{"id":"https://openalex.org/W2089971990","doi":"https://doi.org/10.1016/s0026-2714(01)00003-8","title":"Board level reliability of PBGA using flex substrate","display_name":"Board level reliability of PBGA using flex substrate","publication_year":2001,"publication_date":"2001-05-01","ids":{"openalex":"https://openalex.org/W2089971990","doi":"https://doi.org/10.1016/s0026-2714(01)00003-8","mag":"2089971990"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00003-8","doi":"https://doi.org/10.1016/s0026-2714(01)00003-8","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00003-8","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"S.C Hung","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"S.C Hung","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053925852","display_name":"P.J. Zheng","orcid":"https://orcid.org/0009-0000-5790-4316","observed_orcids":["https://orcid.org/0009-0000-5790-4316"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"P.J Zheng","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110939614","display_name":"Seong Ho","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S.H Ho","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084235747","display_name":"SunGoo Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S.C Lee","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035748921","display_name":"H.N Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"H.N Chen","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110229601","display_name":"J.D. Wu","orcid":"https://orcid.org/0009-0004-6935-8147","observed_orcids":["https://orcid.org/0009-0004-6935-8147"]},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"J.D Wu","raw_affiliation_strings":["Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering Inc., 26, Chin 3rd Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I2799432993"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":1.602,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.83643684,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"41","issue":"5","first_page":"677","last_page":"687"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/board-level-reliability","display_name":"board level reliability","score":0.871999979019165},{"id":"https://openalex.org/keywords/plastic-ball-grid-array","display_name":"plastic ball grid array","score":0.6729999780654907},{"id":"https://openalex.org/keywords/solder-joint-fatigue-life","display_name":"solder joint fatigue life","score":0.8230000138282776},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.6880000233650208},{"id":"https://openalex.org/keywords/underfill","display_name":"underfill","score":0.746999979019165},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.9359999895095825},{"id":"https://openalex.org/keywords/weibull-analysis","display_name":"Weibull analysis","score":0.6570000052452087},{"id":"https://openalex.org/keywords/failure-modes","display_name":"failure modes","score":0.8420000076293945},{"id":"https://openalex.org/keywords/chip-size","display_name":"chip size","score":0.6230000257492065}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.7843935489654541},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7742083072662354},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7154738903045654},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6530819535255432},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.6479957103729248},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.5497668981552124},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5213505029678345},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.5182973742485046},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5151466131210327},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.462069571018219},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4499243497848511},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4266500473022461},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.17326620221138},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.16236281394958496},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14740192890167236},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.10738670825958252},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00003-8","doi":"https://doi.org/10.1016/s0026-2714(01)00003-8","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00003-8","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W571002254","https://openalex.org/W827086763","https://openalex.org/W1633693358","https://openalex.org/W1822430537","https://openalex.org/W1898742279","https://openalex.org/W1914062284","https://openalex.org/W1976562336","https://openalex.org/W2024155555","https://openalex.org/W2088929950","https://openalex.org/W2111398882","https://openalex.org/W2125213781","https://openalex.org/W2495573729","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W1837700555","https://openalex.org/W4416876651","https://openalex.org/W2026691684","https://openalex.org/W1570261552","https://openalex.org/W1994986915","https://openalex.org/W2012019750","https://openalex.org/W2117555107","https://openalex.org/W2076673959","https://openalex.org/W4247946356","https://openalex.org/W2361400255"],"abstract_inverted_index":null,"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2016-06-24T00:00:00"}