W2053206578","https://openalex.org/W2156032305"],"related_works":["https://openalex.org/W2033156723","https://openalex.org/W2156032305","https://openalex.org/W2337786849","https://openalex.org/W2091371896","https://openalex.org/W2035629523","https://openalex.org/W2481201961","https://openalex.org/W2908931758","https://openalex.org/W2462203241","https://openalex.org/W2095743883","https://openalex.org/W2541300711"],"abstract_inverted_index":null,"counts_by_year":[{"year":2018,"cited_by_count":1}],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2016-06-24T00:00:00"}