{"id":"https://openalex.org/W2097207066","doi":"https://doi.org/10.7736/kspe.2014.31.10.881","title":"Introduction to the Thin Film Thermoelectric Cooler Design Theories","display_name":"Introduction to the Thin Film Thermoelectric Cooler Design Theories","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2097207066","doi":"https://doi.org/10.7736/kspe.2014.31.10.881","mag":"2097207066"},"language":"en","primary_location":{"id":"doi:10.7736/kspe.2014.31.10.881","doi":"https://doi.org/10.7736/kspe.2014.31.10.881","is_oa":true,"landing_page_url":"https://doi.org/10.7736/kspe.2014.31.10.881","pdf_url":null,"source":{"id":"https://openalex.org/S2913889705","display_name":"Journal of the Korean Society for Precision Engineering","issn_l":"1225-9071","issn":["1225-9071","2287-8769"],"is_oa":true,"is_in_doaj":true,"is_core":false,"listed_in":["doaj","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4322697845","host_organization_name":"Korean Society of Precision Engineering","host_organization_lineage":["https://openalex.org/P4322697845"],"host_organization_lineage_names":["Korean Society of Precision Engineering"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of the Korean Society for Precision Engineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://doi.org/10.7736/kspe.2014.31.10.881","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113560852","display_name":"Seong-jae Jeon","orcid":"https://orcid.org/0000-0002-3283-8276","observed_orcids":["https://orcid.org/0000-0002-3283-8276"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Seong-Jae Jeon","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001465501","display_name":"Bongkyun Jang","orcid":"https://orcid.org/0000-0002-8247-7229","observed_orcids":["https://orcid.org/0000-0002-8247-7229"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Bongkyun Jang","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103423812","display_name":"Jun Yeob Song","orcid":"https://orcid.org/0009-0009-9905-7085","observed_orcids":["https://orcid.org/0009-0009-9905-7085"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jun Yeob Song","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004899832","display_name":"Seungmin Hyun","orcid":"https://orcid.org/0000-0002-7286-9026","observed_orcids":["https://orcid.org/0000-0002-7286-9026"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Seungmin Hyun","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5032449911","display_name":"Hoo-Jeong Lee","orcid":"https://orcid.org/0000-0002-7393-1223","observed_orcids":["https://orcid.org/0000-0002-7393-1223"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hoo-Jeong Lee","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"31","issue":"10","first_page":"881","last_page":"887"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelectric-cooler","display_name":"thermoelectric cooler","score":0.878000020980835},{"id":"https://openalex.org/keywords/peltier-effect","display_name":"Peltier effect","score":0.746999979019165},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"contact resistance","score":0.8619999885559082},{"id":"https://openalex.org/keywords/cooling-capacity","display_name":"cooling capacity","score":0.7670000195503235}],"concepts":[{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.8658684492111206},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.7779614925384521},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5887752771377563},{"id":"https://openalex.org/C134786449","wikidata":"https://www.wikidata.org/wiki/Q3391255","display_name":"Planar","level":2,"score":0.5644187927246094},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.5619004368782043},{"id":"https://openalex.org/C117127486","wikidata":"https://www.wikidata.org/wiki/Q11569191","display_name":"Thermoelectric generator","level":3,"score":0.5458968877792358},{"id":"https://openalex.org/C2985596519","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat flow","level":3,"score":0.532882809638977},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5295703411102295},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.5104855298995972},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.5054836273193359},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.42844918370246887},{"id":"https://openalex.org/C33676613","wikidata":"https://www.wikidata.org/wiki/Q13415176","display_name":"Dimension (graph theory)","level":2,"score":0.41707462072372437},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3601692318916321},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.35677945613861084},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3101019859313965},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2625671923160553},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.24541160464286804},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.21278166770935059},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.12296703457832336},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08221879601478577},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07975280284881592},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06822618842124939},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.7736/kspe.2014.31.10.881","doi":"https://doi.org/10.7736/kspe.2014.31.10.881","is_oa":true,"landing_page_url":"https://doi.org/10.7736/kspe.2014.31.10.881","pdf_url":null,"source":{"id":"https://openalex.org/S2913889705","display_name":"Journal