{"id":"https://openalex.org/W2138118262","doi":"https://doi.org/10.1109/relphy.2004.1315418","title":"Effect of thermal gradients on the electromigration life-time in power electronics","display_name":"Effect of thermal gradients on the electromigration life-time in power electronics","publication_year":2004,"publication_date":"2004-08-13","ids":{"openalex":"https://openalex.org/W2138118262","doi":"https://doi.org/10.1109/relphy.2004.1315418","mag":"2138118262"},"language":"en","primary_location":{"id":"doi:10.1109/relphy.2004.1315418","doi":"https://doi.org/10.1109/relphy.2004.1315418","is_oa":false,"landing_page_url":"https://doi.org/10.1109/relphy.2004.1315418","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 IEEE International Reliability Physics Symposium. Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://research.utwente.nl/en/publications/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"H.V. Nguyen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I94624287","display_name":"University of Twente","ror":"https://ror.org/006hf6230","country_code":"NL","type":"education","lineage":["https://openalex.org/I94624287"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"H.V. Nguyen","raw_affiliation_strings":["MESA+ Research Institute, University of Twente, Enschede, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MESA+ Research Institute, University of Twente, Enschede, The Netherlands","institution_ids":["https://openalex.org/I94624287"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056718393","display_name":"Cora Salm","orcid":"https://orcid.org/0000-0003-3541-2155","observed_orcids":["https://orcid.org/0000-0003-3541-2155"]},"institutions":[{"id":"https://openalex.org/I94624287","display_name":"University of Twente","ror":"https://ror.org/006hf6230","country_code":"NL","type":"education","lineage":["https://openalex.org/I94624287"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"C. Salm","raw_affiliation_strings":["MESA+ Research Institute, University of Twente, Enschede, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MESA+ Research Institute, University of Twente, Enschede, The Netherlands","institution_ids":["https://openalex.org/I94624287"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061359998","display_name":"B.H. Krabbenborg","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"B. Krabbenborg","raw_affiliation_strings":["Philips Semiconductors, Nijmegen, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Philips Semiconductors, Nijmegen, The Netherlands","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061108588","display_name":"Kirsten Weide-Zaage","orcid":"https://orcid.org/0000-0003-3438-210X","observed_orcids":["https://orcid.org/0000-0003-3438-210X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K. Weide-Zaage","raw_affiliation_strings":["Laboratorium fur Informationstechnologie, Hannover, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratorium fur Informationstechnologie, Hannover, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060056829","display_name":"J. Bisschop","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. Bisschop","raw_affiliation_strings":["Philips Semiconductors, Nijmegen, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Philips Semiconductors, Nijmegen, The Netherlands","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056476681","display_name":"A.J. Mouthaan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I94624287","display_name":"University of Twente","ror":"https://ror.org/006hf6230","country_code":"NL","type":"education","lineage":["https://openalex.org/I94624287"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"A.J. Mouthaan","raw_affiliation_strings":["MESA+ Research Institute, University of Twente, Enschede, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MESA+ Research Institute, University of Twente, Enschede, The Netherlands","institution_ids":["https://openalex.org/I94624287"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057061608","display_name":"Fred G. Kuper","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I94624287","display_name":"University of Twente","ror":"https://ror.org/006hf6230","country_code":"NL","type":"education","lineage":["https://openalex.org/I94624287"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"F.G. Kuper","raw_affiliation_strings":["MESA+ Research Institute, University of Twente, Enschede, The Netherlands","Philips Semiconductors, Nijmegen, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MESA+ Research Institute, University of Twente, Enschede, The Netherlands","institution_ids":["https://openalex.org/I94624287"]},{"raw_affiliation_string":"Philips Semiconductors, Nijmegen, The Netherlands","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":9.6821,"has_fulltext":true,"cited_by_count":34,"citation_normalized_percentile":{"value":0.98503119,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"619","last_page":"620"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.8798999786376953,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.8798999786376953,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.09040000289678574,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.006200000178068876,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.9919999837875366},{"id":"https://openalex.org/keywords/thermomigration","display_name":"thermomigration","score":0.9940000176429749},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"temperature gradient","score":0.8529999852180481},{"id":"https://openalex.org/keywords/electromigration-lifetime","display_name":"electromigration