{"id":"https://openalex.org/W2117608378","doi":"https://doi.org/10.1109/tsm.2003.822735","title":"Characterization of Spatial Intrafield Gate CD Variability, Its Impact on Circuit Performance, and Spatial Mask-Level Correction","display_name":"Characterization of Spatial Intrafield Gate CD Variability, Its Impact on Circuit Performance, and Spatial Mask-Level Correction","publication_year":2004,"publication_date":"2004-02-01","ids":{"openalex":"https://openalex.org/W2117608378","doi":"https://doi.org/10.1109/tsm.2003.822735","mag":"2117608378"},"language":"en","primary_location":{"id":"doi:10.1109/tsm.2003.822735","doi":"https://doi.org/10.1109/tsm.2003.822735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsm.2003.822735","pdf_url":null,"source":{"id":"https://openalex.org/S14676311","display_name":"IEEE Transactions on Semiconductor Manufacturing","issn_l":"0894-6507","issn":["0894-6507","1558-2345"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Semiconductor Manufacturing","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090899796","display_name":"Michael E. Orshansky","orcid":"https://orcid.org/0000-0002-6223-4748","observed_orcids":["https://orcid.org/0000-0002-6223-4748"]},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Orshansky","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Technology, Austin, TX, USA","Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Technology, Austin, TX, USA","institution_ids":[]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA#TAB#","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032107826","display_name":"Linda S. Milor","orcid":"https://orcid.org/0000-0002-8244-4793","observed_orcids":["https://orcid.org/0000-0002-8244-4793"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. Milor","raw_affiliation_strings":["Department of Electrical Engineering and Computer Sciences, Georgia Institute of Technology, Atlanta, GA, USA","[Georgia Institute of Technology.]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Sciences, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[Georgia Institute of Technology.]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058605789","display_name":"Chenming Calvin Hu","orcid":"https://orcid.org/0000-0003-0836-6296","observed_orcids":["https://orcid.org/0000-0003-0836-6296","https://orcid.org/0009-0000-9599-3401"]},"institutions":[{"id":"https://openalex.org/I2803209242","display_name":"University of California System","ror":"https://ror.org/00pjdza24","country_code":"US","type":"education","lineage":["https://openalex.org/I2803209242"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Hu","raw_affiliation_strings":["Department of Electrical Engineering and Computer Sciences, University of California, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Sciences, University of California, CA, USA","institution_ids":["https://openalex.org/I2803209242"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":9.1868,"has_fulltext":false,"cited_by_count":99,"citation_normalized_percentile":{"value":0.98175209,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":"17","issue":"1","first_page":"2","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.4377000033855438,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.4377000033855438,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.3815999925136566,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.06930000334978104,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spatial-variability","display_name":"spatial variability","score":0.5789999961853027},{"id":"https://openalex.org/keywords/layout-dependent-effects","display_name":"layout effects","score":0.5529999732971191},{"id":"https://openalex.org/keywords/yield-improvement","display_name":"yield improvement","score":0.7419999837875366},{"id":"https://openalex.org/keywords/variance-reduction","display_name":"variance reduction","score":0.5569999814033508}],"concepts":[{"id":"https://openalex.org/C94747663","wikidata":"https://www.wikidata.org/wiki/Q7574086","display_name":"Spatial variability","level":2,"score":0.6087103486061096},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6049496531486511},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5854043960571289},{"id":"https://openalex.org/C93389723","wikidata":"https://www.wikidata.org/wiki/Q7247313","display_name":"Process