of the Korean Society for Precision Engineering","issn_l":"1225-9071","issn":["1225-9071","2287-8769"],"is_oa":true,"is_in_doaj":true,"is_core":false,"listed_in":["doaj","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4322697845","host_organization_name":"Korean Society of Precision Engineering","host_organization_lineage":["https://openalex.org/P4322697845"],"host_organization_lineage_names":["Korean Society of Precision Engineering"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of the Korean Society for Precision Engineering","raw_type":"journal-article"},{"id":"mag:2217503821","doi":null,"is_oa":true,"landing_page_url":"http://www.dbpia.co.kr/Article/NODE02481557","pdf_url":null,"source":{"id":"https://openalex.org/S2913889705","display_name":"Journal of the Korean Society for Precision Engineering","issn_l":"1225-9071","issn":["1225-9071","2287-8769"],"is_oa":true,"is_in_doaj":true,"is_core":false,"listed_in":["doaj","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4322697845","host_organization_name":"Korean Society of Precision Engineering","host_organization_lineage":["https://openalex.org/P4322697845"],"host_organization_lineage_names":["Korean Society of Precision Engineering"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":null,"is_accepted":false,"is_published":false,"raw_source_name":"\ud55c\uad6d\uc815\ubc00\uacf5\ud559\ud68c\uc9c0","raw_type":null}],"best_oa_location":{"id":"doi:10.7736/kspe.2014.31.10.881","doi":"https://doi.org/10.7736/kspe.2014.31.10.881","is_oa":true,"landing_page_url":"https://doi.org/10.7736/kspe.2014.31.10.881","pdf_url":null,"source":{"id":"https://openalex.org/S2913889705","display_name":"Journal of the Korean Society for Precision Engineering","issn_l":"1225-9071","issn":["1225-9071","2287-8769"],"is_oa":true,"is_in_doaj":true,"is_core":false,"listed_in":["doaj","kci-registered","poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4322697845","host_organization_name":"Korean Society of Precision Engineering","host_organization_lineage":["https://openalex.org/P4322697845"],"host_organization_lineage_names":["Korean Society of Precision Engineering"],"type":"journal"},"license":"cc-by-nc","license_id":"https://openalex.org/licenses/cc-by-nc","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of the Korean Society for Precision Engineering","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.5690000057220459,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1844204486","https://openalex.org/W1980053614","https://openalex.org/W2032571260","https://openalex.org/W2041457028","https://openalex.org/W2080783735","https://openalex.org/W2092165187","https://openalex.org/W2148596493","https://openalex.org/W2270553939","https://openalex.org/W2941088258","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2217503821","https://openalex.org/W1970900900","https://openalex.org/W3033768070","https://openalex.org/W2106619075","https://openalex.org/W2108803771","https://openalex.org/W7033083598","https://openalex.org/W2105495010","https://openalex.org/W2268157923","https://openalex.org/W2096762537","https://openalex.org/W3211857074"],"abstract_inverted_index":{"Micro-sized":[0],"Peltier":[1],"coolers":[2,16],"are":[3,17],"generally":[4],"employed":[5],"for":[6,46,68],"uniformly":[7],"distributing":[8],"heat":[9,28],"generated":[10],"in":[11],"the":[12,27,32,38,43,101],"multi-chip":[13],"packages.":[14],"These":[15],"commonly":[18],"classified":[19],"into":[20],"vertical":[21],"and":[22,31,93,103],"planar":[23],"devices,":[24],"depending":[25],"on":[26,37],"flow":[29],"direction":[30],"arrangement":[33],"of":[34,48,50,57,80,107],"thermoelectric":[35,51,70,110],"materials":[36],"used":[39],"substrate.":[40],"Owing":[41],"to":[42],"strong":[44],"need":[45],"evaluation":[47],"performance":[49,79],"modules,":[52],"at":[53],"present":[54],"an":[55],"establishment":[56],"proper":[58],"theoretical":[59],"model":[60,106],"has":[61],"been":[62],"highly":[63],"required.":[64],"The":[65],"design":[66,105],"theory":[67],"micro-sized":[69],"cooler":[71],"should":[72],"be":[73],"considered":[74],"with":[75],"contact":[76,88],"resistance.":[77],"Cooling":[78],"these":[81],"modules":[82],"was":[83],"significantly":[84],"affected":[85],"by":[86],"their":[87],"resistance":[89],"such":[90],"as":[91],"electrical":[92],"thermal":[94],"junction.":[95],"In":[96],"this":[97],"paper,":[98],"we":[99],"introduce":[100],"useful":[102],"optimal":[104],"small":[108],"dimension":[109],"module.":[111]},"counts_by_year":[],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2016-06-24T00:00:00"}