{"id":"https://openalex.org/W2102984992","doi":"https://doi.org/10.1016/s0167-9317(99)00317-2","title":"Room temperature electroless plating copper seed layer process for damascene interlevel metal structures","display_name":"Room temperature electroless plating copper seed layer process for damascene interlevel metal structures","publication_year":2000,"publication_date":"2000-01-01","ids":{"openalex":"https://openalex.org/W2102984992","doi":"https://doi.org/10.1016/s0167-9317(99)00317-2","mag":"2102984992"},"language":"en","primary_location":{"id":"doi:10.1016/s0167-9317(99)00317-2","doi":"https://doi.org/10.1016/s0167-9317(99)00317-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0167-9317(99)00317-2","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069079938","display_name":"Joseph P. O\u2019Kelly","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Joseph P O\u2019Kelly","raw_affiliation_strings":["National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084190954","display_name":"Karen F. Mongey","orcid":"https://orcid.org/0000-0003-4652-2122","observed_orcids":["https://orcid.org/0000-0003-4652-2122"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Karen F Mongey","raw_affiliation_strings":["National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030904581","display_name":"Y. Gobil","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Yveline Gobil","raw_affiliation_strings":["GRESSI-LETI-DMEL-CEA-Grenoble, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GRESSI-LETI-DMEL-CEA-Grenoble, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113400936","display_name":"Joaquin Torres","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Joaquin Torres","raw_affiliation_strings":["GRESSI-LETI-DMEL-CEA-Grenoble, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"GRESSI-LETI-DMEL-CEA-Grenoble, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210150049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039147629","display_name":"P.V. Kelly","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Patrick V Kelly","raw_affiliation_strings":["National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5053964244","display_name":"Gabriel M. Crean","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Gabriel M Crean","raw_affiliation_strings":["National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5084190954"],"corresponding_institution_ids":[],"apc_list":{"value":2860,"currency":"USD","value_usd":2860},"apc_paid":null,"fwci":2.5957,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.90252981,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"50","issue":"1-4","first_page":"473","last_page":"479"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9814000129699707,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9814000129699707,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.016599999740719795,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11907","display_name":"Copper-based nanomaterials and applications","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electroless-copper-plating","display_name":"electroless copper plating","score":0.9020000100135803},{"id":"https://openalex.org/keywords/copper-seed-layer","display_name":"copper seed layer","score":0.9810000061988831},{"id":"https://openalex.org/keywords/room-temperature-deposition","display_name":"room-temperature deposition","score":0.8090000152587891},{"id":"https://openalex.org/keywords/damascene-interconnects","display_name":"damascene interconnects","score":0.8410000205039978},{"id":"https://openalex.org/keywords/tin-barrier-layer","display_name":"TiN barrier layer","score":0.8169999718666077},{"id":"https://openalex.org/keywords/copper-resistivity","display_name":"copper resistivity","score":0.6650000214576721},{"id":"https://openalex.org/keywords/metal-contamination","display_name":"metal contamination","score":0.609000027179718},{"id":"https://openalex.org/keywords/ulsi-fabrication","display_name":"ULSI fabrication","score":0.46399998664855957}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7912696599960327},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.7478001713752747},{"id":"https://openalex.org/C29216876","wikidata":"https://www.wikidata.org/wiki/Q1769505","display_name":"Copper plating","level":4,"score":0.7165340781211853},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6866302490234375},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.6541749238967896},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.6440353393554688},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6393855810165405},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5370283126831055},{"id":"https://openalex.org/C2779833192","wikidata":"https://www.wikidata.org/wiki/Q17015866","display_name":"Barrier layer","level":3,"score":0.47112107276916504},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.455271452665329},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.44543129205703735},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.41986003518104553},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.41597557067871094},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.34092989563941956},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.28017881512641907},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2401818335056305},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.21724069118499756},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0167-9317(99)00317-2","doi":"https://doi.org/10.1016/s0167-9317(99)00317-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0167-9317(99)00317-2","pdf_url":null,"source":{"id":"https://openalex.org/S158028765","display_name":"Microelectronic Engineering","issn_l":"0167-9317","issn":["0167-9317","1873-5568"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronic Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1970444588","https://openalex.org/W1997738448","https://openalex.org/W2010009345","https://openalex.org/W2015489020","https://openalex.org/W2061188349","https://openalex.org/W2070840596","https://openalex.org/W2121771181","https://openalex.org/W2460240195"],"related_works":["https://openalex.org/W2024011629","https://openalex.org/W2087540409","https://openalex.org/W2095206266","https://openalex.org/W2111598766","https://openalex.org/W1983684627","https://openalex.org/W2045766732","https://openalex.org/W2032480161","https://openalex.org/W2391945811","https://openalex.org/W2018101740","https://openalex.org/W2596644238"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}