{"id":"https://openalex.org/W2132829258","doi":"https://doi.org/10.1109/test.1999.805883","title":"Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment","display_name":"Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment","publication_year":2003,"publication_date":"2003-01-20","ids":{"openalex":"https://openalex.org/W2132829258","doi":"https://doi.org/10.1109/test.1999.805883","mag":"2132829258"},"language":"en","primary_location":{"id":"doi:10.1109/test.1999.805883","doi":"https://doi.org/10.1109/test.1999.805883","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805883","pdf_url":null,"source":{"id":"https://openalex.org/S4210209697","display_name":"IEEE International Test Conference (ITC)","issn_l":"1089-3539","issn":["1089-3539","2378-2250"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109237661","display_name":"P. Nigh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Nigh","raw_affiliation_strings":["Essex Junction, IBM Microelectronics, VT, USA","[IBM Microelectron., Essex Junction, VT, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Essex Junction, IBM Microelectronics, VT, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Microelectron., Essex Junction, VT, USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019000106","display_name":"David P. Vallett","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Vallett","raw_affiliation_strings":["Essex Junction, IBM Microelectronics, VT, USA","[IBM Microelectronics]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Essex Junction, IBM Microelectronics, VT, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Microelectronics]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108620595","display_name":"A. M. Patel","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Patel","raw_affiliation_strings":["Essex Junction, IBM Microelectronics, Fishkill, NY, USA","[IBM Microelectronics]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Essex Junction, IBM Microelectronics, Fishkill, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Microelectronics]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084353041","display_name":"Jason Wright","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Wright","raw_affiliation_strings":["Essex Junction, IBM Microelectronics, VT, USA","[IBM Microelectronics]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Essex Junction, IBM Microelectronics, VT, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Microelectronics]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075278282","display_name":"Franco Motika","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"F. Motika","raw_affiliation_strings":["Micrus Corporation, Fishkill, NY, USA","Micrus Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micrus Corporation, Fishkill, NY, USA","institution_ids":[]},{"raw_affiliation_string":"Micrus Corporation","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065671404","display_name":"Donato Forlenza","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. Forlenza","raw_affiliation_strings":["Micrus Corporation, Fishkill, NY, USA","Micrus Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micrus Corporation, Fishkill, NY, USA","institution_ids":[]},{"raw_affiliation_string":"Micrus Corporation","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027629528","display_name":"Ray Kurtulik","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Kurtulik","raw_affiliation_strings":["Micrus Corporation, Fishkill, NY, USA","Micrus Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micrus Corporation, Fishkill, NY, USA","institution_ids":[]},{"raw_affiliation_string":"Micrus Corporation","institution_ids":[]}]},{"author_position":"last","author":{"id":null,"display_name":"W. Chong","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. Chong","raw_affiliation_strings":["Micrus Corporation, Fishkill, NY, USA","Micrus Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micrus Corporation, Fishkill, NY, USA","institution_ids":[]},{"raw_affiliation_string":"Micrus Corporation","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":9.5114,"has_fulltext":false,"cited_by_count":53,"citation_normalized_percentile":{"value":0.98704234,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1152","last_page":"1161"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8676999807357788,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.8676999807357788,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.1289999932050705,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/iddq-testing","display_name":"IDDQ testing","score":0.6759999990463257},{"id":"https://openalex.org/keywords/timing-failures","display_name":"timing failures","score":0.6050000190734863},{"id":"https://openalex.org/keywords/failure-analysis","display_name":"failure analysis","score":0.6050000190734863},{"id":"https://openalex.org/keywords/test-method-evaluation","display_name":"test method evaluation","score":0.6940000057220459},{"id":"https://openalex.org/keywords/semiconductor-device-reliability","display_name":"semiconductor device reliability","score":0.5509999990463257},{"id":"https://openalex.org/keywords/fault-diagnosis","display_name":"fault diagnosis","score":0.8769999742507935},{"id":"https://openalex.org/keywords/physical-analysis","display_name":"physical analysis","score":0.4320000112056732}],"concepts":[{"id":"https://openalex.org/C206678392","wikidata":"https://www.wikidata.org/wiki/Q5987815","display_name":"Iddq testing","level":3,"score":0.9798927307128906},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.7924216985702515},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6100966334342957},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.5317505598068237},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5039669871330261},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.49970483779907227},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4293450117111206},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.1259777545928955},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.06787967681884766},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.1999.805883","doi":"https://doi.org/10.1109/test.1999.805883","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805883","pdf_url":null,"source":{"id":"https://openalex.org/S4210209697","display_name":"IEEE International Test Conference (ITC)","issn_l":"1089-3539","issn":["1089-3539","2378-2250"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W59256056","https://openalex.org/W105182170","https://openalex.org/W1527363716","https://openalex.org/W1833973233","https://openalex.org/W2004437077","https://openalex.org/W2037964522","https://openalex.org/W2069520100","https://openalex.org/W2100827158","https://openalex.org/W2107479796","https://openalex.org/W2112978605","https://openalex.org/W2121871782","https://openalex.org/W2129563753","https://openalex.org/W2144963173","https://openalex.org/W2151244242","https://openalex.org/W2154418718","https://openalex.org/W2160445869","https://openalex.org/W2167138208","https://openalex.org/W2171908682","https://openalex.org/W2505380584"],"related_works":["https://openalex.org/W7101063145","https://openalex.org/W3114676154","https://openalex.org/W2112978605","https://openalex.org/W2540668569","https://openalex.org/W2100875390","https://openalex.org/W2078897458","https://openalex.org/W2186833290","https://openalex.org/W2563491269","https://openalex.org/W1891206988","https://openalex.org/W1989101070"],"abstract_inverted_index":{"SEMATECH":[0],"has":[1],"sponsored":[2],"a":[3],"\"Test":[4],"Method":[5],"Evaluation\"":[6],"study":[7],"to":[8],"understand":[9],"the":[10,13,20,25,28],"trade-offs":[11],"among":[12],"most":[14],"common":[15],"test":[16],"methodologies":[17],"used":[18],"in":[19],"industry.":[21],"This":[22],"paper":[23],"presents":[24],"results":[26,45],"of":[27,32],"failure":[29],"analysis":[30,44],"portion":[31],"that":[33],"project.":[34],"The":[35],"testing,":[36],"reliability":[37],"stressing,":[38],"characterization,":[39],"fault":[40],"diagnosis":[41],"and":[42,54],"physical":[43],"are":[46],"presented":[47],"for":[48],"25":[49],"devices":[50],"including":[51],"\"IDDq-only\"":[52],"failures":[53],"\"delay":[55],"test-only\"":[56],"failures.":[57]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2016-06-24T00:00:00"}