{"id":"https://openalex.org/W2130158657","doi":"https://doi.org/10.1109/tsm.2005.858457","title":"Impact of CMP Consumables on Copper Metallization Reliability","display_name":"Impact of CMP Consumables on Copper Metallization Reliability","publication_year":2005,"publication_date":"2005-11-01","ids":{"openalex":"https://openalex.org/W2130158657","doi":"https://doi.org/10.1109/tsm.2005.858457","mag":"2130158657"},"language":"en","primary_location":{"id":"doi:10.1109/tsm.2005.858457","doi":"https://doi.org/10.1109/tsm.2005.858457","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsm.2005.858457","pdf_url":null,"source":{"id":"https://openalex.org/S14676311","display_name":"IEEE Transactions on Semiconductor Manufacturing","issn_l":"0894-6507","issn":["0894-6507","1558-2345"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Semiconductor Manufacturing","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://stars.library.ucf.edu/facultybib2000/5520","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022917315","display_name":"Yaw S. Obeng","orcid":"https://orcid.org/0000-0002-4880-1689","observed_orcids":["https://orcid.org/0000-0002-4880-1689"]},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y.S. Obeng","raw_affiliation_strings":["Texas Instruments, Inc., Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049445436","display_name":"Jeffrey Earl Ramsdell","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I430192","display_name":"Appalachian State University","ror":"https://ror.org/051m4vc48","country_code":"US","type":"education","lineage":["https://openalex.org/I430192"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.E. Ramsdell","raw_affiliation_strings":["Appalachian State University, Boone, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Appalachian State University, Boone, NC, USA","institution_ids":["https://openalex.org/I430192"]}]},{"author_position":"middle","author":{"id":null,"display_name":"S. Deshpande","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Deshpande","raw_affiliation_strings":["AMPAC, Department of Mechanical, Materials and AeroSpace Engineering, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AMPAC, Department of Mechanical, Materials and AeroSpace Engineering, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113124620","display_name":"S. C. Kuiry","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210117800","display_name":"Campbell Scientific (Canada)","ror":"https://ror.org/02951hv89","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210117800"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"S.C. Kuiry","raw_affiliation_strings":["Center for Tribology, Inc., Campbell, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Tribology, Inc., Campbell, CA, USA","institution_ids":["https://openalex.org/I4210117800"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075256946","display_name":"Karima Chamma","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Chamma","raw_affiliation_strings":["CREOL, School of Optics, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CREOL, School of Optics, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034189303","display_name":"Kathleen A. Richardson","orcid":"https://orcid.org/0000-0002-2960-6714","observed_orcids":["https://orcid.org/0000-0002-2960-6714"]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]},{"id":"https://openalex.org/I8078737","display_name":"Clemson University","ror":"https://ror.org/037s24f05","country_code":"US","type":"education","lineage":["https://openalex.org/I8078737"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K.A. Richardson","raw_affiliation_strings":["CREOL, School of Optics, University of Central Florida, Orlando, FL, USA","School of Material Science and Engineering, Clemson University, Clemson, SC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CREOL, School of Optics, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]},{"raw_affiliation_string":"School of Material Science and Engineering, Clemson University, Clemson, SC, USA","institution_ids":["https://openalex.org/I8078737"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5026168431","display_name":"Sudipta Seal","orcid":"https://orcid.org/0000-0002-0963-3344","observed_orcids":["https://orcid.org/0000-0002-0963-3344"]},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Seal","raw_affiliation_strings":["AMPAC, Department of Mechanical, Materials and AeroSpace Engineering, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AMPAC, Department of Mechanical, Materials and AeroSpace Engineering, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":1.8125,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.88372221,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"18","issue":"4","first_page":"688","last_page":"694"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-mechanical-polishing","display_name":"chemical mechanical polishing","score":0.9829999804496765},{"id":"https://openalex.org/keywords/copper-metallization","display_name":"copper metallization","score":0.9660000205039978},{"id":"https://openalex.org/keywords/device-reliability","display_name":"device