{"id":"https://openalex.org/W2111584591","doi":"https://doi.org/10.1149/2.006205ssl","title":"Effective Charge Number of Cu in Cu-Sn Compound","display_name":"Effective Charge Number of Cu in Cu-Sn Compound","publication_year":2012,"publication_date":"2012-08-29","ids":{"openalex":"https://openalex.org/W2111584591","doi":"https://doi.org/10.1149/2.006205ssl","mag":"2111584591"},"language":"en","primary_location":{"id":"doi:10.1149/2.006205ssl","doi":"https://doi.org/10.1149/2.006205ssl","is_oa":true,"landing_page_url":"https://doi.org/10.1149/2.006205ssl","pdf_url":"https://iopscience.iop.org/article/10.1149/2.006205ssl/pdf","source":{"id":"https://openalex.org/S2492252179","display_name":"ECS Solid State Letters","issn_l":"2162-8742","issn":["2162-8742","2162-8750"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310320195","host_organization_name":"Electrochemical Society","host_organization_lineage":["https://openalex.org/P4310320195"],"host_organization_lineage_names":["Electrochemical Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Solid State Letters","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://iopscience.iop.org/article/10.1149/2.006205ssl/pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103713970","display_name":"Chao-Hsin Lu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. T. Lu","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100754233","display_name":"Yang Hu","orcid":"https://orcid.org/0000-0002-8943-2584","observed_orcids":["https://orcid.org/0000-0002-8943-2584"]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. J. Hu","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052306661","display_name":"Yite Liu","orcid":"https://orcid.org/0009-0001-9342-9476","observed_orcids":["https://orcid.org/0009-0001-9342-9476"]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. S. Liu","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080816106","display_name":"T. S. Huang","orcid":"https://orcid.org/0000-0002-4137-8988","observed_orcids":["https://orcid.org/0000-0002-4137-8988"]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"T. S. Huang","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":null,"display_name":"H. W. Tseng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"H. W. Tseng","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034968176","display_name":"C. Y. Chen","orcid":"https://orcid.org/0000-0002-9896-5841","observed_orcids":["https://orcid.org/0000-0002-9896-5841"]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. Y. Chen","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088699916","display_name":"Cheng\u2010Yi Liu","orcid":"https://orcid.org/0000-0002-0930-2609","observed_orcids":["https://orcid.org/0000-0002-0930-2609"]},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. Y. Liu","raw_affiliation_strings":["Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-li 32001, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I22265921"],"apc_list":null,"apc_paid":null,"fwci":0.2001,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.60826874,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"1","issue":"5","first_page":"P73","last_page":"P75"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6211000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.6211000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.3393999934196472,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.00430000014603138,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/effective-charge-number","display_name":"effective charge number","score":0.9769999980926514},{"id":"https://openalex.org/keywords/cu6sn5","display_name":"Cu6Sn5","score":0.8399999737739563},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.8629999756813049},{"id":"https://openalex.org/keywords/current-stress","display_name":"current stress","score":0.47200000286102295},{"id":"https://openalex.org/keywords/solder-joint-interface","display_name":"solder joint interface","score":0.4050000011920929}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9840408563613892},{"id":"https://openalex.org/C49110097","wikidata":"https://www.wikidata.org/wiki/Q175233","display_name":"Cathode","level":2,"score":0.8035026788711548},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7600281238555908},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.5178244709968567},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.49883079528808594},{"id":"https://openalex.org/C68709404","wikidata":"https://www.wikidata.org/wiki/Q1134475","display_name":"Flux (metallurgy)","level":2,"score":0.44439640641212463},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.42994049191474915},{"id":"https://openalex.org/C138775182","wikidata":"https://www.wikidata.org/wiki/Q909960","display_name":"Effective nuclear