{"id":"https://openalex.org/W2128307441","doi":"https://doi.org/10.1109/tadvp.2006.871186","title":"Novel Method for Simultaneous Formation of Wires and Vias of a Printed Circuit Board Using Nanoporous Body","display_name":"Novel Method for Simultaneous Formation of Wires and Vias of a Printed Circuit Board Using Nanoporous Body","publication_year":2006,"publication_date":"2006-05-01","ids":{"openalex":"https://openalex.org/W2128307441","doi":"https://doi.org/10.1109/tadvp.2006.871186","mag":"2128307441"},"language":"en","primary_location":{"id":"doi:10.1109/tadvp.2006.871186","doi":"https://doi.org/10.1109/tadvp.2006.871186","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tadvp.2006.871186","pdf_url":null,"source":{"id":"https://openalex.org/S138446831","display_name":"IEEE Transactions on Advanced Packaging","issn_l":"1521-3323","issn":["1521-3323","1557-9980"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Advanced Packaging","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112719198","display_name":"K. Asakawa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Asakawa","raw_affiliation_strings":["Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]},{"raw_affiliation_string":"[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113675409","display_name":"S. Matake","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Matake","raw_affiliation_strings":["Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]},{"raw_affiliation_string":"[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060836694","display_name":"Yasuyuki Hotta","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y. Hotta","raw_affiliation_strings":["Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]},{"raw_affiliation_string":"[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]","institution_ids":["https://openalex.org/I1292669757"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111461168","display_name":"T. Hiraoka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Hiraoka","raw_affiliation_strings":["Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan","institution_ids":["https://openalex.org/I1292669757"]},{"raw_affiliation_string":"[Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan]","institution_ids":["https://openalex.org/I1292669757"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1292669757"],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.3281,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.68664079,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"29","issue":"2","first_page":"211","last_page":"217"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.2797999978065491,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.2797999978065491,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.25999999046325684,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.0794999971985817,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flexible-printed-circuit-board","display_name":"flexible printed circuit board","score":0.8169999718666077},{"id":"https://openalex.org/keywords/nanoporous-substrates","display_name":"nanoporous substrates","score":0.9279999732971191},{"id":"https://openalex.org/keywords/copper-impregnation","display_name":"copper impregnation","score":0.8460000157356262},{"id":"https://openalex.org/keywords/photomask-design","display_name":"mask design","score":0.9139999747276306},{"id":"https://openalex.org/keywords/fine-pitch-interconnects","display_name":"fine pitch interconnects","score":0.5699999928474426}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.9426603317260742},{"id":"https://openalex.org/C48940184","wikidata":"https://www.wikidata.org/wiki/Q17623309","display_name":"Nanoporous","level":2,"score":0.745542049407959},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.695838451385498},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6766263246536255},{"id":"https://openalex.org/C14737013","wikidata":"https://www.wikidata.org/wiki/Q1319657","display_name":"Photomask","level":4,"score":0.5404930710792542},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.5064772367477417},{"id":"https://openalex.org/C134256836","wikidata":"https://www.wikidata.org/wiki/Q545913","display_name":"Backplane","level":2,"score":0.4846670925617218},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4164672791957855},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.411787748336792},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2672432065010071},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23620226979255676},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.21110376715660095},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14525845646858215},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.12262406945228577},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.11901786923408508},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10507115721702576},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08536273241043091},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tadvp.2006.871186","doi":"https://doi.org/10.1109/tadvp.2006.871186","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tadvp.2006.871186","pdf_url":null,"source":{"id":"https://openalex.org/S138446831","display_name":"IEEE Transactions on Advanced Packaging","issn_l":"1521-3323","issn":["1521-3323","1557-9980"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Advanced Packaging","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7207000255584717,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2063071171","https://openalex.org/W2071376671","https://openalex.org/W2107398534","https://openalex.org/W2131945652","https://openalex.org/W2158949054","https://openalex.org/W2229342622","https://openalex.org/W3150209903","https://openalex.org/W4205700093"],"related_works":["https://openalex.org/W570263142","https://openalex.org/W1994834921","https://openalex.org/W2070198704","https://openalex.org/W2034230625","https://openalex.org/W2035046378","https://openalex.org/W2021733108","https://openalex.org/W4247796121","https://openalex.org/W2127364740","https://openalex.org/W2168428136","https://openalex.org/W4377713400"],"abstract_inverted_index":{"A":[0,42],"new":[1,43,59],"type":[2],"of":[3,31,65,76,83],"a":[4,15,38,52,58,66],"flexible":[5],"printed":[6,33],"circuit":[7,34],"board":[8,35,89],"with":[9,55],"landless":[10,93],"vias":[11,30,94],"is":[12,90,104],"developed":[13],"using":[14],"novel":[16],"method":[17,25,47],"called":[18],"interconnection":[19],"via":[20,72],"nanoporous":[21,53],"structure":[22],"(INPS).":[23],"This":[24],"can":[26],"make":[27],"wires":[28],"and":[29,57,73,95,109],"the":[32,84,87,101],"simultaneously":[36],"by":[37,92,107],"single":[39],"photo-exposure":[40],"process.":[41],"photo-induced":[44],"selective":[45],"plating":[46],"was":[48,61],"used":[49],"to":[50,100],"impregnate":[51],"substrate":[54],"copper,":[56],"photomask":[60],"designed,":[62],"which":[63],"constitutes":[64],"completely":[67],"vacant":[68],"large":[69],"hole":[70],"for":[71,80],"aggregation":[74],"patterns":[75],"very":[77,96],"fine":[78,97],"holes":[79],"wire.":[81],"Because":[82],"simple":[85],"process,":[86],"INPS":[88],"characterized":[91,106],"circuit.":[98],"Owing":[99],"structure,":[102],"it":[103],"also":[105],"flexibility":[108],"detachable":[110],"wires.":[111]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2016-06-24T00:00:00"}