{"id":"https://openalex.org/W2092963697","doi":"https://doi.org/10.1143/jjap.44.5736","title":"Study of IC Compatible On-Chip Thermoelectric Coolers","display_name":"Study of IC Compatible On-Chip Thermoelectric Coolers","publication_year":2005,"publication_date":"2005-07-01","ids":{"openalex":"https://openalex.org/W2092963697","doi":"https://doi.org/10.1143/jjap.44.5736","mag":"2092963697"},"language":"en","primary_location":{"id":"doi:10.1143/jjap.44.5736","doi":"https://doi.org/10.1143/jjap.44.5736","is_oa":true,"landing_page_url":"https://doi.org/10.1143/jjap.44.5736","pdf_url":"https://iopscience.iop.org/article/10.1143/JJAP.44.5736/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://iopscience.iop.org/article/10.1143/JJAP.44.5736/pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068288800","display_name":"Seong-Ho Kong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Ho Kong","raw_affiliation_strings":["School of Electrical Engineering & Computer Science, Kyungpook National University, Sangyuk-dong 1370, buk-gu, Daegu 702-701, South-Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering & Computer Science, Kyungpook National University, Sangyuk-dong 1370, buk-gu, Daegu 702-701, South-Korea","institution_ids":["https://openalex.org/I31419693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086399399","display_name":"D.D.L. Wijngaards","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Davey D. L. Wijngaards","raw_affiliation_strings":["Electronic Instrumentation Laboratory, ITS/Et, Delft University of Technology, Mekelweg 4, NL-2628 CD Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronic Instrumentation Laboratory, ITS/Et, Delft University of Technology, Mekelweg 4, NL-2628 CD Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072116455","display_name":"Reinoud F. Wolffenbuttel","orcid":"https://orcid.org/0000-0003-2074-4958","observed_orcids":["https://orcid.org/0000-0003-2074-4958"]},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Reinoud F. Wolffenbuttel","raw_affiliation_strings":["Electronic Instrumentation Laboratory, ITS/Et, Delft University of Technology, Mekelweg 4, NL-2628 CD Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronic Instrumentation Laboratory, ITS/Et, Delft University of Technology, Mekelweg 4, NL-2628 CD Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2210,"currency":"USD","value_usd":2210},"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":9,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"44","issue":"7S","first_page":"5736","last_page":"5736"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.00139999995008111,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microcoolers","display_name":"microcoolers","score":0.7440000176429749},{"id":"https://openalex.org/keywords/thin-film-thermoelectric-materials","display_name":"thin-film thermoelectric materials","score":0.8640000224113464},{"id":"https://openalex.org/keywords/ic-compatible-fabrication","display_name":"IC-compatible fabrication","score":0.6970000267028809},{"id":"https://openalex.org/keywords/bulk-micromachining","display_name":"bulk micromachining","score":0.9779999852180481},{"id":"https://openalex.org/keywords/koh-etching","display_name":"KOH etching","score":0.8270000219345093},{"id":"https://openalex.org/keywords/joule-heating","display_name":"Joule heating","score":0.8560000061988831},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"contact resistance","score":0.8949999809265137},{"id":"https://openalex.org/keywords/parasitic-heat-losses","display_name":"parasitic heat losses","score":0.9589999914169312},{"id":"https://openalex.org/keywords/bismuth-telluride","display_name":"Bi2Te3","score":0.8389999866485596},{"id":"https://openalex.org/keywords/thermal-stabilization","display_name":"thermal stabilization","score":0.6019999980926514}],"concepts":[{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.7999786138534546},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7809693813323975},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7640696167945862},{"id":"https://openalex.org/C2777038907","wikidata":"https://www.wikidata.org/wiki/Q415256","display_name":"Bismuth