{"id":"https://openalex.org/W2133710167","doi":"https://doi.org/10.1149/2.0181507jss","title":"Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity","display_name":"Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity","publication_year":2015,"publication_date":"2015-01-01","ids":{"openalex":"https://openalex.org/W2133710167","doi":"https://doi.org/10.1149/2.0181507jss","mag":"2133710167"},"language":"en","primary_location":{"id":"doi:10.1149/2.0181507jss","doi":"https://doi.org/10.1149/2.0181507jss","is_oa":false,"landing_page_url":"https://doi.org/10.1149/2.0181507jss","pdf_url":null,"source":{"id":"https://openalex.org/S2493531148","display_name":"ECS Journal of Solid State Science and Technology","issn_l":"2162-8769","issn":["2162-8769","2162-8777"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Journal of Solid State Science and Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/11250/2484023","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048849357","display_name":"Nishant Malik","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]},{"id":"https://openalex.org/I184942183","display_name":"University of Oslo","ror":"https://ror.org/01xtthb56","country_code":"NO","type":"education","lineage":["https://openalex.org/I184942183"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"N. Malik","raw_affiliation_strings":["Centre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway","SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","#N#         aCentre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway#N#","#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway","institution_ids":["https://openalex.org/I184942183"]},{"raw_affiliation_string":"SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"#N#         aCentre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway#N#","institution_ids":["https://openalex.org/I184942183"]},{"raw_affiliation_string":"#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027263449","display_name":"Erik U Poppe","orcid":"https://orcid.org/0000-0001-6542-3803","observed_orcids":["https://orcid.org/0000-0001-6542-3803"]},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"E. Poppe","raw_affiliation_strings":["SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087435159","display_name":"Kari Schj\u00f8lberg\u2010Henriksen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"K. Schj\u00f8lberg-Henriksen","raw_affiliation_strings":["SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"#N#         b#N#         SINTEF ICT, Department of Microsystems and Nanotechnology, N-0314 Oslo, Norway#N#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111643313","display_name":"Maaike M. Visser Taklo","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I173888879","display_name":"SINTEF","ror":"https://ror.org/01f677e56","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"M. M. V. Taklo","raw_affiliation_strings":["SINTEF ICT, Department of Instrumentation, N-0314 Oslo, Norway","#N#         c#N#         SINTEF ICT, Department of Instrumentation, N-0314 Oslo, Norway#N#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SINTEF ICT, Department of Instrumentation, N-0314 Oslo, Norway","institution_ids":["https://openalex.org/I173888879"]},{"raw_affiliation_string":"#N#         c#N#         SINTEF ICT, Department of Instrumentation, N-0314 Oslo, Norway#N#","institution_ids":["https://openalex.org/I173888879"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048483464","display_name":"T. G. Finstad","orcid":"https://orcid.org/0000-0003-1293-3126","observed_orcids":["https://orcid.org/0000-0003-1293-3126"]},"institutions":[{"id":"https://openalex.org/I184942183","display_name":"University of Oslo","ror":"https://ror.org/01xtthb56","country_code":"NO","type":"education","lineage":["https://openalex.org/I184942183"]}],"countries":["NO"],"is_corresponding":false,"raw_author_name":"T. G. Finstad","raw_affiliation_strings":["Centre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway","#N#         aCentre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway#N#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway","institution_ids":["https://openalex.org/I184942183"]},{"raw_affiliation_string":"#N#         aCentre for Materials Science and Nanotechnology, University of Oslo, Oslo, Norway#N#","institution_ids":["https://openalex.org/I184942183"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":1950,"currency":"USD","value_usd":1950},"apc_paid":null,"fwci":0.466,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.68726628,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"4","issue":"7","first_page":"P251","last_page":"P257"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7856000065803528,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7856000065803528,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.2053000032901764,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.004600000102072954,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-level-bonding","display_name":"wafer-level bonding","score":0.8080000281333923},{"id":"https://openalex.org/keywords/hermeticity","display_name":"hermeticity","score":0.921999990940094},{"id":"https://openalex.org/keywords/bond-strength","display_name":"bond strength","score":0.9570000171661377},{"id":"https://openalex.org/keywords/moisture-resistance","display_name":"moisture resistance","score":0.4790000021457672},{"id":"https://openalex.org/keywords/thermal-shock","display_name":"thermal shock","score":0.8349999785423279},{"id":"https://openalex.org/keywords/membrane-deflection","display_name":"membrane deflection","score":0.8370000123977661},{"id":"https://openalex.org/keywords/bond-parameters","display_name":"bonding