{"id":"https://openalex.org/W2136104106","doi":"https://doi.org/10.1063/1.1800290","title":"High-power-density spot cooling using bulk thermoelectrics","display_name":"High-power-density spot cooling using bulk thermoelectrics","publication_year":2004,"publication_date":"2004-10-04","ids":{"openalex":"https://openalex.org/W2136104106","doi":"https://doi.org/10.1063/1.1800290","mag":"2136104106"},"language":"en","primary_location":{"id":"doi:10.1063/1.1800290","doi":"https://doi.org/10.1063/1.1800290","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.1800290","pdf_url":null,"source":{"id":"https://openalex.org/S105243760","display_name":"Applied Physics Letters","issn_l":"0003-6951","issn":["0003-6951","1077-3118","1520-8842"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-a","jufo-3","ki-jl-1","norway-2","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Applied Physics Letters","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://escholarship.org/content/qt0j2975j6/qt0j2975j6.pdf?t=lnokkd","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100456450","display_name":"Yan Zhang","orcid":"https://orcid.org/0000-0003-4877-4323","observed_orcids":["https://orcid.org/0000-0003-4877-4323"]},"institutions":[{"id":"https://openalex.org/I185103710","display_name":"University of California, Santa Cruz","ror":"https://ror.org/03s65by71","country_code":"US","type":"education","lineage":["https://openalex.org/I185103710"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yan Zhang","raw_affiliation_strings":["Electrical Engineering Departmemt of University of California , Santa Cruz, California 9405"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Departmemt of University of California , Santa Cruz, California 9405","institution_ids":["https://openalex.org/I185103710"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110147009","display_name":"Ali Shakouri","orcid":"https://orcid.org/0009-0002-1381-8947","observed_orcids":["https://orcid.org/0009-0002-1381-8947"]},"institutions":[{"id":"https://openalex.org/I185103710","display_name":"University of California, Santa Cruz","ror":"https://ror.org/03s65by71","country_code":"US","type":"education","lineage":["https://openalex.org/I185103710"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ali Shakouri","raw_affiliation_strings":["Electrical Engineering Departmemt of University of California , Santa Cruz, California 9405"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Departmemt of University of California , Santa Cruz, California 9405","institution_ids":["https://openalex.org/I185103710"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032420438","display_name":"Gehong Zeng","orcid":"https://orcid.org/0000-0002-8472-1643","observed_orcids":["https://orcid.org/0000-0002-8472-1643"]},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gehong Zeng","raw_affiliation_strings":["Electrical and Computer Engineering Department of University of California , Santa Barbara, California 93106"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department of University of California , Santa Barbara, California 93106","institution_ids":["https://openalex.org/I154570441"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.7019,"has_fulltext":true,"cited_by_count":32,"citation_normalized_percentile":{"value":0.8182646,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"85","issue":"14","first_page":"2977","last_page":"2979"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spot-cooling","display_name":"spot cooling","score":0.6830000281333923},{"id":"https://openalex.org/keywords/bulk-silicon","display_name":"bulk silicon","score":0.44699999690055847},{"id":"https://openalex.org/keywords/solid-geometry","display_name":"solid geometry","score":0.7749999761581421},{"id":"https://openalex.org/keywords/cooling-power-density","display_name":"cooling power density","score":0.8309999704360962},{"id":"https://openalex.org/keywords/heat-spreading","display_name":"heat spreading","score":0.8360000252723694},{"id":"https://openalex.org/keywords/current-spreading","display_name":"current spreading","score":0.800000011920929},{"id":"https://openalex.org/keywords/thermoelectric-figure-of-merit","display_name":"figure of merit ZT","score":0.6970000267028809},{"id":"https://openalex.org/keywords/microelectronics-thermal-management","display_name":"microelectronics thermal management","score":0.48100000619888306}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7368524074554443},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6506656408309937},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.6137241125106812},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.5976975560188293},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.573234498500824},{"id":"https://openalex.org/C112625512","wikidata":"https://www.wikidata.org/wiki/Q1091448","display_name":"Seebeck