{"id":"https://openalex.org/W2107927141","doi":"https://doi.org/10.1109/mwsym.2002.1012316","title":"High performance spiral inductors embedded on organic substrates for SOP applications","display_name":"High performance spiral inductors embedded on organic substrates for SOP applications","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2107927141","doi":"https://doi.org/10.1109/mwsym.2002.1012316","mag":"2107927141"},"language":"en","primary_location":{"id":"doi:10.1109/mwsym.2002.1012316","doi":"https://doi.org/10.1109/mwsym.2002.1012316","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwsym.2002.1012316","pdf_url":null,"source":{"id":"https://openalex.org/S4210185519","display_name":"IEEE MTT-S International Microwave Symposium digest","issn_l":"0149-645X","issn":["0149-645X","2576-7216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108228663","display_name":"S.H. Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S.H. Lee","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021785278","display_name":"Sung-Hwan Min","orcid":"https://orcid.org/0000-0003-3931-4376","observed_orcids":["https://orcid.org/0000-0003-3931-4376"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Min","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006266667","display_name":"D. Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Kim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025467545","display_name":"Sidharth Dalmia","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Dalmia","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068649748","display_name":"W. Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. Kim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112847870","display_name":"V. Sundaram","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V. Sundaram","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113805810","display_name":"Swapan K. Bhattacharya","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Bhattacharya","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":null,"display_name":"G. White","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. White","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081523432","display_name":"Farrokh Ayazi","orcid":"https://orcid.org/0000-0002-4539-7393","observed_orcids":["https://orcid.org/0000-0002-4539-7393"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Ayazi","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049894002","display_name":"James Stevenson Kenney","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.S. Kenney","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085554167","display_name":"Madhavan Swaminathan","orcid":"https://orcid.org/0000-0003-1729-2807","observed_orcids":["https://orcid.org/0000-0003-1729-2807"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Swaminathan","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045655197","display_name":"Rao Tummala","orcid":"https://orcid.org/0000-0003-2284-7600","observed_orcids":["https://orcid.org/0000-0003-2284-7600"]},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R.R. Tummala","raw_affiliation_strings":["School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Sch. of Electr. & Comput. Eng.,, Georgia Inst. of Technol., Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":3.891,"has_fulltext":false,"cited_by_count":21,"citation_normalized_percentile":{"value":0.9399661,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"3","issue":null,"first_page":"2229","last_page":"2232"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.625,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.625,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.3208000063896179,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.012600000016391277,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spiral-inductors","display_name":"spiral inductors","score":0.9980000257492065},{"id":"https://openalex.org/keywords/organic-substrates","display_name":"organic substrates","score":0.7860000133514404},{"id":"https://openalex.org/keywords/system-on-package","display_name":"system-on-package","score":0.8450000286102295},{"id":"https://openalex.org/keywords/mcm-l","display_name":"MCM-L","score":0.8130000233650208},{"id":"https://openalex.org/keywords/quality-factor","display_name":"quality factor","score":0.8920000195503235},{"id":"https://openalex.org/keywords/self-resonant-frequency","display_name":"self-resonant frequency","score":0.9800000190734863},{"id":"https://openalex.org/keywords/inductance","display_name":"inductance","score":0.8970000147819519},{"id":"https://openalex.org/keywords/flip-chip-mounting","display_name":"flip-chip mounting","score":0.7620000243186951},{"id":"https://openalex.org/keywords/bandpass-filter","display_name":"bandpass filter","score":0.734000027179718},{"id":"https://openalex.org/keywords/voltage-controlled-oscillator","display_name":"voltage-controlled oscillator","score":0.796999990940094}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.9549281597137451},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.7924046516418457},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5863842964172363},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.559910774230957},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5370498895645142},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.5131474137306213},{"id":"https://openalex.org/C147788027","wikidata":"https://www.wikidata.org/wiki/Q2718101","display_name":"Band-pass filter","level":2,"score":0.5016019344329834},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.4882374107837677},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48209336400032043},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4409022629261017},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37779709696769714},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26585349440574646},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17612627148628235},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.10560593008995056},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0975533127784729},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwsym.2002.1012316","doi":"https://doi.org/10.1109/mwsym.2002.1012316","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwsym.2002.1012316","pdf_url":null,"source":{"id":"https://openalex.org/S4210185519","display_name":"IEEE MTT-S International Microwave Symposium digest","issn_l":"0149-645X","issn":["0149-645X","2576-7216"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2050438295","https://openalex.org/W2153429334","https://openalex.org/W2160428624","https://openalex.org/W3217269181"],"related_works":["https://openalex.org/W1973881232","https://openalex.org/W2164762249","https://openalex.org/W2133656396","https://openalex.org/W2134747886","https://openalex.org/W2970346201","https://openalex.org/W2127494376","https://openalex.org/W2012119660","https://openalex.org/W2165129538","https://openalex.org/W1986091886","https://openalex.org/W802691330"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,32,138],"design,":[4],"measured":[5,59],"data,":[6],"and":[7,48,50,103,117],"systematic":[8],"analysis":[9],"of":[10,41,56,77,85,91],"spiral":[11],"embedded":[12,109],"inductors":[13,27,108],"fabricated":[14],"on":[15,68,94,110,137],"standard":[16],"organic":[17,70,111],"substrates":[18,112],"using":[19],"low-cost,":[20],"large-area":[21],"MCM-L":[22],"technology.":[23],"Several":[24],"configurations":[25],"for":[26,60],"were":[28],"investigated":[29],"to":[30],"optimize":[31],"inductor":[33,47,51,64,82,95],"layout":[34],"dimensions":[35],"such":[36,97,122],"as":[37,98,123],"conductor":[38],"width,":[39],"number":[40],"turns,":[42],"inner":[43],"diameter,":[44],"spacing":[45],"between":[46],"ground,":[49],"area.":[52],"A":[53],"maximum":[54],"Q":[55],"100":[57],"was":[58],"a":[61,73],"3.6":[62],"nH":[63],"at":[65],"1.8":[66],"GHz":[67,79],"an":[69,81],"substrate":[71],"with":[72],"self":[74],"resonance":[75],"frequency":[76],"10.6":[78],"within":[80],"core":[83],"area":[84],"0.72":[86],"mm/sup":[87],"2/.":[88],"The":[89],"effects":[90],"configurational":[92],"variables":[93],"characteristics":[96],"quality":[99],"factor,":[100],"self-resonance":[101],"frequency,":[102],"inductance":[104],"are":[105,134],"discussed.":[106],"High-Q":[107],"can":[113],"find":[114],"numerous":[115],"RF":[116],"microwave":[118],"system-on-package":[119],"(SOP)":[120],"applications,":[121],"VCOs,":[124],"IF/RF":[125],"bandpass":[126],"filters,":[127],"LNAs,":[128],"etc.,":[129],"in":[130],"which":[131],"IC":[132],"chips":[133],"flip-chip":[135],"mounted":[136],"package":[139],"substrate.":[140]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-10-06T10:28:23.643775","created_date":"2016-06-24T00:00:00"}