{"id":"https://openalex.org/W2101230374","doi":"https://doi.org/10.1109/16.239822","title":"A micromachined polyimide aperture for stable bilayer lipid membranes (BLMs)","display_name":"A micromachined polyimide aperture for stable bilayer lipid membranes (BLMs)","publication_year":1993,"publication_date":"1993-01-01","ids":{"openalex":"https://openalex.org/W2101230374","doi":"https://doi.org/10.1109/16.239822","mag":"2101230374"},"language":"en","primary_location":{"id":"doi:10.1109/16.239822","doi":"https://doi.org/10.1109/16.239822","is_oa":false,"landing_page_url":"https://doi.org/10.1109/16.239822","pdf_url":null,"source":{"id":"https://openalex.org/S162355128","display_name":"IEEE Transactions on Electron Devices","issn_l":"0018-9383","issn":["0018-9383","1557-9646"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-3","norway-2","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electron Devices","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022777038","display_name":"Mete Eray","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Eray","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","School of Electrical Engineering and Computer Science, Washington State University#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"School of Electrical Engineering and Computer Science, Washington State University#TAB#","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091117460","display_name":"Numan S. Dogan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"N.S. Dogan","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":null,"display_name":"L. Liu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. Liu","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035851803","display_name":"Alan Koch","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A.R. Koch","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056730261","display_name":"David F. Moffett","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.F. Moffett","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028654932","display_name":"Moris Silber","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Silber","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5081037692","display_name":"Bernard Van Wie","orcid":"https://orcid.org/0000-0001-7382-9715","observed_orcids":["https://orcid.org/0000-0001-7382-9715"]},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B.J. Van Wie","raw_affiliation_strings":["Washington State Univ., Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State Univ., Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I72951846"],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.26252303,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"40","issue":"11","first_page":"2137","last_page":"2138"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.4731000065803528,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.4731000065803528,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10407","display_name":"Lipid Membrane Structure and Behavior","score":0.34450000524520874,"subfield":{"id":"https://openalex.org/subfields/1312","display_name":"Molecular Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.03020000085234642,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lipid-bilayers","display_name":"lipid bilayers","score":0.9629999995231628},{"id":"https://openalex.org/keywords/silicon-micromachining","display_name":"silicon micromachining","score":0.9039999842643738},{"id":"https://openalex.org/keywords/membrane-stability","display_name":"membrane stability","score":0.6650000214576721},{"id":"https://openalex.org/keywords/membrane-thinning","display_name":"membrane thinning","score":0.6520000100135803},{"id":"https://openalex.org/keywords/specific-capacitance","display_name":"specific capacitance","score":0.8659999966621399},{"id":"https://openalex.org/keywords/anisotropic-etching","display_name":"anisotropic etching","score":0.699999988079071},{"id":"https://openalex.org/keywords/photosensitive-polyimide","display_name":"photosensitive polyimide","score":0.7009999752044678}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7673633098602295},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.7074007391929626},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6417822241783142},{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.5979211330413818},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5755560994148254},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.5751688480377197},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5607293248176575},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5519589185714722},{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.545118510723114},{"id":"https://openalex.org/C192157962","wikidata":"https://www.wikidata.org/wiki/Q4087243","display_name":"Bilayer","level":3,"score":0.4816100001335144},{"id":"https://openalex.org/C41075158","wikidata":"https://www.wikidata.org/wiki/Q4996485","display_name":"Bulk micromachining","level":5,"score":0.46421125531196594},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.4358900487422943},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4323793351650238},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3521489202976227},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2823581099510193},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.18309727311134338},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/16.239822","doi":"https://doi.org/10.1109/16.239822","is_oa":false,"landing_page_url":"https://doi.org/10.1109/16.239822","pdf_url":null,"source":{"id":"https://openalex.org/S162355128","display_name":"IEEE Transactions on Electron Devices","issn_l":"0018-9383","issn":["0018-9383","1557-9646"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-3","norway-2","poland-100","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Electron Devices","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2070602514","https://openalex.org/W2080800399"],"related_works":["https://openalex.org/W4245648087","https://openalex.org/W1988990217","https://openalex.org/W2695682696","https://openalex.org/W2602552232","https://openalex.org/W1547047110","https://openalex.org/W2610997143","https://openalex.org/W2798798677","https://openalex.org/W53982944","https://openalex.org/W1995761840","https://openalex.org/W1986224978"],"abstract_inverted_index":{"Silicon":[0],"micromachining":[1],"is":[2,36,108],"used":[3,43],"to":[4,41,131,148],"fabricate":[5],"reproducible":[6],"miniature":[7],"apertures":[8],"over":[9,64,118],"photosensitive":[10],"polyimide":[11],"(PPI)":[12],"layers":[13],"(septa),":[14],"with":[15,97],"highly":[16],"controllable":[17],"dimensions.":[18],"PPI,":[19],"having":[20],"a":[21,28,37,92,112],"high":[22,98],"level":[23],"of":[24,48,115,141,146],"planarization,":[25],"chemical":[26],"inertness,":[27],"low":[29],"dielectric":[30],"constant,":[31],"and":[32,54,83,91],"good":[33],"mechanical":[34],"strength,":[35],"very":[38],"suitable":[39],"material":[40],"be":[42],"as":[44],"BLM":[45,107],"septa.":[46],"Apertures":[47,96],"approximately":[49,55,133],"5":[50],"mu":[51,57,125],"m":[52,58],"thickness":[53],"40":[56],"diameter":[59],"in":[60],"PPI":[61,82,120],"septa":[62],"suspended":[63],"thick":[65,136],"silicon":[66],"rims":[67],"were":[68,101],"realized.":[69],"The":[70,106],"fabrication":[71],"process":[72],"includes":[73],"double-side":[74],"oxide":[75],"growth":[76],"on":[77],"the":[78,81,119],"wafer,":[79],"spin-coating":[80],"its":[84],"patterning,":[85],"back":[86],"surface":[87],"anisotropic":[88],"window":[89],"etching,":[90],"final":[93],"cleaning":[94],"step.":[95],"circular":[99],"symmetry":[100],"fabricated":[102],"using":[103],"this":[104],"process.":[105],"formed":[109],"by":[110],"dropping":[111],"small":[113],"amount":[114],"phospholipid-alkane":[116],"solution":[117],"aperture.":[121],"An":[122],"initially":[123],"few-":[124],"m-thick":[126],"membrane":[127],"spontaneously":[128],"thins":[129],"down":[130],"an":[132],"50":[134,149],"AA":[135],"BLM.":[137],"Specific":[138],"capacitance":[139],"measurements":[140],"these":[142],"BLMs":[143],"revealed":[144],"stability":[145],"up":[147],"h.":[150]},"counts_by_year":[],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2016-06-24T00:00:00"}