charge","level":3,"score":0.42957940697669983},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.42889925837516785},{"id":"https://openalex.org/C188082385","wikidata":"https://www.wikidata.org/wiki/Q73792","display_name":"Charge (physics)","level":2,"score":0.4254091680049896},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.35104990005493164},{"id":"https://openalex.org/C159467904","wikidata":"https://www.wikidata.org/wiki/Q2001702","display_name":"Chemical physics","level":1,"score":0.33093857765197754},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22782939672470093},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20107483863830566},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.19911399483680725},{"id":"https://openalex.org/C145148216","wikidata":"https://www.wikidata.org/wiki/Q36496","display_name":"Ion","level":2,"score":0.19618430733680725},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.18884587287902832},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.17715734243392944},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.11830058693885803},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.05755797028541565},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C170154142","wikidata":"https://www.wikidata.org/wiki/Q150737","display_name":"Architectural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1149/2.006205ssl","doi":"https://doi.org/10.1149/2.006205ssl","is_oa":true,"landing_page_url":"https://doi.org/10.1149/2.006205ssl","pdf_url":"https://iopscience.iop.org/article/10.1149/2.006205ssl/pdf","source":{"id":"https://openalex.org/S2492252179","display_name":"ECS Solid State Letters","issn_l":"2162-8742","issn":["2162-8742","2162-8750"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310320195","host_organization_name":"Electrochemical Society","host_organization_lineage":["https://openalex.org/P4310320195"],"host_organization_lineage_names":["Electrochemical Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Solid State Letters","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1149/2.006205ssl","doi":"https://doi.org/10.1149/2.006205ssl","is_oa":true,"landing_page_url":"https://doi.org/10.1149/2.006205ssl","pdf_url":"https://iopscience.iop.org/article/10.1149/2.006205ssl/pdf","source":{"id":"https://openalex.org/S2492252179","display_name":"ECS Solid State Letters","issn_l":"2162-8742","issn":["2162-8742","2162-8750"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310320195","host_organization_name":"Electrochemical Society","host_organization_lineage":["https://openalex.org/P4310320195"],"host_organization_lineage_names":["Electrochemical Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ECS Solid State Letters","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G3503486993","display_name":null,"funder_award_id":"101-3113-E-008-001","funder_id":"https://openalex.org/F4320321040","funder_display_name":"National Science Council"}],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"},{"id":"https://openalex.org/F4320323229","display_name":"National Central University","ror":"https://ror.org/00944ve71"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2111584591.pdf","grobid_xml":"https://content.openalex.org/works/W2111584591.grobid-xml"},"referenced_works_count":1,"referenced_works":["https://openalex.org/W2469732947"],"related_works":["https://openalex.org/W2124887630","https://openalex.org/W2148350413","https://openalex.org/W2019420858","https://openalex.org/W1978400550","https://openalex.org/W7097202243","https://openalex.org/W2338300051","https://openalex.org/W2051295990","https://openalex.org/W2528964209","https://openalex.org/W1963868785","https://openalex.org/W2319462445"],"abstract_inverted_index":{"As":[0],"current-stressing":[1],"a":[2,34],"Cu/Sn":[3],"joint":[4,37],"interface,":[5],"the":[6,10,17,44,52,56,63,67,72,80,91],"Cu":[7,53,69,74,88,92],"atoms":[8,54,89],"in":[9,55,71,90],"interfacial":[11],"cathode":[12,73],"Cu-Sn":[13,57],"compound":[14,78,96],"would":[15],"experience":[16],"direct":[18],"electromigration":[19,46,68],"force":[20,24],"and":[21,40,47],"chemical":[22,48],"potential":[23],"simultaneously,":[25],"which":[26],"have":[27],"never":[28],"been":[29],"decoupled.":[30],"In":[31,59],"this":[32],"work,":[33],"triple-junction":[35],"Cu-Sn-Cu":[36],"was":[38],"designed":[39],"current-stressed":[41],"to":[42,100],"separate":[43],"above":[45],"forces":[49],"imposed":[50],"on":[51],"compound.":[58],"addition,":[60],"by":[61],"obtaining":[62],"individual":[64],"value":[65],"of":[66,87],"flux":[70],"6":[75,93],"Sn":[76,94],"5":[77,95],"layer,":[79],"effective":[81],"charge":[82],"number":[83],"(Z":[84],"*":[85],")":[86],"can":[97],"be":[98,101],"determined":[99],"35.6.":[102]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}