variation","level":3,"score":0.574612021446228},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4997541904449463},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.47097066044807434},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.4586496353149414},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4554171562194824},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45032066106796265},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4346696138381958},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.4284370541572571},{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.4150782823562622},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.3935680091381073},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32542112469673157},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.19023388624191284},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.17582327127456665},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1558239459991455},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1317233145236969},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08978927135467529},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tsm.2003.822735","doi":"https://doi.org/10.1109/tsm.2003.822735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsm.2003.822735","pdf_url":null,"source":{"id":"https://openalex.org/S14676311","display_name":"IEEE Transactions on Semiconductor Manufacturing","issn_l":"0894-6507","issn":["0894-6507","1558-2345"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Semiconductor Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.470.2528","doi":null,"is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.470.2528","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.bioee.ee.columbia.edu/courses/upload/Bibliography/orshansky2004.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320307757","display_name":"Advanced Micro Devices","ror":"https://ror.org/04kd6c783"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1601842572","https://openalex.org/W1979616688","https://openalex.org/W1997832506","https://openalex.org/W2024332750","https://openalex.org/W2107566947","https://openalex.org/W2127451853","https://openalex.org/W2167232152","https://openalex.org/W2171836507","https://openalex.org/W2533387447","https://openalex.org/W2536059287"],"related_works":["https://openalex.org/W1982280659","https://openalex.org/W2541512954","https://openalex.org/W2105982376","https://openalex.org/W2107566947","https://openalex.org/W65868862","https://openalex.org/W1966618006","https://openalex.org/W1693570377","https://openalex.org/W2140362342","https://openalex.org/W2140437015","https://openalex.org/W2079661650"],"abstract_inverted_index":{"The":[0,36],"authors":[1,37,170],"present":[2],"a":[3,24,120,172],"comprehensive":[4,51],"characterization":[5,19,62],"method":[6],"applied":[7],"to":[8,160,179,191],"the":[9,12,32,39,47,55,59,70,103,125,140,149,162,169,181,193,216],"study":[10],"of":[11,20,42,58,67,102,105,143,164,195,211],"state-of-the-art":[13],"18-/spl":[14],"mu/m":[15],"CMOS":[16],"process.":[17],"Statistical":[18],"gate":[21,144,175],"CD":[22,72,117,145,176],"reveals":[23],"large":[25],"spatial":[26,141,174],"intrafield":[27,106,116,182],"component,":[28,151],"strongly":[29],"dependent":[30],"on":[31,108,124],"local":[33],"layout":[34],"patterns.":[35],"describe":[38,54],"statistical":[40,81,100],"analysis":[41,101],"this":[43,212],"data":[44],"and":[45,80,86,167,183,186],"demonstrate":[46,138],"need":[48],"for":[49,76,83,155,197],"such":[50],"characterization.":[52],"They":[53,113,200],"experimental":[56],"setup":[57],"novel":[60],"measurement-based":[61],"approach":[63],"that":[64,115,129,139,202],"is":[65,89,111,152],"capable":[66],"capturing":[68],"all":[69],"relevant":[71],"variation":[73,118],"patterns":[74],"necessary":[75],"accurate":[77],"circuit":[78,109,127,165],"modeling":[79],"design":[82],"increased":[84],"performance":[85,110,128,166],"yield.":[87],"Characterization":[88],"based":[90,95],"upon":[91],"an":[92,188],"inexpensive":[93],"electrically":[94],"measurement":[96],"technique.":[97],"A":[98],"rigorous":[99],"impact":[104],"variability":[107,185],"undertaken.":[112],"show":[114],"has":[119],"significant":[121,204],"detrimental":[122],"effect":[123],"overall":[126,184],"may":[130],"be":[131,207],"as":[132,134],"high":[133],"25%.":[135],"Moreover,":[136],"they":[137],"component":[142],"variability,":[146],"rather":[147],"than":[148],"proximity-dependent":[150],"predominantly":[153],"responsible":[154],"speed":[156],"degradation.":[157],"In":[158],"order":[159],"reduce":[161,180],"degradation":[163],"yield,":[168],"propose":[171],"mask-level":[173],"correction":[177,196],"algorithm":[178],"provide":[187],"analytical":[189],"model":[190],"evaluate":[192],"effectiveness":[194],"variance":[198],"reduction.":[199],"believe":[201],"potentially":[203],"benefits":[205],"can":[206],"achieved":[208],"through":[209],"implementation":[210],"compensation":[213],"technique":[214],"in":[215],"production":[217],"environment.":[218]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":3}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}