parameters","score":0.6100000143051147},{"id":"https://openalex.org/keywords/mems-packaging","display_name":"MEMS packaging","score":0.5199999809265137},{"id":"https://openalex.org/keywords/reliability-testing","display_name":"reliability testing","score":0.38499999046325684}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8961131572723389},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.764592707157135},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.6398863792419434},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.5665839314460754},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5193803906440735},{"id":"https://openalex.org/C159096172","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bond strength","level":4,"score":0.4996821880340576},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.42500734329223633},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3249031901359558},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.15730315446853638},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08750969171524048},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.06769555807113647},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1149/2.0181507jss","doi":"https://doi.org/10.1149/2.0181507jss","is_oa":false,"landing_page_url":"https://doi.org/10.1149/2.0181507jss","pdf_url":null,"source":{"id":"https://openalex.org/S2493531148","display_name":"ECS Journal of Solid State Science and Technology","issn_l":"2162-8769","issn":["2162-8769","2162-8777"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Journal of Solid State Science and Technology","raw_type":"journal-article"},{"id":"pmh:oai:sintef.brage.unit.no:11250/2484023","doi":null,"is_oa":true,"landing_page_url":"http://hdl.handle.net/11250/2484023","pdf_url":null,"source":{"id":"https://openalex.org/S7407064446","display_name":"NORA - Norwegian Open Research Archives","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"P251-P257","raw_type":"info:eu-repo/semantics/article"},{"id":"pmh:oai:www.duo.uio.no:10852/61275","doi":null,"is_oa":true,"landing_page_url":"http://hdl.handle.net/10852/61275","pdf_url":null,"source":{"id":"https://openalex.org/S7407064446","display_name":"NORA - Norwegian Open Research Archives","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2162-8769","raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":{"id":"pmh:oai:sintef.brage.unit.no:11250/2484023","doi":null,"is_oa":true,"landing_page_url":"http://hdl.handle.net/11250/2484023","pdf_url":null,"source":{"id":"https://openalex.org/S7407064446","display_name":"NORA - Norwegian Open Research Archives","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"P251-P257","raw_type":"info:eu-repo/semantics/article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320323299","display_name":"Norges Forskningsr\u00e5d","ror":"https://ror.org/00epmv149"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W382599870","https://openalex.org/W1976424883","https://openalex.org/W1993126309","https://openalex.org/W1996128645","https://openalex.org/W2003766830","https://openalex.org/W2015295389","https://openalex.org/W2082003521","https://openalex.org/W2090741076","https://openalex.org/W2091013611","https://openalex.org/W2134005170","https://openalex.org/W2166141037","https://openalex.org/W2169698898","https://openalex.org/W4297987115"],"related_works":["https://openalex.org/W2038480393","https://openalex.org/W1993411039","https://openalex.org/W7100818645","https://openalex.org/W1996128645","https://openalex.org/W4231396661","https://openalex.org/W1993126309","https://openalex.org/W2797181752","https://openalex.org/W2734701086","https://openalex.org/W2395323510","https://openalex.org/W2326303168"],"abstract_inverted_index":{"Hermeticity,":[0],"reliability":[1],"and":[2,92,104],"strength":[3,98,185],"of":[4,18,44,113,118,152,186],"Al-Al":[5],"thermocompression":[6],"bonds":[7],"realized":[8,23],"by":[9,24,67,79,101],"applying":[10,40,109],"different":[11],"bonding":[12,25,34],"parameters":[13],"have":[14],"been":[15],"investigated.":[16],"Laminates":[17,107],"diameter":[19],"150":[20],"mm":[21],"were":[22,38,65],"wafers":[26,31],"containing":[27],"membrane":[28,68,130,169],"structures":[29],"to":[30,54,83,157,194],"with":[32,71],"patterned":[33],"frames.":[35],"The":[36,62,162,181],"laminates":[37,82,190],"bonded":[39,108],"a":[41,84,88,93,110,145],"bond":[42,111,184],"force":[43,112],"36":[45],"or":[46,59,120,139],"60":[47,60,114],"kN":[48,115],"at":[49,116],"temperatures":[50,117],"ranging":[51],"from":[52,168,188,192],"300":[53],"400\u00b0C":[55,121],"for":[56,178],"15,":[57],"30":[58],"minutes.":[61],"hermetic":[63,124],"properties":[64],"estimated":[66,167],"deflection":[69,131,170],"measurements":[70,171],"white-light":[72],"interferometry":[73],"after":[74,134,155],"bonding.":[75],"Reliability":[76],"was":[77,99,132,148,172],"tested":[78],"exposing":[80],"the":[81,135,140,153,158],"steady-state":[85,136],"life":[86,137],"test,":[87,91],"thermal":[89,141],"shock":[90,142],"moisture":[94,159],"resistance":[95,160],"test.":[96,143,161],"Bond":[97],"measured":[100,182],"shear":[102],"test":[103,138],"pull":[105],"tests.":[106],"350":[119],"resulted":[122],"in":[123,129,150],"bonds.":[125],"No":[126],"significant":[127],"change":[128],"observed":[133,149],"However,":[144],"gross":[146],"leakage":[147,164],"1\u201311%":[151],"dies":[154,187],"exposure":[156],"maximum":[163],"rate":[165],"(MLR)":[166],"below":[173],"10":[174],"\u221211":[175],"mbar\u00b7l\u00b7s":[176],"\u22121":[177],"all":[179],"laminates.":[180],"average":[183],"selected":[189],"ranged":[191],"28":[193],"190":[195],"MPa.":[196]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-06-24T00:00:00"}