reliability","score":0.6970000267028809}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.9199042916297913},{"id":"https://openalex.org/C62126406","wikidata":"https://www.wikidata.org/wiki/Q1681365","display_name":"Consumables","level":2,"score":0.915726900100708},{"id":"https://openalex.org/C2777686893","wikidata":"https://www.wikidata.org/wiki/Q424370","display_name":"Polyolefin","level":3,"score":0.8941936492919922},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8051831722259521},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7189427018165588},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6967320442199707},{"id":"https://openalex.org/C2779578285","wikidata":"https://www.wikidata.org/wiki/Q146322","display_name":"Polyurethane","level":2,"score":0.6754565238952637},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.45073994994163513},{"id":"https://openalex.org/C94293008","wikidata":"https://www.wikidata.org/wiki/Q23925154","display_name":"Slurry","level":2,"score":0.44324690103530884},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.4254448413848877},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3660123944282532},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3528430461883545},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.24098962545394897},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.12093967199325562},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/tsm.2005.858457","doi":"https://doi.org/10.1109/tsm.2005.858457","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsm.2005.858457","pdf_url":null,"source":{"id":"https://openalex.org/S14676311","display_name":"IEEE Transactions on Semiconductor Manufacturing","issn_l":"0894-6507","issn":["0894-6507","1558-2345"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Semiconductor Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:stars.library.ucf.edu:facultybib2000-6519","doi":null,"is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/facultybib2000/5520","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","vabb-shw"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Faculty Bibliography 2000s","raw_type":"text"},{"id":"pmh:oai:stars.library.ucf.edu:scopus2000-4585","doi":null,"is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/scopus2000/3586","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","vabb-shw"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Scopus Export 2000s","raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:stars.library.ucf.edu:facultybib2000-6519","doi":null,"is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/facultybib2000/5520","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","vabb-shw"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Faculty Bibliography 2000s","raw_type":"text"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332478","display_name":"U.S. Forest Service","ror":"https://ror.org/03zmjc935"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1524259252","https://openalex.org/W1986329512","https://openalex.org/W1994857637","https://openalex.org/W2003984826","https://openalex.org/W2045383364","https://openalex.org/W2045728438","https://openalex.org/W2050534596","https://openalex.org/W2087307175","https://openalex.org/W2533938810","https://openalex.org/W2726542089","https://openalex.org/W2943761892"],"related_works":["https://openalex.org/W4255763432","https://openalex.org/W2786713844","https://openalex.org/W4240028749","https://openalex.org/W2111890837","https://openalex.org/W7168634132","https://openalex.org/W2378967433","https://openalex.org/W4311905901","https://openalex.org/W1578665081","https://openalex.org/W2045019257","https://openalex.org/W2741633219"],"abstract_inverted_index":{"Over":[0],"the":[1,5,14,20,34,47,69,96,105,108,113,121],"past":[2],"few":[3],"years,":[4],"chemical":[6],"mechanical":[7],"planarization":[8],"(CMP)":[9],"community":[10],"has":[11],"systematically":[12],"characterized":[13],"device":[15,40],"reliability":[16],"issues":[17],"associated":[18],"with":[19,66],"introduction":[21],"of":[22,33,36,49,68,107,125,129],"copper":[23,51,73,80],"metallization":[24],"into":[25,120],"integrated":[26],"circuit":[27],"fabrication.":[28,115],"To":[29],"gain":[30],"further":[31],"understanding":[32],"impact":[35],"CMP":[37],"processing":[38],"on":[39,83,104],"performance,":[41],"this":[42],"paper":[43],"reports":[44],"in":[45,72,112],"detail":[46],"interactions":[48],"simulated":[50],"slurries":[52],"and":[53,86,98,123],"pristine":[54],"segmented":[55],"polyurethanes.":[56],"These":[57,116],"studies":[58],"clearly":[59],"show":[60],"that":[61],"polyurethane":[62,85,97],"is":[63],"fundamentally":[64],"incompatible":[65],"some":[67],"chemicals":[70],"used":[71,111],"CMP,":[74],"such":[75],"as":[76],"hydrogen":[77],"peroxide.":[78],"Experimental":[79],"polishing":[81],"data":[82],"both":[84],"polyolefin-based":[87,99],"pads":[88,100],"are":[89,101,118],"compared.":[90],"The":[91],"pad":[92,114],"performance":[93],"differences":[94],"between":[95],"explained":[102],"based":[103],"chemistry":[106],"base":[109],"polymers":[110],"results":[117],"incorporated":[119],"design":[122],"fabrication":[124],"a":[126],"new":[127],"class":[128],"polyolefins-based":[130],"application":[131],"specific":[132],"pads.":[133]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2016-06-24T00:00:00"}