{"id":"https://openalex.org/W2134286663","doi":"https://doi.org/10.1109/50.956142","title":"Design and testing of a kinematic package supporting a 32\u00d732 array of GaAs MQW modulators flip-chip bonded to a CMOS chip","display_name":"Design and testing of a kinematic package supporting a 32\u00d732 array of GaAs MQW modulators flip-chip bonded to a CMOS chip","publication_year":2001,"publication_date":"2001-01-01","ids":{"openalex":"https://openalex.org/W2134286663","doi":"https://doi.org/10.1109/50.956142","mag":"2134286663"},"language":"en","primary_location":{"id":"doi:10.1109/50.956142","doi":"https://doi.org/10.1109/50.956142","is_oa":false,"landing_page_url":"https://doi.org/10.1109/50.956142","pdf_url":null,"source":{"id":"https://openalex.org/S2307745","display_name":"Journal of Lightwave Technology","issn_l":"0733-8724","issn":["0733-8724","1558-2213"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","jufo-3","ki-jl-1","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Lightwave Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022471711","display_name":"Michael H. Ayliffe","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M.H. Ayliffe","raw_affiliation_strings":["Picolight, Inc.orporated, Boulder, CO, USA","Picolight Inc., Boulder, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Picolight, Inc.orporated, Boulder, CO, USA","institution_ids":[]},{"raw_affiliation_string":"Picolight Inc., Boulder, CO, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020619841","display_name":"David R. Rolston","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D.R. Rolston","raw_affiliation_strings":["FCI Canada, Dorval, QUE, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FCI Canada, Dorval, QUE, Canada","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012324740","display_name":"Alan E. L. Chuah","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"A.E.L. Chuah","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113457613","display_name":"\u00c9. Bernier","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I153908563","display_name":"Nortel (Canada)","ror":"https://ror.org/03rz4pm90","country_code":"CA","type":"company","lineage":["https://openalex.org/I153908563"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"E. Bernier","raw_affiliation_strings":["Nortel Networks Limited, Kanata, ONT, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nortel Networks Limited, Kanata, ONT, Canada","institution_ids":["https://openalex.org/I153908563"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055659908","display_name":"F.S.J. Michael","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"F.S.J. Michael","raw_affiliation_strings":["Xanoptix Inc.orporated, Nashua, NH, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xanoptix Inc.orporated, Nashua, NH, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088638106","display_name":"D. Kabal","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. Kabal","raw_affiliation_strings":["Picolight, Inc.orporated, Boulder, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Picolight, Inc.orporated, Boulder, CO, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081805052","display_name":"Andrew G. Kirk","orcid":"https://orcid.org/0000-0002-6759-0506","observed_orcids":["https://orcid.org/0000-0002-6759-0506"]},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"A.G. Kirk","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080230991","display_name":"David V. Plant","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"D.V. Plant","raw_affiliation_strings":["Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, McGill University, Montreal, QUE, Canada","institution_ids":["https://openalex.org/I5023651"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":2.403,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.88574119,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"19","issue":"10","first_page":"1543","last_page":"1559"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14158","display_name":"Optical Systems and Laser Technology","score":0.0020000000949949026,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.0020000000949949026,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip-bonding","display_name":"flip-chip bonding","score":0.9629999995231628},{"id":"https://openalex.org/keywords/cmos-integration","display_name":"CMOS integration","score":0.6980000138282776},{"id":"https://openalex.org/keywords/copper-heat-spreader","display_name":"copper heat spreader","score":0.8029999732971191},{"id":"https://openalex.org/keywords/thermoelectric-cooler","display_name":"thermoelectric cooler","score":0.9919999837875366},{"id":"https://openalex.org/keywords/heat-sinks","display_name":"heat sinks","score":0.7459999918937683},{"id":"https://openalex.org/keywords/chip-on-board","display_name":"chip-on-board","score":0.8330000042915344},{"id":"https://openalex.org/keywords/flexible-printed-circuit-board","display_name":"flexible printed circuit board","score":0.9229999780654907},{"id":"https://openalex.org/keywords/crosstalk","display_name":"crosstalk","score":0.8259999752044678},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"thermal