telluride","level":4,"score":0.6735970973968506},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.5600982904434204},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5525147318840027},{"id":"https://openalex.org/C117127486","wikidata":"https://www.wikidata.org/wiki/Q11569191","display_name":"Thermoelectric generator","level":3,"score":0.5340446829795837},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.5191773176193237},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.3004296123981476},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20260092616081238},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1143/jjap.44.5736","doi":"https://doi.org/10.1143/jjap.44.5736","is_oa":true,"landing_page_url":"https://doi.org/10.1143/jjap.44.5736","pdf_url":"https://iopscience.iop.org/article/10.1143/JJAP.44.5736/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1143/jjap.44.5736","doi":"https://doi.org/10.1143/jjap.44.5736","is_oa":true,"landing_page_url":"https://doi.org/10.1143/jjap.44.5736","pdf_url":"https://iopscience.iop.org/article/10.1143/JJAP.44.5736/pdf","source":{"id":"https://openalex.org/S143744711","display_name":"Japanese Journal of Applied Physics","issn_l":"0021-4922","issn":["0021-4922","1347-4065"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2","vabb-shw"],"host_organization":"https://openalex.org/P4310311669","host_organization_name":"Institute of Physics","host_organization_lineage":["https://openalex.org/P4310311669"],"host_organization_lineage_names":["Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Japanese Journal of Applied Physics","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.75,"display_name":"Affordable and clean energy"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321272","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2092963697.pdf","grobid_xml":"https://content.openalex.org/works/W2092963697.grobid-xml"},"referenced_works_count":7,"referenced_works":["https://openalex.org/W389868541","https://openalex.org/W1966564068","https://openalex.org/W1976705459","https://openalex.org/W1991540986","https://openalex.org/W1996187981","https://openalex.org/W2100043979","https://openalex.org/W2141427375"],"related_works":["https://openalex.org/W2538021486","https://openalex.org/W2997498595","https://openalex.org/W1922791113","https://openalex.org/W2119586833","https://openalex.org/W4412712550","https://openalex.org/W4300488086","https://openalex.org/W2072017538","https://openalex.org/W4414480129","https://openalex.org/W4292158301","https://openalex.org/W2032309457"],"abstract_inverted_index":{"A":[0],"thin-film-based":[1],"thermoelectric":[2,57,74,111],"micro-cooler":[3,126],"has":[4],"been":[5],"studied":[6],"and":[7,17,91,104],"realized":[8],"using":[9],"the":[10,39,43,47,71,108],"standard":[11],"integrated":[12],"circuit":[13],"(IC)":[14],"fabrication":[15,25,44,48],"technology":[16,20],"bulk":[18],"micromachining":[19],"in":[21],"sequence.":[22,45],"The":[23,76,100],"whole":[24],"process":[26],"is":[27,54,68,98],"kept":[28],"IC":[29],"compatible":[30],"by":[31],"postponing":[32],"potassium":[33],"hydroxide":[34],"(KOH)":[35],"etching":[36],"step":[37],"to":[38,88,115],"last":[40],"part":[41],"of":[42,70,78,107],"Considering":[46],"compatibility,":[49],"polycrystalline":[50],"silicon":[51],"germanium":[52],"(polySiGe)":[53],"chosen":[55],"as":[56,84],"material":[58,112],"even":[59],"though":[60],"bismuth":[61],"telluride":[62],"(Bi":[63],"2":[64],"Te":[65],"3":[66],")":[67],"one":[69],"most":[72],"effective":[73],"materials.":[75],"influence":[77],"non-idealities":[79],"on":[80],"device":[81],"performance,":[82],"such":[83],"Joule":[85],"heating":[86],"due":[87],"contact":[89],"resistance":[90],"parasitic":[92],"heat":[93],"loss":[94],"through":[95],"supporting":[96],"membrane,":[97],"analyzed.":[99],"characterized":[101],"thermoelectric,":[102],"thermal":[103,131],"electric":[105],"properties":[106],"fabricated":[109],"polySiGe":[110],"correspond":[113],"well":[114],"those":[116],"from":[117],"literatures.":[118],"Measured":[119],"cooling":[120],"performance":[121],"demonstrates":[122],"that":[123],"an":[124],"on-chip":[125],"can":[127],"be":[128],"applied":[129],"for":[130],"stabilization":[132],"near":[133],"ambient":[134],"temperature.":[135]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-09-22T06:50:58.402377","created_date":"2016-06-24T00:00:00"}