lifetime","score":0.9639999866485596},{"id":"https://openalex.org/keywords/power-electronics","display_name":"power electronics","score":0.7699999809265137},{"id":"https://openalex.org/keywords/semiconductor-reliability","display_name":"semiconductor reliability","score":0.36399999260902405}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9992769360542297},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.7749454975128174},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6239029169082642},{"id":"https://openalex.org/C15401063","wikidata":"https://www.wikidata.org/wiki/Q610090","display_name":"Thermophoresis","level":4,"score":0.5225790739059448},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4835243225097656},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.454624205827713},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.18250399827957153},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1643809676170349},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1393994688987732},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08373746275901794},{"id":"https://openalex.org/C155672457","wikidata":"https://www.wikidata.org/wiki/Q61231","display_name":"Nanoparticle","level":2,"score":0.0},{"id":"https://openalex.org/C21946209","wikidata":"https://www.wikidata.org/wiki/Q1989679","display_name":"Nanofluid","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/relphy.2004.1315418","doi":"https://doi.org/10.1109/relphy.2004.1315418","is_oa":false,"landing_page_url":"https://doi.org/10.1109/relphy.2004.1315418","pdf_url":null,"source":{"id":"https://openalex.org/S4210238090","display_name":"IEEE International Reliability Physics Symposium proceedings","issn_l":"0735-0791","issn":["0735-0791","1541-7026","1938-1891"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 IEEE International Reliability Physics Symposium. Proceedings","raw_type":"proceedings-article"},{"id":"pmh:oai:ris.utwente.nl:openaire/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","doi":null,"is_oa":true,"landing_page_url":"https://research.utwente.nl/en/publications/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","pdf_url":null,"source":{"id":"https://openalex.org/S4406922991","display_name":"University of Twente Research Information","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Nguyen, H V, Salm, C, Krabbenborg, B, Weide-Zaage, K, Bisschop, J, Mouthaan, A J & Kuper, F G 2004, Effect of thermal gradients on the electromigration lifetime in power electronics. in 2004 IEEE International Reliability Physics Symposium proceedings : 42nd Annual : Phoenix, Arizona, April 25-29, 2004 . IEEE, Piscataway, NJ, pp. 619-620, 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004, Phoenix, Arizona, United States, 25/04/04. https://doi.org/10.1109/RELPHY.2004.1315418","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:ut:oai:ris.utwente.nl:publications/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","doi":null,"is_oa":false,"landing_page_url":"https://research.utwente.nl/en/publications/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","pdf_url":null,"source":{"id":"https://openalex.org/S4406922991","display_name":"University of Twente Research Information","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2004 IEEE International Reliability Physics Symposium proceedings: 42nd Annual : Phoenix, Arizona, April 25-29, 2004, 619 - 620","raw_type":"info:eu-repo/semantics/conferencepaper"}],"best_oa_location":{"id":"pmh:oai:ris.utwente.nl:openaire/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","doi":null,"is_oa":true,"landing_page_url":"https://research.utwente.nl/en/publications/2ba51ea2-b133-4bcc-beb4-c26dcbc5af23","pdf_url":null,"source":{"id":"https://openalex.org/S4406922991","display_name":"University of Twente Research Information","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Nguyen, H V, Salm, C, Krabbenborg, B, Weide-Zaage, K, Bisschop, J, Mouthaan, A J & Kuper, F G 2004, Effect of thermal gradients on the electromigration lifetime in power electronics. in 2004 IEEE International Reliability Physics Symposium proceedings : 42nd Annual : Phoenix, Arizona, April 25-29, 2004 . IEEE, Piscataway, NJ, pp. 619-620, 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004, Phoenix, Arizona, United States, 25/04/04. https://doi.org/10.1109/RELPHY.2004.1315418","raw_type":"info:eu-repo/semantics/conferenceObject"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W113636360","https://openalex.org/W1994434760","https://openalex.org/W2007719944","https://openalex.org/W2014898886","https://openalex.org/W2016745542","https://openalex.org/W2046896054"],"related_works":["https://openalex.org/W2117064431","https://openalex.org/W4376606735","https://openalex.org/W4413074478","https://openalex.org/W2112720641","https://openalex.org/W4415970886","https://openalex.org/W1960072520","https://openalex.org/W1836380706","https://openalex.org/W4396980757","https://openalex.org/W2030653793","https://openalex.org/W1659131491"],"abstract_inverted_index":{"The":[0],"combined":[1],"effects":[2],"of":[3,18,35],"electromigration":[4,11],"and":[5],"thermomigration":[6,27],"are":[7,13],"studied.":[8],"Significantly":[9],"shorter":[10],"lifetimes":[12],"observed":[14],"in":[15],"the":[16,33],"presence":[17],"a":[19],"temperature":[20,36],"gradient.":[21],"This":[22],"cannot":[23],"be":[24],"explained":[25],"by":[26],"only,":[28],"but":[29],"is":[30],"attributed":[31],"to":[32],"effect":[34],"gradient":[37],"on":[38],"electromigration-induced":[39],"failures.":[40]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2022,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":3}],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2016-06-24T00:00:00"}