resistance","score":0.7409999966621399}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8847417235374451},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6866028308868408},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5749155282974243},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5653664469718933},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5580118298530579},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.5454167127609253},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5396912097930908},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.5014755725860596},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4584483802318573},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.45563405752182007},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4479036331176758},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.4251026511192322},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3898733854293823},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3377600610256195},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30513957142829895},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.28547194600105286},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.2108965814113617},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08945754170417786},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08576112985610962},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/50.956142","doi":"https://doi.org/10.1109/50.956142","is_oa":false,"landing_page_url":"https://doi.org/10.1109/50.956142","pdf_url":null,"source":{"id":"https://openalex.org/S2307745","display_name":"Journal of Lightwave Technology","issn_l":"0733-8724","issn":["0733-8724","1558-2213"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-a","jufo-3","ki-jl-1","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Lightwave Technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4943999946117401}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320310638","display_name":"McGill University","ror":"https://ror.org/01pxwe438"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":41,"referenced_works":["https://openalex.org/W1546460110","https://openalex.org/W1550363369","https://openalex.org/W1986015006","https://openalex.org/W2002000718","https://openalex.org/W2011707165","https://openalex.org/W2028322204","https://openalex.org/W2032077314","https://openalex.org/W2035104398","https://openalex.org/W2038335243","https://openalex.org/W2041443738","https://openalex.org/W2056591373","https://openalex.org/W2057371707","https://openalex.org/W2060360929","https://openalex.org/W2073003920","https://openalex.org/W2078340335","https://openalex.org/W2081917477","https://openalex.org/W2083408056","https://openalex.org/W2084554588","https://openalex.org/W2088982918","https://openalex.org/W2112010113","https://openalex.org/W2117071941","https://openalex.org/W2121855598","https://openalex.org/W2130810458","https://openalex.org/W2131722625","https://openalex.org/W2135731874","https://openalex.org/W2136967931","https://openalex.org/W2139810789","https://openalex.org/W2155220200","https://openalex.org/W2155638734","https://openalex.org/W2161186460","https://openalex.org/W2165270294","https://openalex.org/W2180318942","https://openalex.org/W2991928031","https://openalex.org/W3021473614","https://openalex.org/W3157065213","https://openalex.org/W4229612144","https://openalex.org/W4247554045","https://openalex.org/W4285719527","https://openalex.org/W4295679857","https://openalex.org/W4303099822","https://openalex.org/W6771324167"],"related_works":["https://openalex.org/W2127401942","https://openalex.org/W2055426507","https://openalex.org/W2144988028","https://openalex.org/W2121520706","https://openalex.org/W2104432792","https://openalex.org/W2101248448","https://openalex.org/W2160452897","https://openalex.org/W4294968813","https://openalex.org/W1509841015","https://openalex.org/W2113210389"],"abstract_inverted_index":{"Innovative":[0],"approaches":[1],"to":[2,24,118,152],"the":[3,62,79,83,119,146,154],"design":[4,76],"and":[5,50,59],"packaging":[6],"of":[7,16,69,82,131,148,160,168],"a":[8,12,25,39,42,46,65,86,102,109,129,149,164],"high-performance":[9],"module":[10,37,84],"supporting":[11],"32/spl":[13],"times/32":[14],"array":[15,56],"GaAs":[17],"multiple":[18],"quantum-well":[19],"(MQW)":[20],"modulators":[21],"flip-chip":[22],"bonded":[23],"9/spl":[26],"times/9":[27],"mm/sup":[28],"2/":[29],"complementary":[30],"metal-oxide-semiconductor":[31],"(CMOS)":[32],"chip":[33,63,97,155],"are":[34],"described.":[35],"The":[36,54,74,96,137],"integrates":[38],"minilens":[40,55],"array,":[41],"copper":[43],"heat":[44],"spreader,":[45],"thermoelectric":[47],"cooler":[48],"(TEC)":[49],"an":[51,157],"aluminum":[52],"heatsink.":[53],"is":[57,98,141],"aligned":[58],"packaged":[60],"with":[61,90,128],"using":[64,108],"novel":[66],"six":[67],"degrees":[68],"freedom":[70],"(DOFs)":[71],"alignment":[72],"technique.":[73],"kinematic":[75],"allows":[77],"for":[78,93,145],"manual":[80],"insertion":[81],"into":[85],"free-space":[87],"optical":[88],"system":[89],"no":[91],"need":[92],"further":[94],"adjustments.":[95],"mounted":[99],"directly":[100],"on":[101],"flexible":[103],"printed":[104],"circuit":[105],"board":[106],"(PCB)":[107],"chip-on-board":[110],"approach,":[111],"providing":[112],"over":[113],"200":[114],"bond":[115],"pad":[116],"connections":[117],"chip.":[120],"Impedance-controlled":[121],"lines":[122],"were":[123],"operated":[124],"at":[125,156],"1.0":[126],"Gb/s":[127],"crosstalk":[130],"4.0%":[132],"between":[133],"nearest":[134],"neighbor":[135],"lines.":[136],"junction-to-TEC":[138],"thermal":[139,166],"resistance":[140],"0.4/spl":[142],"deg/C/W,":[143],"allowing":[144],"use":[147],"single-stage":[150],"TEC":[151],"regulate":[153],"operating":[158],"temperature":[159],"40/spl":[161],"deg/C":[162],"under":[163],"maximum":[165],"load":[167],"13.1":[169],"W.":[170]},"counts_by_year":[],"updated_date":"2026-09-23T05:00:35.095934","created_date":"2016-06-24T00:00:00"}