coefficient","level":3,"score":0.566929817199707},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.5389156937599182},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.47888559103012085},{"id":"https://openalex.org/C116615679","wikidata":"https://www.wikidata.org/wiki/Q6795908","display_name":"Maximum power principle","level":3,"score":0.475192666053772},{"id":"https://openalex.org/C26873012","wikidata":"https://www.wikidata.org/wiki/Q214781","display_name":"Condensed matter physics","level":1,"score":0.3918444812297821},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3636157512664795},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.3424297869205475},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.2938125729560852},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.2142356038093567},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.185116708278656},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1333828866481781},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1063/1.1800290","doi":"https://doi.org/10.1063/1.1800290","is_oa":false,"landing_page_url":"https://doi.org/10.1063/1.1800290","pdf_url":null,"source":{"id":"https://openalex.org/S105243760","display_name":"Applied Physics Letters","issn_l":"0003-6951","issn":["0003-6951","1077-3118","1520-8842"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-a","jufo-3","ki-jl-1","norway-2","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Applied Physics Letters","raw_type":"journal-article"},{"id":"pmh:oai:escholarship.org/ark:/13030/qt0j2975j6","doi":null,"is_oa":true,"landing_page_url":"https://escholarship.org/uc/item/0j2975j6","pdf_url":"https://escholarship.org/content/qt0j2975j6/qt0j2975j6.pdf?t=lnokkd","source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Applied Physics Letters, vol 85, iss 14","raw_type":"article"},{"id":"pmh:qt0j2975j6","doi":null,"is_oa":false,"landing_page_url":"http://www.escholarship.org/uc/item/0j2975j6","pdf_url":null,"source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Zhang, Y; Shakouri, A; & Zeng, G H. (2004). High-power-density spot cooling using bulk thermoelectrics. Applied Physics Letters, 85(14), 2977 - 2979. UC Santa Cruz: Retrieved from: http://www.escholarship.org/uc/item/0j2975j6","raw_type":"article"}],"best_oa_location":{"id":"pmh:oai:escholarship.org/ark:/13030/qt0j2975j6","doi":null,"is_oa":true,"landing_page_url":"https://escholarship.org/uc/item/0j2975j6","pdf_url":"https://escholarship.org/content/qt0j2975j6/qt0j2975j6.pdf?t=lnokkd","source":{"id":"https://openalex.org/S4306400115","display_name":"eScholarship (California Digital Library)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I2801248553","host_organization_name":"California Digital Library","host_organization_lineage":["https://openalex.org/I2801248553"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Applied Physics Letters, vol 85, iss 14","raw_type":"article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.75,"id":"https://metadata.un.org/sdg/7"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2136104106.pdf","grobid_xml":"https://content.openalex.org/works/W2136104106.grobid-xml"},"referenced_works_count":4,"referenced_works":["https://openalex.org/W389868541","https://openalex.org/W1990754123","https://openalex.org/W2082959659","https://openalex.org/W2141251919"],"related_works":["https://openalex.org/W2294587811","https://openalex.org/W2139896909","https://openalex.org/W1983607373","https://openalex.org/W2100320004","https://openalex.org/W2032309457","https://openalex.org/W7098803513","https://openalex.org/W2077515074","https://openalex.org/W2065972107","https://openalex.org/W2096762537","https://openalex.org/W2127517595"],"abstract_inverted_index":{"We":[0,35],"demonstrate":[1],"a":[2,37,43],"three-dimensional":[3],"(3D)":[4],"bulk":[5,46],"silicon":[6,47],"microcooler,":[7],"which":[8,50],"has":[9],"the":[10,28,73,79],"advantages":[11],"of":[12,40,59],"high":[13],"cooling":[14,39,56,75],"power":[15,57],"densities":[16],"and":[17,67],"is":[18,51],"less":[19],"dependent":[20],"on":[21],"thermoelectric":[22,82],"element\u2019s":[23],"thickness":[24],"as":[25],"compared":[26],"with":[27,31],"same":[29],"device":[30],"one-dimensional":[32],"(1D)":[33],"geometry.":[34],"measured":[36],"maximum":[38,74],"1.2\u00b0C":[41],"for":[42],"40\u00d740\u03bcm2":[44],"area":[45],"microcooler":[48],"device,":[49],"equivalent":[52],"to":[53,77],"an":[54],"estimated":[55],"density":[58],"580W\u2215cm2.":[60],"In":[61],"this":[62],"unique":[63],"geometry,":[64],"both":[65],"current":[66],"heat":[68],"spreading":[69],"in":[70],"3D":[71],"allows":[72],"temperature":[76],"exceed":[78],"conventional":[80],"1D":[81],"model\u2019s":[83],"theoretical":[84],"limit":[85],"0.5ZTc2.":[86]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":2}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}