{"id":"https://openalex.org/W2094512124","doi":"https://doi.org/10.1117/12.819717","title":"Optical method for testing of the packaging reliability of IC chips","display_name":"Optical method for testing of the packaging reliability of IC chips","publication_year":2008,"publication_date":"2008-12-08","ids":{"openalex":"https://openalex.org/W2094512124","doi":"https://doi.org/10.1117/12.819717","mag":"2094512124"},"language":"en","primary_location":{"id":"doi:10.1117/12.819717","doi":"https://doi.org/10.1117/12.819717","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.819717","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100952476","display_name":"Xianming Xiong","orcid":"https://orcid.org/0000-0002-7933-3136","observed_orcids":["https://orcid.org/0000-0002-7933-3136"]},"institutions":[{"id":"https://openalex.org/I5343935","display_name":"Guilin University of Electronic Technology","ror":"https://ror.org/05arjae42","country_code":"CN","type":"education","lineage":["https://openalex.org/I5343935"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xianming Xiong","raw_affiliation_strings":["Guilin Univ. Of Electronic Technology (China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Guilin Univ. Of Electronic Technology (China)","institution_ids":["https://openalex.org/I5343935"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108606365","display_name":"Li Huang","orcid":"https://orcid.org/0009-0004-9141-6438","observed_orcids":["https://orcid.org/0009-0004-9141-6438"]},"institutions":[{"id":"https://openalex.org/I5343935","display_name":"Guilin University of Electronic Technology","ror":"https://ror.org/05arjae42","country_code":"CN","type":"education","lineage":["https://openalex.org/I5343935"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Huang","raw_affiliation_strings":["Guilin Univ. Of Electronic Technology (China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Guilin Univ. Of Electronic Technology (China)","institution_ids":["https://openalex.org/I5343935"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085059628","display_name":"Yanxiong Lin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I5343935","display_name":"Guilin University of Electronic Technology","ror":"https://ror.org/05arjae42","country_code":"CN","type":"education","lineage":["https://openalex.org/I5343935"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yanxiong Lin","raw_affiliation_strings":["Guilin Univ. Of Electronic Technology (China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Guilin Univ. Of Electronic Technology (China)","institution_ids":["https://openalex.org/I5343935"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I5343935"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"7130","issue":null,"first_page":"71304D","last_page":"71304D"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5292999744415283,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5292999744415283,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.18690000474452972,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.14749999344348907,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-speckle-pattern-interferometry","display_name":"electronic speckle pattern interferometry","score":0.9470000267028809},{"id":"https://openalex.org/keywords/thermal-deformation","display_name":"thermal deformation","score":0.9049999713897705},{"id":"https://openalex.org/keywords/heat-stress","display_name":"heat stress","score":0.5989999771118164},{"id":"https://openalex.org/keywords/surface-temperature-measurement","display_name":"surface temperature measurement","score":0.8240000009536743}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.804086446762085},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6646548509597778},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5371741652488708},{"id":"https://openalex.org/C107551265","wikidata":"https://www.wikidata.org/wiki/Q1458245","display_name":"Displacement (psychology)","level":2,"score":0.526735782623291},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.49246343970298767},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.4795081913471222},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.46519386768341064},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42732203006744385},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4247887432575226},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.42108145356178284},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.40001970529556274},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.36748170852661133},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20883730053901672},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1428622603416443},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.14018315076828003},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C542102704","wikidata":"https://www.wikidata.org/wiki/Q183257","display_name":"Psychotherapist","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.819717","doi":"https://doi.org/10.1117/12.819717","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.819717","pdf_url":null,"source":{"id":"https://openalex.org/S183492911","display_name":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","issn_l":"0277-786X","issn":["0277-786X","1996-756X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SPIE Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2122732470","https://openalex.org/W2364298057","https://openalex.org/W2084906327","https://openalex.org/W1252445604","https://openalex.org/W2393576437","https://openalex.org/W2347356149","https://openalex.org/W4317382453","https://openalex.org/W1999095913","https://openalex.org/W2380711420","https://openalex.org/W2985330379"],"abstract_inverted_index":{"This":[0,173],"paper":[1],"describes":[2],"a":[3,19,204],"very":[4],"simple":[5],"and":[6,39,66,100,111,124,199,201],"reliable":[7],"procedure":[8,25],"for":[9,187,208],"testing":[10],"packaging":[11,54,69,169],"reliability":[12,55,62,70,170,198,209],"of":[13,53,76,88,93,136,146,157,171,180,211],"integrated":[14],"circuits":[15],"(IC)":[16],"chips":[17,77],"with":[18,42,90,139,153,176],"single":[20],"optical":[21],"experimental":[22,131],"set-up.":[23],"The":[24,49,160],"is":[26,33,56,63,71,106,141,156,194,202],"based":[27],"on":[28],"the":[29,83,85,113,130,133,144,151,177],"principle":[30],"that":[31,118,150,163],"it":[32],"possible":[34],"to":[35],"test":[36,168],"minuteness":[37],"displacement":[38,122,138],"thermal":[40,181],"deformation":[41,123,182],"electronic":[43],"speckle":[44,86],"pattern":[45,109],"interferometer":[46],"(ESPI)":[47],"techniques.":[48],"chips'":[50],"direct":[51],"performance":[52],"their":[57,68,102,120],"heat":[58,61,96,114,189],"reliability.":[59,159],"Therefore,":[60],"firstly":[64],"tested":[65],"then":[67],"speculated.":[72],"Two":[73],"similar":[74],"kinds":[75],"are":[78,97,126],"chosen":[79],"as":[80],"specimens.":[81],"In":[82],"experiment,":[84],"pictures":[87],"specimens":[89],"five":[91],"groups":[92],"equivalent":[94],"input":[95],"obtained":[98],"respectively,":[99],"meanwhile":[101],"corresponding":[103],"surface":[104],"temperature":[105,116,125,140],"measured.":[107],"Disposing":[108],"stripes":[110],"calculating":[112],"source":[115],"show":[117],"both":[119],"off-surface":[121,137],"obviously":[127],"different.":[128],"From":[129],"data,":[132],"simulation":[134],"curve":[135,148],"plotted.":[142],"Analyzing":[143],"changes":[145],"fitting":[147],"testify":[149],"chip":[152],"lower":[154],"rate":[155],"high":[158],"results":[161],"justify":[162],"using":[164],"ESPI":[165],"could":[166],"simply":[167],"chips.":[172],"fact":[174],"along":[175],"exact":[178],"knowledge":[179],"may":[183],"be":[184],"more":[185],"useful":[186],"understanding":[188],"stress.":[190],"Moreover,":[191],"this":[192],"approach":[193],"characterized":[195],"by":[196],"fastness,":[197],"real-time,":[200],"therefore":[203],"quite":[205],"effective":[206],"tool":[207],"analysis":[210],"microelectronic":[212],"devices.":[213]},"counts_by_year":[],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2016-06-24T00:00:00"}